Hitachi, Ltd.

Hitachi Media Electronics Co., Ltd.

Hitachi-Lg Data Storage, Inc.

Hitachi Plant Technologies, Ltd.

Hiroyuki Toyoda

Tadakatsu Nakajima

Yoshihiro Kondo

Akio Idei

Shigeyasu Tsubaki

Tomoo Hayashi

Hitoshi Matsushima

Yoshiaki Yamauchi

Manabu Ochi

Makoto Ibe

Takayuki Fujimoto

Junichi Senga

Takeshi Kato

Tatsuya Saito

Shigeo Ohashi

Kenji Ogiro

Seiichi Katou

Shinya Tsubota

Takayuki Atarashi

Hirofumi Taguchi

Shigeyuki Sasaki

Kazuhiro Oda

Yasuhiro Kashirajima

Takumi Sugiura

Hideyuki Onuma

Keiji Sasao

Shigemasa Satoh

Takehiro Hayama

Akinori Kawasaki

Mitsukata Shizuya

Hiroshi Maita

Daisuke Akimaru

Tomoaki Taguchi

Fumio Fujii

Shoichi Taguchi

An object of the present invention is to provide an air conditioner for a rail vehicle that is excellent in cleanliness and comfort by cleaning the air conditioner at an appropriate timing without causing discomfort to passengers. An air conditioner for a rail vehicle including a vehicle control system includes: a refrigeration cycle devicethat can execute a cleaning operation; and an air conditioning control devicethat controls the refrigeration cycle device, and the air conditioning control devicecan communicate with the vehicle control systemand causes the refrigeration cycle deviceto execute a cleaning operation on the basis of status information obtained from the vehicle control system

Air conditioner for rail vehicle

A cooling system for cooling a CPUmounted on a printed circuit boardwithin a housing thereof, has a heat-receiving jacket, being thermally connected with a surface of the CPU generating heat therein, and for evaporating liquid refrigerant stored in a pressure-reduced inner space with heat generation thereof. A condenserreceives refrigerant vapor from the heat-receiving jacket for condensing the refrigerant vapor into a liquid by transferring the heat into an outside of the apparatus. A thermo siphon is used for circulating the refrigerant due to phase change thereof, and the condenser has fine grooves on an inner wall surface thereof along a direction of flow of the refrigerant, and is also formed flat in a cross-section thereof, for cooling the refrigerant vapor from the heat-receiving jacket on the inner wall surface thereof, efficiently.

Cooling system and electronic apparatus applying the same therein

An optical pickup, having an optical pickup housing made of resin, for maintaining the heat radiation performance or capacity of a semiconductor laser, also an objective lens driving mechanism, and further a driver IC for the semiconductor laser, while keeping small-size and light-weight thereof, comprises a pickup housing, in which an optical part and a semiconductor laser are fixed; an objective lens, which is attached within the pickup housing; and an objective lens driving mechanism, which is configured to drive the objective lens, further comprising: a metal-made bottom cover, which is configured to cover a lower surface of the pickup housing and a side surface of an inner periphery of an optical disc, wherein the metal-made bottom cover and the semiconductor laser are thermally connected with each other.

Optical pickup

An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.

Electronic apparatus

A server system with a cooling ability that can cope with an increase in the amount of heat generated by a CPU of a server module detachably mounted on a blade server. The server module includes an enclosure accommodating therein a motherboard on which a CPU, memory, and the like are mounted, and part of a boil cooling device for cooling heat generated by the CPU. A fan accommodated in a fan module is adapted to blow air into the server module through an opening of the server module enclosure. The boil cooling device includes a first heat transmission member disposed in the server module enclosure, a second heat transmission member disposed outside the server module enclosure, and a plurality of pipes connecting them. The first heat transmission member is a box body with an internal space for hermetically sealing a refrigerant therein, one external planar face of which is thermally connected to the CPU and the other external planar face of which is provided with a heat sink. The second heat transmission member is disposed in the fan module unit, and a heat radiation member provided for the pipes forms an airflow passage together with the motherboard.

Blade server

A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between fins, a vapor condensing pipe is used, in which grooves are formed in a direction substantially parallel direction with a pipe axis direction on the above described pipe inner surface, a section of a row of the above described fins is exposed on a side surface of the above described groove, the above described groove is disposed at a lower side in the vertical direction from the center line in the pipe axis direction of the vapor condensing pipe when the above described groove is installed in the above described vapor condensing pipe, and a wick with a wire space smaller than the fin space of the above described fin row is filled inside the above described groove.

Cooling device and electronic equipment including cooling device

An optical pickup devicecomprising a laser diode, a photo detector, a housinghaving an optical system for guiding light from the laser diodeto an optical disk and guiding light reflected on the optical disk to the photo detector, a wiringto supply current to the laser diode, and a metallic coverprovided outside of the housing, wherein

Optical pickup device with heat radiating structure

An electronic device comprises: a housing; blades each of which is detachable from the housing and on each of which at least CPU and a memory are mounted; first cooling devices each of that takes out heat generated in the blade outside the blade, each of said first cooling device having a heat release part in the form of an elongate column to be fixed to the blade; second cooling devices fixed to the housing to discharge heat transported from the first cooling devices outside the housing, each of said second cooling devices having a heat absorbing part, which is capable of containing the heat release part of the first cooling device; medium reservoirs each of which is put in fluid communication with a clearance, which is formed between the heat release part and the heat absorbing part when the heat release part is inserted into the heat absorbing part; a heat conducting medium stored in each of the medium reservoirs; pressurizing devices for pressurizing the heat conducting medium to supply the heat conducting medium to the clearance, and a detachable connecting part formed between the heat release part and the heat absorbing part.

Electronic device and a thermal connector used therein

It is an object to provide a cooling device for optimally cooling a semiconductor device on a CPU blade which is detachable with respect to an electronic apparatus using the cooling device with compact structure for reducing power consumption. A cooling device for cooling a semiconductor device disposed on an electronic circuit substrate in a casing of an electronic apparatus, comprising a first cooling unit comprising a first heat absorbing portion and a first heat releasing portion, and a second cooling unit comprising a second heat absorbing portion and a second heat releasing portion, wherein the first heat absorbing portion is disposed in contact with the semiconductor device, the second heat absorbing portion is detachably disposed in contact with the first heat releasing portion, a phase-change refrigerant is contained in the first cooling unit, and the second heat releasing portion is disposed outside the casing.

Cooling device and electronic apparatus using the same

In an optical disk apparatus for recording and/or reading information with respect to an optical disk, comprising, a chassis for containing the optical disk, and a tray being movable with respect to the chassis and adapted to support the optical disk thereon so that the optical disk is movable with respect to the chassis, the chassis has an opening for discharging an air from an inside of the chassis to an outside of the chassis through the opening.

Optical disk apparatus with openings for discharging air from therein

An optical pickup device comprises a semiconductor laser that causes outgoing of laser beam used for reproduction and recording of information on an optical disk, and an objective lens that conducts the laser beam outgoing from the semiconductor laser to the optical disk. The objective lens is driven by a yoke, a focusing coil, a tracking coil, etc. These elements are accommodated in a pickup housing. First and second bearing portions supporting the pickup housing to make the same movable are attached to the pickup housing and arranged on both sides with the objective lens therebetween. The yoke is thermally connected to the first bearing portion positioned on an opposite side of the yoke to the semiconductor laser.

Optical pickup device having heat radiation means and optical disk apparatus using the same

In a recording disk apparatus, a pickup element and an electric element for at lease one of supplying an electric power to at least one of a recording disk driving motor and the pickup and processing a signal to be recorded into the recording disk and/or the signal read from the recording disk are prevented from overlapping each other as seen in a thickness direction of the recording disk to restrain a thermal conduction between the pickup element and the electric element so that a thermal conduction restraining area extending along an imaginary directional line crossing an imaginary straight line passing the pickup element and the electric element as seen in the thickness direction is formed between the pickup element and the electric element as seen in the thickness direction.

Recording disk apparatus having regions of constrained thermal conduction

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Hitachinaka, Japan

Hiroyuki Toyoda