Photopoly Ohka Co., Ltd.

Tokyo Ohka Kogyo Co., Ltd.

Dai Nippon Insatsu Kabushiki Kaisha

Tokyo Ohka Kogyo Kabushiki Kaisha

Hiroyuki Tohda

Hisashi Nakane

Toshimi Aoyama

Junichi Onodera

Kazuo Kato

Shinichi Hikosaka

Eiichi Tachibana

Shozo Toda

Shigeru Ohtawa

Shigeru Otawa

Bonpei Kato

Tsuyoshi Miyashita

A remover solution for photoresist comprising (a) a solvent which is typically water, (b) an inorganic or organic alkaline compound such as sodium and potassium hydroxides, and (c) a borohydride compound such as sodium and lithium borohydrides and organic amine borane compounds. When used for removing patterned photoresist layer in the manufacturing process of, for example, electronic circuit board substrates. The method gives quite satisfactory results without discoloration or denaturation of the copper surface and solder surface, consequently leading to the production of high-quality products.

Remover solution for photoresist

The composition of this invention comprises:

Photopolymerizable composition including benzotriazole carboxylic acid

The invention provides an improved method for the so-called dry-film process for forming a pattern-wise photoresist layer on the substrate surface in which a substrate is overlaid and laminated with a preformed film of a photosensitive composition called a dry film and photolithographically processed. In the inventive method, different from conventional dry-film processes, the substrate plate is first provided with a protecting layer of a photosensitive composition containing a halation inhibitor and the lamination with a dry film is performed without removing the protecting layer. After pattern-wise exposure to light, development of the photosensitive layer is undertaken by use of a developer solvent capable of dissolving both of the protecting layer and the pattern-forming layer. Despite the intervention of the protecting layer, the resolving power and image reproducibility are excellent.

Method for providing a pattern-wise photoresist layer on a substrate

A process for producing novel resinous gravure printing plates comprises coating on a printing substrate such as a cylinder a radiation-curable resin coating composition containing in a specific ratio a soluble polyamide resin and a radiation-polymerizable monomer or the like dissolved in a solvent, curing the coated film by irradiation with actinic rays, and engraving the resulting cured film. As a result, a novel resinous gravure printing plate having excellent engraving property, printing durability, and solvent resistance is produced.

Process for producing gravure printing plates

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Fujisawa, Japan

Hiroyuki Tohda