Agency of Industrial Science and Technology

Tokyo Shibaura Denki Kabushiki Kaisha

Tokyo Shibaura Electric Co., Ltd.

Hiroyuki Tango

Tomoyasu Inoue

Iwao Higashinakagawa

Kyoichi Suguro

Toshihiko Hamasaki

Kenji Maeguchi

Minoru Kimura

Tadahiro Takigawa

Yukio Ohmori

In an apparatus for forming a single crystal semiconductor layer from a non-single-crystalline semiconductor material by scanning a region of the material with an electron beam, a first pair of deflection electrodes and a second pair of deflection electrodes, both pairs being provided in the path of the electron beam. A deflection signal generated by modifying the amplitude of a high-frequency fundamental wave signal with a modulation wave signal having a frequency lower than that of the high-frequency fundamental wave signal is supplied to the deflection electrodes of the first pair. The electrodes rapidly deflect the electron beam in a first direction, while changing the range of deflecting the beam, thereby forming a locus of the beam spot on the sample. Simultaneously, the deflection electrodes of the second pair deflect the beam in a second direction, thereby annealing a region of the material, to form a single crystal semiconductor layer.

Method of forming a single crystal semiconductor layer from a

Method of forming a single crystal semiconductor layer from a non-single

A semiconductor device having silicon-on-sapphire structure in which a pn junction element is formed in a silicon substrate disposed on a sapphire plate. An oxide layer is formed in the surface area of the p-type region which serves to form the pn junction elements.

SOS p--n Junction device with a thick oxide wiring insulation layer

A MOS integrated circuit comprises a MOS IC body including at least one MOS transistor made of an island-like semiconductor layer formed on an insulating substrate, and a protective circuit connected between a signal input terminal and the gate electrode of a MOS transistor at least at an input stage of the MOS IC body and adapted to protect the MOS integrated circuit against an irregular input signal. The protective circuit is also connected between ground and the gate electrode of the MOS transistor at the input stage of the MOS IC body and comprises a protective MOS transistor made of an island-like semiconductor layer formed on the insulating substrate in a manner to be arranged in juxtaposition with the MOS transistor at the input stage of the MOS IC body, a resistor connected between the signal input terminal and the gate circuit of the MOS transistor as the input stage of the MOS IC body the resistor being formed on a grounded insulating layer on the semiconductor layer overlying the insulating substrate to provide a stray capacitance therebetween, the resistor being formed in juxtapositon with the protective MOS transistor.

Protective circuit on insulating substrate for protecting MOS integrated

An insulated-gate field-effect transistor having improved high-speed operation characteristics and high channel controllability includes a source region having first and second diffused regions and a drain region having first and second diffused regions. The first diffused regions of both the source and drain regions are formed by diffusion of a first impurity having relatively low diffusion coefficient and the second diffused regions of both the source and drain regions are formed by diffusion of a second impurity having relatively high diffusion coefficient.

Insulated-gate field-effect transistor

A method for the manufacture of semiconductor devices comprises the steps of forming a number of mutually electrically isolated semiconductor islands on an insulating substrate and cutting a semiconductor wafer, made of semiconductor elements and substrate, along its dicing line to provide a number of semiconductor chips, the method characterized in that additional semiconductor islands are formed on the insulating substrate simultaneously with, or after, the formation of the first-mentioned semi-conductor islands so that each substantially surrounds the chip. The method permits very easy mask alignments for photoengraving as well as a clear judgment as to whether or not the formation of contact openings has been completed.

Growing community of inventors

Yokohama, Japan

Hiroyuki Tango