Applied Materials, Inc.

Hiroyuki Takahama

Vijay D Parkhe

Mingwei Zhu

Cheng-Hsiung Matt Tsai

Jallepally Ravi

Daniel Lee Diehl

David T Or

Hiroshi Sato

Sumit Subhash Patankar

Keith K Koai

Aravind Kamath

Tomoharu Matsushita

Randy D Schmieding

Fred Eric Ruhland

Koji Ota

Takeshi Jinbo

Takahiro Ito

Avi Tepman

Ananthkrishna Jupudi

Manjunatha P Koppa

Cheng-Hsiung Matthew Tsai

Sarath Babu

Akihiko Saito

Methods and apparatus for substrate position calibration for substrate supports in substrate processing systems are provided herein. In some embodiments, a method for positioning a substrate on a substrate support includes: obtaining a plurality of backside pressure values corresponding to a plurality of different substrate positions on a substrate support by repeatedly placing a substrate in a position on the substrate support, and vacuum chucking the substrate to the substrate support and measuring a backside pressure; and analyzing the plurality of backside pressure values to determine a calibrated substrate position.

Substrate position calibration for substrate supports in substrate processing systems

Embodiments of a substrate carrier are provided herein. In some embodiments, a substrate carrier includes a base plate, wherein the base plate is a thin, solid plate with no through holes or embedded components; and a plurality of raised portions extending from the base plate, wherein the plurality of raised portions include first raised portions and second raised portions, the first raised portions disposed radially inward from the second raised portions, wherein the base plate and the plurality of raised portions define pockets configured to retain a plurality of substrates, and wherein an upper surface of the second raised portions have a greater surface area than an upper surface of the first raised portions.

Substrate carrier

Substrate processing chambers with integrated shutter garage are provided herein. In some embodiments, a pre-clean substrate processing chamber may include a chamber body, wherein the chamber body includes a first side configured to be attached to mainframe substrate processing tool, and a second side disposed opposite the first side, a substrate support configured to support a substrate when disposed thereon, a shutter disk garage disposed on the second side of the process chamber, and a shutter disk assembly mechanism comprising a rotatable shaft, and a robot shutter arm coupled to the shaft, wherein the robot shutter arm includes a shutter disk assembly support section configured to support a shutter disk assembly, and wherein the shutter disk assembly mechanism is configured to move the robot shutter arm between a storage position within the shutter garage and a processing position within the process chamber over the substrate support.

Pre-clean chamber with integrated shutter garage

Substrate support lift pin

A substrate support is provided that features a lift pin having at least one larger diameter shoulder section that forms a relief region between the lift pin and a guide hole disposed through a substrate support. The shoulder section minimizes contact between the substrate support and lift pin guide hole, thereby reducing pin scratching, particle generation, component wear, and increasing the useful life of the pin. In another embodiment, a flat-bottom tip is provided to promote self-standing of the lift pin, reducing pin tilting or leaning of the lift pin within the guide hole.

Reduced friction lift pin

The present invention provides a shield arrangement that prevents deposition in the area of the chamber surrounding the substrate. This shield arrangement is equipped with a wall-like member which surrounds a substrate, and includes a projecting annular flange and a substrate support which extends in the horizontal direction beyond the substrate, and includes a groove therein. The annular flange is received in the groove to shield the deposition region of the chamber from the remainder of the chamber.

Apparatus for full wafer deposition

A cooling structure for a vacuum device includes an external frame portion positioned between vacuum chamber flange and cryopump flange; a cooling panel formed in a partition surrounded by said external frame, the cooling panel having an opening that allows a fluid flow between said vacuum chamber and said cryopump; a cooling means positioned in contact with an exposed peripheral cooling panel surface for cooling said cooling panel; and a coolant feeding means for supplying coolant to the cooling means.

Method and apparatus for cooling a vacuum device

Growing community of inventors

Chiba-ken, Japan

Hiroyuki Takahama