Rohm Co., Ltd.

Hiroyuki Tajiri

Yasuhiro Yoshikawa

Hideki Sawada

Tomoharu Horio

Hiromi Ogata

Yuki Tanuma

Takumi Yamade

Yuya Hasegawa

Yasuyuki Aritaki

Kenji Sakai

Tadatoshi Miwa

Yasuhiro Nagao

Kazuyoshi Izumi

Hiroki Kawai

A semiconductor laser device Acomprises a semiconductor laser chipand a stem. The stemincludes a baseand leadsA,B, andC fixed to the base, and supports the semiconductor laser chip. The semiconductor laser device Afurther comprises a first metal layerincluding a first layercovering the baseand the leadsA,B, andC, a second layerinterposed between the first layerand each of the baseand the leadsA,B, andC, and a third layerinterposed between the second layerand each of the baseand the leadsA,B, andC. Crystal grains in the second layerare smaller than crystal grains in the third layer. Such a configuration can suppress corrosion.

Semiconductor laser device

A semiconductor laser device includes a semiconductor laser element, a base material supporting the semiconductor laser element, and a wiring portion formed on the base material and constituting a conduction path to the semiconductor laser element. The base material includes a mounting face oriented to one side in a thickness direction of the base material and having the semiconductor laser element mounted thereon, while also including an emission part located on one side with respect to the semiconductor laser element in a first direction perpendicular to the thickness direction. Light from the semiconductor laser element is emitted through the emission part to the outside.

An LED lighting apparatus is provided. The LED lighting apparatus includes LED chips, a substrate, and an electronic element. The substrate includes a mount surface on which the LED chips are mounted. The LED chips are arranged at or near a center of the mount surface of the substrate. The substrate includes a base, a wiring pattern, and an insulating layer. The wiring pattern is formed on the base. The insulating layer is formed on the base or the wiring pattern and formed with a plurality of openings. The wiring pattern includes pad portions comprising parts of the wiring pattern, respectively. Each of the parts of the wiring pattern is exposed through one of the openings of the insulating layer as viewed in a thickness direction of the substrate. Each of the LED chips is mounted on one of the pad portions.

LED lighting apparatus

An LED light source unit for a backlight of a liquid crystal display is provided. The light source unit includes a plurality of LED chips, an insulating substrate, and a metal film covering a principal surface of the substrate. The LED chips are mounted on the metal film. With this arrangement, brightness of the light source unit is enhanced.

LED light source unit for backlight of liquid crystal display, and liquid crystal display

An image reading apparatus of the present invention includes a first light source, a first light guide, a second light source, a second light guide, light receiving elements and a lens unit. The first light source emits first light. The first light guide directs the first light from the first light source toward an image-carrying object as first linear light extending in a primary scanning direction. The second light source emits second light of a wavelength different from that of the first light. The second light guide directs the second light from the second light source toward the image-carrying object as second linear light extending in the primary scanning direction. The light receiving elements are arranged in the primary scanning direction. The first and second linear lights are reflected by the image-carrying object, and the reflected lights are guided by the lens unit toward the light receiving elements.

Image reading apparatus

Provided is an acceleration sensor that has high detection sensitivity and that can enhance production efficiency. The acceleration sensor has: a ceramic substrate made of AlO; a ferroelectric layer formed in a predetermined area on the ceramic substrate by screen printing, the ferroelectric layer being made of BaTiO; a proof mass disposed so as to face the ferroelectric layer, the proof mass being formed at a predetermined distance d from the ferroelectric layer; and a first electrode and a second electrode that are formed on that side of the proof mass which faces the ferroelectric layer, so as to be fixed thereto. The first electrode and the second electrode are each formed in the shape of comb teeth, and comb tooth portions and thereof are arranged in an alternating manner.

Acceleration sensor and method of fabricating it

An MEMS element (A) includes a substrate (), and a first electrode () formed on the substrate (). The MEMS element (A) further includes a second electrode () including a movable portion () spaced from the first electrode () and facing the first electrode. The movable portion () is formed with a plurality of through-holes (). Each of the through-holes () may have a rectangular cross section.

Growing community of inventors

Kyoto, Japan

Hiroyuki Tajiri