Hitachi Via Mechanics Ltd.

Hiroyuki Sugawara

Kunio Arai

Hiroshi Aoyama

Hiroaki Ashizawa

Hiromi Nishiyawa

Kounosuke Kitamura

Sadao Mori

Takeshi Goto

A method and an apparatus for perforating a printed circuit board are provided so that the processing efficiency and the board densification can be improved. In test processing, a conductor layeris irradiated with a pulsed laser beamwhose energy density is set at a value high enough to process the conductor layerwhile emissionfrom a processed portion is monitored. Thus, the number of pulses of irradiation required for processing a window in the conductor layeris obtained. An insulating layeris irradiated with a pulsed laser beamwhose energy density is set at a value high enough to process the insulating layerbut low enough not to process a conductor layer+1 under the insulating layer. Thus, the number of pulses of irradiation required for processing a window in the insulating layeris obtained. The conductor layeris irradiated with the laser beamthe obtained number of pulses of irradiation, and the insulating layeris irradiated with the laser beamthe obtained number of pulses of irradiation. Thus, a hole is processed in the printed circuit board.

Method and apparatus for perforating printed circuit board

Method and apparatus for laser perforating printed circuit board

A laser machining apparatus in which three or more beam splits are made incident on one machining lens so that high speed machining can be achieved, and the machining quality (shapes, dimensions, accuracy and straightness of machined holes) is excellent. The optical paths of beams A and B having the same polarization direction are aligned almost in one and the same direction by a total reflection/transmission type beam combining meansusing a difference in incident angle. After that, the optical paths of the beams A and B and the optical path of a beam C different in polarization direction therefrom are aligned almost in one and the same direction by a polarizing type beam combining meansThen, the beams A, B and C are made incident on a machining lens

Laser machining apparatus

A method for determining a position of a reference point in which there is no influence of aberration of a camera lens or the like, but an error caused by a failure in shape of an alignment mark can be reduced. An alignment mark consisting of a plurality of pattern portions (and background portions) centering at a design reference point is provided in advance. Positions of centers of border lines of the patterns are calculated. Obtained coordinate values of the centers are averaged in each axial direction. The averaged coordinate values are regarded as coordinate values of a machining reference point. Thus, even when a defect occurs in any pattern portion, an error caused by the defect is reduced so that the accuracy in machining can be improved.

Method for determining position of reference point

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Hitachinaka, Japan

Hiroyuki Sugawara