Ebara Corporation

Other

Hitachi, Ltd.

Hitachi Software Engineering Company, Ltd.

Komatsu Corporation

Hiroyuki Shinozaki

Osamu Nabeya

Shinichi Sekiguchi

Toshimitsu Barada

Seiji Katsuoka

Toshiharu Nakazawa

Kenichi Kobayashi

Naoki Matsuda

Mitsuru Miyazaki

Kiwamu Tsukamoto

Takeshi Murakami

Junji Kunisawa

Takahiro Ogawa

Hiroshi Sotozaki

Natsuki Makino

Yukio Fukunaga

Shinya Morisawa

Akira Imamura

Hideo Aizawa

Tadakazu Sone

Hiroshi Aono

Kenji Shinkai

Atsushi Ooyama

Takahiro Shimano

Yutaka Kobayashi

Akira Nakamura

Masahiro Hatakeyama

Makoto Fukushima

Yuta Suzuki

Taro Takahashi

Satoshi Mori

Akihisa Hongo

Kuniaki Horie

Masao Matsumura

Yoichi Kanemitsu

Hiroyuki Ueyama

Fumio Kondo

Takeshi Yoshioka

Mitsunao Shibasaki

Masaru Nakaniwa

Noriyuki Takeuchi

Norio Kimura

Nobuyuki Takahashi

Shoji Yoshikawa

Yukio Ikeda

Koichi Takeda

Katsuhide Watanabe

Toru Maruyama

Hirosi Sobukawa

Yuji Araki

Toshio Yokoyama

Masafumi Inoue

Yasuyuki Motoshima

Tsutomu Nakada

Masayoshi Hirose

Junichiro Yoshioka

Takeshi Kawamura

Katsuyuki Aoki

Ryuichi Kosuge

Yoshitaka Mukaiyama

Yuji Shirao

Hidenao Suzuki

Katsuaki Usui

Toshiro Maekawa

Masahito Abe

Natsushi Suzuki

Shunichi Aiyoshizawa

Teruaki Hombo

Suguru Sakugawa

Kazuaki Maeda

Hironobu Yamasaki

Shunsuke Yoshioka

Hisashi Nara

Masaaki Kajiyama

Shuichi Suemasa

Shinichi Moriyama

Takafumi Nogami

Shigehiro Hatakeyama

Naoji Hiraki

Masao Saitoh

Nakamura Akira

Masato Eguchi

Shuichi Kamata

Atushi Ooyama

Kazunari Nasa

Masahiko Hashimoto

Tomohiro Sakaue

Kazutoshi Amano

Fumio Gomi

Takenori Iwato

Junki Asai

Boyu Dong

The present application provides a technique for testing execution data and an operation of an AM apparatus by bringing the AM apparatus into operation before actually carrying out fabrication. An AM apparatus configured to manufacture a fabricated object is provided. This AM apparatus includes a chamber defining a space used to manufacture the fabricated object, a base plate disposed in the chamber and configured to support a material of the fabricated object, a beam source configured to irradiate the material on the base plate with a beam, a computer configured to determine an irradiation position of the beam based on three-dimensional data of the fabricated object, a scanning mechanism configured to move the beam according to the determined irradiation position, a detector configured to detect an irradiation position of the beam applied into the chamber, and an evaluator configured to compare the determined irradiation position and the detected irradiation position.

AM apparatus for manufacturing a fabricated object and method for testing an irradiation position of a beam in the AM apparatus

A method is provided and includes making a polishing table and a dummy disk rotate; bringing the dummy disk into contact with a table surface of the polishing table while a liquid is supplied to the table surface; measuring heights of the table surface at a plurality of measurement points while the dummy disk is moved on the table surface; and creating a table profile showing tilt of the table surface from measurement values of the heights of the table surface.

Surface height measurement method using dummy disk

The present invention constructs, in an AM system, such an environment that fine particles are prevented from scattering from an area where the fine particles such as a powder material can be present to another area. According to one aspect, an AM system configured to manufacture a fabrication object is provided. This AM system includes a fabrication chamber in which an AM apparatus is disposed, and a buffer chamber in communication with the fabrication chamber. The buffer chamber includes an entrance in communication with a surrounding environment, an exit in communication with the fabrication chamber, a grating floor, and an exhaust port. The AM system further includes a first gate configured to be able to open and close the entrance of the buffer chamber, and a second gate configured to be able to open and close the exit of the buffer chamber.

Buffer chamber and AM system including a buffer chamber

A coupling mechanism capable of preventing vibration of a rotating body from occurring due to a lower-bearing friction torque is disclosed. The coupling mechanism includes an upper spherical bearing and a lower spherical bearing disposed between a drive shaft and a rotating body. The upper spherical bearing has a first concave contact surface and a second convex contact surface, and the lower spherical bearing has a third concave contact surface and a fourth convex contact surface. The first concave contact surface, the second convex contact surface, the third concave contact surface, and the fourth convex contact surface are arranged concentrically. A lower-bearing radius of the lower spherical bearing is determined so that a lower-restoring torque is equal to or less than 0, the lower-restoring torque being the sum of a rotating-body friction torque generated in the rotating body due to a rotating-body frictional force between a polishing pad and the rotating body, and a lower-bearing friction torque generated in the rotating body due to a frictional force between the third concave contact surface and the fourth convex contact surface.

Coupling mechanism with spherical bearing, method of determining bearing radius of spherical bearing, and substrate polishing apparatus

Measurement jig

In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing padand a semiconductor waferdisposed opposed to the polishing padincludes a polishing tableA for holding the polishing padand a top ringA for holding the semiconductor wafer. A swing shaft motorswings a swing armfor holding the top ringA. The arm torque detection sectiondetects arm torque applied to the swing arm. An end point detection sectiondetects a polishing end point indicating an end of polishing based on the detected arm torque.

Polishing apparatus

A method includes: vacuuming at least one area among a plurality of areas formed concentrically between a top face of the elastic film and the top ring body under a state where a bottom face of the substrate is supported by a support member and a top face of the substrate contacts a bottom face of the elastic film; measuring a flow volume of gas in an area located outside one or more areas to be vacuumed; determining whether the substrate is adsorbed to the top ring based on the flow volume of the gas; and after it is determined that the substrate is adsorbed to the top ring, separating the elastic film to which the substrate is adsorbed from the support member.

Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus

A substrate polishing apparatus includes a polishing tablehaving a polishing surfacein the upper surface, a substrate holding portionthat holds a substrate W having a surface to be polished in the lower surface, and a holding portion coverthat covers the outer side of the substrate holding portion. Between the lower portion of the holding portion coverand the upper surface of the polishing table, a gap portion for intakeis provided, and in the upper portion of the holding portion cover, a pipe for exhaustconnected to an exhaust mechanismis provided. By operating the exhaust mechanism, a rising air current from the gap portiontoward the pipeis formed between the outer surface of the substrate holding portionand the inner surface of the holding portion cover

Substrate polishing apparatus

An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method

A method of monitoring dressing of a polishing pad is provided. The method includes: rotating a polishing table that supports the polishing pad; dressing the polishing pad by pressing a dresser against the polishing pad while causing the dresser to oscillate in a radial direction of the polishing pad; calculating a work coefficient representing a ratio of a frictional force between the dresser and the polishing pad to a force of pressing the dresser against the polishing pad; and monitoring dressing of the polishing pad based on the work coefficient.

Method of monitoring a dressing process and polishing apparatus

The present invention improves versatility of a film thickness measuring device. The trigger sensorincludes a proximity sensorand a dog, and outputs a trigger signal indicating that a polishing tablemakes one revolution. The eddy current sensormeasures a film thickness of a subject to be polishedat a timing based on the trigger signal output from the trigger sensor. The dogis disposed in an opposite regionlocated at the opposite side of a rotation axis Cof the top ringwith respect to a rotation axis Cof the polishing table. Further, the eddy current sensorand the proximity sensorare disposed at the polishing tableso as to be located in the opposite regionwhen the trigger signal is output from the trigger sensor

Film thickness measuring device and polishing device

The present disclosure provides a substrate processing apparatus including: a substrate holding unit that holds a substrate; a pressure regulator that regulates a pressure of a gas supplied into an elastic membrane; and a controller that controls the pressure regulator to make the pressure of the gas supplied into the elastic membrane variable in order to separate the substrate from the elastic membrane.

Substrate processing apparatus

Provided is a substrate processing apparatus that includes: a rotary joint including a rotary unit that rotates together with the rotation of the head unit, a fixing unit that is provided around the rotary unit, and a sealing unit that seals a gap between the rotary unit and the fixing unit; and an outlet pipe through which the quenching water is discharged. A first flow passage through which a gas passes and a second flow passage through which the quenching water passes are formed in the rotary joint, and the second flow passage is isolated from the first flow passage by the sealing unit. One end of the outlet pipe communicates with an outlet port of the second flow passage of the rotary joint, and the other end of the outlet pipe is opened to atmosphere at a position lower than the outlet port of the second flow passage.

Growing community of inventors

Tokyo, Japan

Hiroyuki Shinozaki