Canon Kabushiki Kaisha

Hiroyuki Shimoyama

Ryo Sato

Kenji Kitabatake

Junichiro Iri

Kazumasa Matsushita

Kazuhiro Ishii

Akitoshi Yamada

Hiroyuki Ishinaga

Toshio Kashino

Yoshiyuki Imanaka

Masahiko Kubota

Teruo Ozaki

Akira Yamamoto

Shuji Koyama

Keiji Matsumoto

Isao Imamura

Ikuo Nakazawa

Yumi Yanai

Hiroaki Mihara

Satoshi Kudo

Masaki Ohsumi

Seiichiro Yaginuma

Taichi Yonemoto

Shimpei Otaka

Tomohiro Takahashi

Hisashi Fukai

In order to efficiently produce a liquid containing ultrafine bubbles of a desired gas, an ultrafine bubble-containing liquid producing apparatus includes a gas dissolving unit that dissolves a predetermined gas into a liquid, and a UFB generating unit that generates ultrafine bubbles in the liquid in which the predetermined gas is dissolved. A CPU performs control under a first condition in a case of causing the gas dissolving unit to operate in a circulation route passing through the dissolving unit. The CPU performs control under a second condition different from the first condition in a case of causing the UFB generating unit to operate in a circulation route passing through the UFB generating unit.

Ultrafine bubble-containing liquid producing apparatus and ultrafine bubble-containing liquid producing method

An element substrate is bonded to a support substrate with high positional accuracy. A manufacturing method of the liquid ejecting head includes curing a first adhesive, which is in contact with an element substrate and a support substrate, at a first temperature to perform first temporary fixing, heating a second adhesive, which is in contact with the element substrate and the support substrate, to a second temperature higher than the first temperature so as to cure the second adhesive and perform second temporary fixing and heating a third adhesive, which is in contact with the element substrate and the support substrate, to a third temperature higher than the second temperature so as to cure the third adhesive and bond the element substrate to the support substrate. An elastic modulus of the second adhesive is larger than an elastic modulus of the first adhesive at the second temperature.

Liquid ejecting head and manufacturing method thereof

A liquid ejection head includes a laminated body including a first plate having a plurality of ejection nozzles for ejecting a liquid and made from a resin material and a second plate having a plurality of through-holes communicating with the corresponding ejection nozzles and made from a metal material. The laminated body has a plurality of projection parts formed along the array direction Y of the ejection nozzles and having a curved dome shape projecting in the direction from the second plate to the first plate. The second plate has a plurality of through-slits formed adjacent to the projection parts.

Liquid ejection head and method for producing the same

A flow path unit is formed by laminating a plurality of lamination plates, and has a first damper chamber extending in a manner overlapping with a plurality of pressure chambers with respect to a longitudinal direction in which the plurality of pressure chambers is aligned, as seen from an opening side of a plurality of nozzles. The first damper chamber is provided at a height between the pressure chamber and the common liquid chamber, as measured along the laminating direction in which the plurality of lamination plates is laminated, and a first support part is provided inside the first damper chamber.

Droplet ejection apparatus

A liquid ejection head includes a plurality of ejection ports, a plurality of pressure chambers each communicating with each of the ejection ports, a piezoelectric actuator constituting part of walls of the pressure chambers, and a common liquid chamber containing liquid to be supplied to the pressure chambers. The pressure chambers and the common liquid chamber are opposed with an opposing wall interposed therebetween. The opposing wall faces the wall of the pressure chambers constituted by the piezoelectric actuator. A reinforcing portion that supports the opposing wall is provided in the common liquid chamber.

Liquid ejection head

An element substrate in which a plurality of members are layered. Plates and a substrate serving as the plurality of members being layered and adhered to each other. The element substrate including a plurality of ejection ports that eject a liquid, and a plurality of supply ports that each communicate with a different ejection port. At least one of the members includes a groove that is, when viewing, from above, a surface in which the ejection ports are formed, formed between two ejection ports, each of which communicates to a different supply port.

Element substrate, liquid ejection head, and liquid ejection apparatus

A method of manufacturing a substrate of a liquid ejection head including: forming a plurality of recesses in a silicon wafer; etching the silicon wafer with etchant to form a depression and a plurality of through holes formed from the plurality of the recesses in the depression; and manufacturing a plurality of substrates of the liquid ejection head from the silicon wafer by dividing the silicon wafer on the basis of through holes.

Forming a liquid ejection head with through holes and a depression

Precise positioning of a film used to seal an electrical connection on a liquid ejecting head is made possible. Specifically, positioning is conducted in a state in which part of the film is held to a finger by suction. Next, the finger is moved downward while in the positioned state, and part of the film is pressed against a wiring board. With part of the film fixed to the wiring board in this way, a sealing resin flows while being covered by the film. Consequently, shifting of the position of the film as the sealing resin flows may be prevented. As a result, it becomes possible to conduct covering with the film in a precisely positioned state.

Liquid ejecting head manufacturing method and liquid ejecting head

Growing community of inventors

Kawasaki, Japan

Hiroyuki Shimoyama