Matsushita Electric Industrial Co., Ltd.

Hiroyuki Satoh

Kunio Ninomiya

Takami Uemura

Toshio Matsubara

Hideto Uchijima

A substrate processing apparatus includes a reaction chamber with a structure allowing pressure reduction, a shower head for supplying a processing gas into the reaction chamber including a gas diffusion plate in which through holes are formed, and a substrate support for placing a substrate. Each ones of through holes provided in a peripheral region of the gas diffusion plate is formed so that an area of an inlet thereof is larger than an area of an outlet thereof. With use of the substrate processing apparatus, a processing gas can be supplied uniformly in the gas diffusion plate. Therefore, substrate processing such as film deposition and film etching can be uniformly performed.

Substrate processing apparatus and substrate processing method

A carrier wave NTSC component or a VSB pilot signal in an IF signal is extracted and judged. Then, on the basis of the judgment result, either of demodulation circuitandwhich is appropriate for the received broadcast wave is switched. Information of co-broadcasting programs for analog and digital broadcasts are acquired from EPG and memorized. In case of high-speed channel search, analog broadcast is preferentially switched to. In case of co-broadcasting, the analog broadcast program is displayed on the screen at the beginning, and then, the digital broadcast program is switched when the data decoding is completed. Therefore, it is possible to provide a receiver for receiving digital and analog broadcasts, which can perform switching automatically to a demodulation circuit appropriate for the channel selected modulated wave, and which can also seamlessly switch the channels between analog and digital broadcasts, thereby screen display can be switched smoothly at switching from analog broadcast to digital broadcast.

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Toyama, Japan

Hiroyuki Satoh