Sumitomo Chemical Company, Limited

Akzo N.v.

Komori Corporation

Hiroyuki Sato

Tsutomu Takahashi

Yasunori Nishida

Yasuo Shinohara

Hiroaki Kumada

Yoshifumi Tsujimoto

Akehiro Kusaka

Hiroyoshi Kamoda

Norihiro Kumagai

Akihiko Takenouchi

Hiroto Nagura

An ink supply apparatus of a printing press includes at least one inking device. In the inking device, an ink fountain roller is rotatably supported. An ink fountain main body forms a space to store an ink together with an outer surface of the ink fountain roller. A guide member slidably supports the ink fountain main body and guides the ink fountain main body between a first position where the space is formed and a second position spaced apart from the ink fountain roller than the first position. A doctor including a blade is attached to a doctor holding member between the ink fountain main body and the ink fountain roller when the ink fountain main body is located at the second position. The blade abuts against the ink fountain roller and cleans the ink fountain roller.

Ink supply apparatus of printing press

Provided is a porous film comprising a heat-resistant resin and two or more fillers, wherein a value of D/Dis 0.15 or less where among values each obtained by measuring the average particle diameter of particles that constitute one of the two or more fillers, the largest value is let be Dand the second largest value is let be D.

Porous film

Provided is a separator made of a laminated porous film in which a heat-resistant layer that comprises a heat-resistant resin and a shut-down layer that comprises a thermoplastic resin are laminated, wherein the heat-resistant layer further comprises two or more fillers, and the value of D/Dis 0.15 or less where among values each obtained by measuring the average particle diameter of particles that constitute one of the two or more fillers, the largest value is let be Dand the second largest value is let be D.

Separator

The present invention provides a printed circuit substrate comprising a lightweight prepreg and a conductive layer. The prepeg having uniform formation, low linear thermal expansion coefficient and good mechanical strength, comprising a porous para-oriented aromatic polyamide film and a thermoplastic resin and/or a thermosetting resin, the porous para-oriented aromatic polyamide film being impregnated with the thermoplastic resin and/or the thermosetting resin, a process for producing the same, and a printed circuit substrate/board using the same.

Prepreg process for producing the same and printed circuit

The present invention provides a lightweight prepreg having uniform formation, low linear thermal expansion coefficient and good mechanical strength, comprising a porous para-oriented aromatic polyamide film and a thermoplastic resin and/or a thermosetting resin, the porous para-oriented aromatic polyamide film being impregnated with the thermoplastic resin and/or the thermosetting resin, a process for producing the same, and a printed circuit substrate/board using the same.

Prepreg, process for producing the same and printed circuit

A para-aramide dope of low degree of polymerization exhibiting an optical anisotropy containing 4-10% by weight of a para-aramide having an inherent viscosity of 1.0-2.5 dl/g and 2-10% by weight of an alkali metal chloride or an alkaline earth metal chloride in a polar amide solvent;

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Ibaraki, Japan

Hiroyuki Sato