Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Hiroyuki Saikawa

Masato Hashimoto

Akio Fukuoka

Toshiki Matsukawa

Yoshiro Morimoto

Hiroaki Kaito

Junichi Hayase

Tsutomu Nakanishi

Hiroshi Kurimoto

Junji Yamane

Kohei Harazono

Doyuu Hachisu

Takanao Saito

A capacitor is improved in reliability by suppressing the formation of burrs or protrusions at a joint portion between an aluminum wire round rod and an external terminal in a lead wire used for a capacitor. A metal cap having a higher melting point than aluminum is fitted to an end portion of the aluminum wire round rod and the metal cap is heated, thereby joining the aluminum wire round rod to the metal cap. Thereafter, the external terminal and the metal cap are welded to each other. The metal cap has a curved surface in which an outer periphery is decreased from an opening toward an end portion opposite to the opining. The opening is provided with a stepped portion, so that the sealing degree is increased when the lead wire is inserted into a hole of the sealing member.

Capacitor lead wire, its manufacturing method, and capacitor using the same

A method of manufacturing an inexpensive fine resistor which do not require dimensional classifications of discrete substrates is disclosed. The method eliminates a process of replacing a mask according to a dimensional ranking of each discrete substrate. The method includes: dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; forming a top electrode layer on a top face of the discrete substrate; forming a resistor layer such that a part of the resistor layer overlaps the top electrode layer; forming protective layers so as to cover the resistor layer; and forming side electrode layer on a side face of the discrete substrate such that the side electrode layer is electrically coupled to the top electrode layer.

Method for fabricating a resistor

An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.

A resistor having reliability in electrical connection between an upper surface electrode and a side face electrode, and in bonding strength between a first thin film and a second thin film is provided. The resistor includes upper surface electrodes formed on a main surface a substrate and side face electrodes disposed to side faces of the substrate and connected electrically to the pair of upper surface electrodes, respectively. The upper surface electrode includes a first upper surface electrode layer and a bonding layer overlying the first upper surface electrode layer. The side face electrode includes a first thin film disposed to a side face of the substrate, a second thin film composed of copper-base alloy film and connected electrically to the first thin film, a first plating film formed by nickel plating for covering the second thin film, and a second plating film covering the first plating film.

Resistor and production method therefor

Method for manufacturing a resistor

Growing community of inventors

Fukui, Japan

Hiroyuki Saikawa