Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Hiroyuki Otani

Kazushi Higashi

Yoshihiko Yagi

Norihito Tsukahara

Takahiro Yonezawa

Hidenobu Nishikawa

Kazuto Nishida

Shinji Kanayama

Kenichi Yamamoto

Yoshifumi Kitayama

Yoshinori Wada

Kenji Takahashi

Akihiro Yamamoto

Takaaki Higashida

Shozo Minamitani

Makoto Imanishi

Koichi Yoshida

Shinzo Eguchi

Kazumichi Shimizu

Kouji Hirotani

Takahiko Iwaki

Kazuhiro Nishikawa

Hiroyuki Yoshida

Kenichi Nishino

Kohei Enchi

Shuji Ono

A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip is corrected and the board is connected, the bumps are compressed, and the insulating resin is hardened.

Electronic component mounting method and apparatus

A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is connected, the bumps are compressed, and the insulating resin is hardened.

Electronic component unit

An electronic component and a circuit formation article are bonded together with a bonding material containing resin interposed therebetween. In a state that bumps of an electronic-component bonding region and electrodes of the circuit formation article are in mutual electrical contact, the electronic component and the circuit formation article are thermocompression-bonded to each other upon curing of the bonding material. A bonding-material flow regulating member of the electronic-component bonding region regulates flow of the bonding material toward a peripheral portion of the electronic-component bonding region during bonding of the circuit formation article to the electronic component.

Electronic parts packaging method and electronic parts package

A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.

Semiconductor element having protruded bump electrodes

A semiconductor element mounting method is provided with high productivity. The method includes forming bumps on electrodes of a wafer in which a plurality of semiconductor elements have been formed, temporarily compression-bonding the wafer and an interposer via an insulative resin, curing the resin by performing heating and pressurization so that the wafer and the interposer are finally compression-bonded, wherein the electrodes of the wafer and electrodes of the interposer are bonded to each other, respectively, and wherein insulative resin overflowing from between the wafer and the interposer flows into grooves disposed so as to be coincident with dicing lines of the wafer, thus providing a uniform flow of the insulative resin, and thereafter, cutting and separating this bonded unit into individual semiconductor elements.

Method for mounting a semiconductor element to an interposer by compression bonding

A multilayered circuit board and a method of forming the multilayered circuit board are provided. In a first circuit forming process, a first circuit is formed on an insulating board with a conductor; in a circuit embedding process, the first circuit is embedded in the insulating board so as to have a predetermined surface flatness and a predetermined parallelism; in a masking process, a pilot hole for a via hole is masked at a part of a surface of the circuit; in an insulating layer forming process P, an insulating material is applied as a layer to the surface except that portion thereof covered by the mask; in an insulating material layer flattening process, the surface of the insulating material layer is flattened so as to have the predetermined surface flatness and the predetermined parallelism; and in a pilot hole forming process, the mask is removed.

Multilayered circuit board forming method and multilayered circuit board

A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is corrected, the bumps are compressed, and the insulating resin is hardened.

Electronic parts mounting method and device therefor

An integral type electronic component is formed of a first board and a second board by storing and holding electronic components to component storage parts of the first board and electrically connecting the second board to the electronic components. An arrangement accuracy of the electronic components is determined on the basis of an arrangement accuracy of the component storage parts, and the electronic components stored in the component storage parts are limited in motion. The electronic components can be arranged highly accurately and simply at low costs in a short time in comparison with the conventional art by being simply inserted to the component storage parts.

Method for assembling integral type electronic component and integral type electronic component

A strengthening land is formed on a semiconductor chip-mounting board corresponding to a non-operating electrode on a semiconductor chip. The strengthening land and the non-operating electrode are bonded with each other, thereby improving a bonding strength between the semiconductor chip and the semiconductor chip-mounting board.

Semiconductor chip&mdash;mounting board

The present invention provides a method for mounting a semiconductor element to a circuit board and a semiconductor device whereby connection reliability and connection strength in bonding of the semiconductor element and circuit board are enhanced and a connection resistance value is stabilized low. An insulating adhesive is applied to an opposite face of a circuit board. The circuit board is then connected with a semiconductor element by a conductive adhesive and the insulating adhesive which are interposed between an electrode on the circuit board and the projecting electrode and set in the same process. The circuit board and semiconductor element are connected by the insulating adhesive in addition to the conductive adhesive, so that connection reliability and connection strength are high and a connection resistance value is stabilized low.

Method for mounting semiconductor element to circuit board

Method for mounting a semiconductor chip to a semiconductor chip-mounting board

To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate having a side for positioning the electronic part, a plate having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring for applying a regulating force to the regulating plate in order to press the electronic part to the plate

Bump bonding device and bump bonding method

Sealant is supplied in advance to one or both of the electrical bonding areas of the component and the mounting surface and as the component is brought in contact with the mounting surface the sealant is compressed and filled therebetween in a required area. At the same time ultrasonic vibration is applied to the component for generating friction between the electrical bonding areas of the component and the mounting surface in tight contact with each other, so that both electrical bonding areas are melted and ultrasonically bonded together, and thereby the component is mounted on the mounting surface

Method and apparatus for mounting component

Regarding filling of a paste, a temperature gradient at a paste-pressing face is managed by a heater incorporated in a filling head. Alternatively, a nonvolatile component is applied to a printing face of a base material before the paste is filled, thereby preventing a volatile component of the paste from evaporating with time. Viscosity of the paste is thus maintained. Meanwhile, a change of the quantity of the paste is coped with by changing a moving speed of the filling head or a contact angle of the filling head to the printing face, or by supporting the filling head at the side in touch with the printing face.

Growing community of inventors

Ikoma, Japan

Hiroyuki Otani