Fujitsu Corporation

Tyco Electronics Amp K.k.

Hiroyuki Otaguro

Hitoshi Yokemura

Rie Takada

Takayuki Ashida

Masao Hosogai

Setuo Kojima

Toshio Abe

Takeshi Kimura

Masaharu Hida

Yutaka Higashiguchi

Kazuya Orui

Hidenao Nakajima

Yoshimi Watanabe

Shuuhei Fujita

Kunihiko Shimizu

The present invention relates to an electrical connector assembly capable of achieving a high-precision fit starting with fairly rough positioning, the assembly consisting of a first connector which is equipped with multiple substrates secured in an array and a second connector which is equipped with female terminals and mates with the first connector. The electrical connector has a rough guide mechanism (first guides and second guides as well as first complementary guides and second complementary guides) which guides a mating between the first connector and the second connector relatively roughly at an initial stage of mating, and a precision guide mechanism (chamfers on substrates and corresponding tapers on a housing of the second connector) which guides the mating between the first connector and the second connector relatively precisely at an advanced stage of mating.

Electrical connector assembly

A circuit board packaging structure comprises a plurality of circuit boards disposed in parallel to each other and each packaged with electric circuit parts. The circuit board packaged with electric circuit parts exhibiting a larger exothermic quantity than those of the electric circuit parts packaged on the other circuit boards is disposed outermost among the plurality of circuit boards. The surface of the circuit board packed with the electric circuit parts exhibiting the larger exothermic quantity is directed outside the structure.

Circuit board packaging structure

A method for fabricating a matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board is formed to include a board made of an insulating material, first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other, and through holes provided at cross points of the first and second wiring patterns. A connection pin inserted into at least one of the through holes, electrically connects at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side.

Method for fabricating a matrix switchboard and connection pin

A wiring board structure includes a board made of a material which can be etched by a given solution, an electrically conductive portion, which is thermally conductive, having a portion which extends from the board and which can be etched by the given solution, and an insulating layer having a portion which is in contact with the board and only the side surface of the electrically conductive portion and which prevents the board from being etched when the electrically conductive layer is etched.

Wiring board with an insulating layer to prevent gap formation during

A matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board includes a board made of an insulating material, and first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other. The matrix switch board further includes through holes provided at cross points of the first and second wiring patterns. In the matrix switch board, when a connection pin is inserted into at least one of the through holes, at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side are electrically connected to each other.

Matrix switch board used to connect/disconnect switching system-and

Matrix switch board, connection pin, and method of fabricating them

Growing community of inventors

Kawasaki, Japan

Hiroyuki Otaguro