Hitachi, Ltd.

Hitachi Automotive Systems, Ltd.

Hiroyuki Oota

Kisho Ashida

Tomonori Sekiguchi

Hiroaki Furuichi

Shohei Hata

Atsushi Kazama

Hanae Shimokawa

Masayuki Hio

Kentarou Miyajima

Atsuo Soma

Junji Onozuka

Takuto Yamaguchi

Kentaro Miyajima

A sensor terminal includes: a vibration sensor; an L-shaped attachment main body portion on which the vibration sensor is mounted and that is detachably attached to a truncated quadrangular pyramid structure portion of a valve cap attached to an opening/closing shaft portion of a water regulating valve provided in a water service pipe; side surface magnets that are provided in the attachment main body portion; and an upper surface magnet that is attached to a lower surface of a base on which the vibration sensor is mounted. Further, the truncated quadrangular pyramid structure portion includes a quadrangular upper surface and four side surfaces, and the attachment main body portion of the sensor terminal is fixed using magnet to each of the upper surface of the truncated quadrangular pyramid structure portion and at least one side surface among the four side surfaces.

Fixing structure for electronic device and water leakage detector

A mechanical quantity measuring device includes: a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector; a stem having ascot that protrudes from an adjacent peripheral portion and has an upper surface that is attached to a lower surface of the sensor chip by a bonding material formed from a metallic material or a glass material; a lead-out wiring part including a plurality of wires that are electrically connected to the plurality of electrodes; and a fixing part for fixing the stem, wherein: the stem and the fixing part are integrally molded or fixed through metallic bonding or mechanical bonding.

Mechanical quantity measuring device and sensor unit

A device for measuring mechanical quantity is provided which reduces the influence of a difference in thermal expansion coefficient between an object to be measured and a base plate metal body, and precisely measures a mechanical quantity such as deformation quantity or strain quantity caused in the object to be measured. The device includes a semiconductor strain sensor module for measuring deformation quantity of the object to be measured, and the module includes a metal body, and a semiconductor strain sensor mounted on the metal body to detect strain of the metal body. The object to be measured is made of a material having a thermal expansion coefficient larger than that of the metal body. Further, the metal body mounted with the semiconductor strain sensor has a structure configured to be fixed to the object to be measured.

Device for measuring mechanical quantity

Growing community of inventors

Tokyo, Japan

Hiroyuki Oota