Screen Semiconductor Solutions Co., Ltd.

Screen Holdings Co., Ltd.

Sokudo Co., Ltd.

Dainippon Screen Mfg. Co., Ltd.

Raschel Co., Ltd.

Yotsuami Limited

Hiroyuki Ogura

Tsuyoshi Mitsuhashi

Yoshiteru Fukutomi

Kenya Morinishi

Yasuo Kawamatsu

Hiromichi Nagashima

Shogo Yoshida

Masahito Kashiyama

Toru Momma

Shoji Kirita

Junki Nishimura

Hidetoshi Sagawa

Ryuichi Yoshida

Hiroyuki Takeuchi

Katsushi Yoshioka

Satoshi Yamamoto

Takuya Sanari

Toyoyuki Kuroda

Hitoshi Nakanishi

A substrate treating apparatus for treating substrates includes a plurality of substrate treatment lines arranged vertically for carrying out plural types of treatment on the substrates while transporting the substrates substantially horizontally, and a controller for changing processes of treatment carried out on the substrates for each of the substrate treatment lines. By changing the processes of treatment carried out for the substrates for each substrate treatment line, the processes of treatment carried out for the substrates can be changed for each substrate conveniently. Thus, a plurality of different processes of treatment corresponding to the number of substrate treatment lines can be carried out in parallel for the respective substrates.

Substrate treating apparatus with parallel first and second parts of substrate treatment lines on multiple stories for simultaneously treating a plurality of substrates

A treating solution supply apparatus which supplies a treating solution for treating a substrate includes a liquid passage for allowing the treating solution to flow therethrough; and a pump including a chamber with a variable volume for receiving and feeding the treating solution from/to the liquid passage, and a chamber driver electrically driven to vary the volume of the chamber. The liquid passage, chamber, and chamber driver are arranged in the stated order laterally.

Treating solution supply apparatus

A chamber has a first opening, a second opening, and a third opening. The second opening is higher in level than the first and third openings, and is located at the highest position of a reservoir. Air bubbles are easily collected around the second opening, higher in level than the third opening, due to buoyancy. Moreover, the chamber includes an upper slope on an upper inner wall thereof such that a sectional area of the chamber becomes smaller toward the highest position of the reservoir. The upper slope causes the air bubbles not to stagnate but to be guided to the second opening along the upper slope. This makes easy discharge of the air bubbles from the chamber.

Pumping apparatus, treatment solution supplying device, and substrate treating apparatus

A coating method of coating a substrate with a chemical includes a solvent supplying step and a chemical supplying step. In the solvent supplying step, a solvent is supplied to the substrate. After the solvent supplying step, the chemical is supplied to the substrate in the chemical supplying step. The solvent supplying step includes a first step. The first step causes the substrate to rotate at a first rotation speed, causes a solvent nozzle to move between a central position above a center portion of the substrate and a peripheral position above a peripheral portion of the substrate, and causes the solvent nozzle to dispense the solvent.

Coating method

A chamber has at least three openings, or a first opening, a second opening, and a third opening formed therein that are in communication with a reservoir. The second opening is higher in level than the first opening. The third opening is used for discharging a liquid within the reservoir by introducing gas through at least one of the first opening and the second opening into the reservoir. Since the third opening is the lowest in level among the three openings, the liquid stored in the reservoir is able to be drained easily.

Pumping apparatus, treatment solution supplying device, substrate treating apparatus, liquid draining method, and liquid replacing method

A pumping apparatus includes a pump chamber, a piston, a motor, and a controller. The controller determines an imaginary terminal point by referring to a dispense command, theoretical information, and a current position of the piston. The controller corrects the imaginary terminal point to a target position by referring to a correction graph. The controller outputs a drive command to the motor for moving the piston from a start position to the target position.

Pumping apparatus and substrate treating apparatus

A substrate treating method for treating substrates with a substrate treating apparatus having an indexer section, a treating section and an interface section includes performing resist film forming treatment in parallel on a plurality of stories provided in the treating section and performing developing treatment in parallel on a plurality of stories provided in the treating section.

Substrate treating apparatus with parallel gas supply pipes and a gas exhaust pipe

A slit opening of a slit nozzle extends unidirectionally in a longitudinal direction from near the center of a circular substrate to near an outer edge of the substrate, and has a length in the longitudinal direction equal to or smaller than a radius of the substrate. When the slit nozzle discharges chemical onto the substrate, a rotary holder rotates the substrate and the slit nozzle relatively to each other about the center of the substrate. Accordingly, the chemical from the slit nozzle all adheres to a surface of the substrate to form an excellent liquid column and a chemical film on an almost entire surface of the substrate along the outer edge of the circular substrate. This yields satisfactory coating of the substrate with the chemical while waste chemical is suppressed.

Coating method and coating apparatus

A substrate treating apparatus includes a first treating block and a second treating block disposed adjacent to the first treating block. Each of the first treating block and the second treating block include a plurality of stories arranged vertically. Each of the plurality of stories includes treating units for treating substrates and a main transport mechanism for transporting the substrates to and from the treating units. The substrates are transportable between the stories of the first treating block and the stories of the second treating block at same heights as corresponding stories of the first treating block. The substrates are transportable between the stories of the first treating block and the stories of the second treating block at different heights from corresponding stories of the first treating block.

Multi-story substrate treating apparatus with flexible transport mechanisms and vertically divided treating units

A treating section has substrate treatment lines arranged one over the other for treating substrates while transporting the substrates substantially horizontally. An IF section transports the substrates fed from each substrate treatment line to an exposing machine provided separately from this apparatus. The substrates are transported to the exposing machine in the order in which the substrates are loaded into the treating section. The throughput of this apparatus can be improved greatly, without increasing the footprint, since the substrate treatment lines are arranged one over the other. Each substrate can be controlled easily since the order of the substrates transported to the exposing machine is in agreement with the order of the substrates loaded into the treating section.

Substrate treating apparatus with substrate reordering

Substrate treating apparatus with parallel substrate treatment lines simultaneously treating a plurality of substrates

Substrate treating apparatus

A treating section includes a plurality of treating blocks juxtaposed horizontally. Each treating block is vertically divided into stories. Each story includes treating units and a main transport mechanism. Substrates are transportable between the same stories of the treating blocks. Further, the substrates are transportable between different stories. Thus, the apparatus can transport the substrates flexibly between the treating blocks.

A substrate treating apparatus includes a treating block including a plurality of cells arranged one over another. Each cell has treating units for treating substrates and a single main transport mechanism disposed in a transporting space for transporting the substrates to the treating units. The treating units include solution treating units and heat-treating units. The solution treating units are arranged at one side of the transporting space, the heat-treating units are arranged at the other side of the transporting space, and the main transport mechanism and the treating units are in substantially the same layout in plan view for the respective cells. The solution treating units are in substantially the same layout in side view for the respective cells, the heat-treating units are in substantially the same layout in side view for the respective cells, and treatments of the substrates carried out in the respective cells are the same.

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Kyoto, Japan

Hiroyuki Ogura