Tokyo Ohka Kogyo Co., Ltd.

Matsushita Electronics Corporation

Hiroyuki Obiya

Ryuma Mizusawa

Kiminori Oshio

Akira Kumazawa

Syunji Nakazato

Hitoshi Setsuda

Kenji Tazawa

Tetsuo Yamamoto

Hiroshi Takehana

Toru Takahashi

Tomoyuki Inoue

Taisuke Shiroyama

Yoshikazu Takiguchi

Hiroyuki Nishimura

Masahiro Suzuki

Shinkichi Asahi

Hiromitsu Sato

Syunzi Nakazato

Yusuke Fujito

Shinichiro Ishino

The present invention provides an unbaked laminate for producing a front plate () of a plasma display device, and a method for producing such a front plate (). The laminate includes a burnable intermediate layer (), and may include an unbaked dielectric layer (A) and a photosensitive unbaked spacer material layer (A). The burnable intermediate layer () positions between the dielectric layer () and the spacer material layer (), and may burn up upon baking treatment, enabling removal of residues of the spacer material layer in the region subjected to its removal.

Unbaked laminate for producing front plate of plasma display device, and method for producing front plate of plasma display device

A composition for a dielectric of a plasma display panel laminating a plurality of layers, includes: a lower layer composition containing inorganic powder and a binder resin, an upper layer composition containing inorganic powder, a binder resin, a photopolymerizable monomer and a photopolymerization initiator, the upper layer composition being provided above the lower layer, and an intermediate layer composition containing a thermally decomposable resin, the intermediate layer composition being provided between the lower layer and the upper layer.

Composition for dielectric of plasma display panel, laminate for dielectric, and method for forming the dielectric

A photosensitive resin composition which gives a dry film having a sand blast proof property and a development property in a well-balanced manner. A photosensitive resin composition containing a carboxy group-containing urethane (meth)acrylate compound having two or more of (meth)acryloyl groups per molecule whose acid value of less than 10 mg KOH/g, an alkali soluble polymer compound, a photopolymerization initiator and a photopolymerizable compound (D) including in the structure thereof a structural unit represented by the formula (I) gives such a well-balanced properties.OCHCH&#x2003;&#x2003;(I)

Photosensitive resin composition and photosensitive dry film containing the same

A process of producing a plasma display panel has the steps of: forming a photosensitive paste composition layer on a carrier film; transferring the photosensitive paste composition layer onto a substrate; exposing the photosensitive paste composition layer; removing the carrier film; and baking the exposed composition layer to fabricate at least one of barrier ribs, electrodes, resistors, dielectrics, phosphors, a color filter array, and a black matrix.

Process of making barrier ribs, electrodes, and the like for a plasma panel

A photosensitive composition for sandblasting comprising the components of: (A) a photopolymerizable urethane (meth)acrylate oligomer comprising (meth)acryloyl group; (B) an acrylic copolymer; and (C) a photopolymerization initiator, wherein the component (B) comprises, as a monomer unit, one of copolymerizable monomers comprising one of a benzene ring and a cyclohexyl group.

Photosensitive composition for sandblasting and photosensitive film using the same

A photosensitive insulating paste composition comprising: an organic component comprising the components of (A) a water-soluble cellulose derivative, (B) a photopolymerizable monomer, (C) an acrylic resin having a hydroxyl group, and (D) a photopolymerization initiator; and an inorganic powder.

Photosensitive insulating paste composition and photosensitive film made therefrom

Plastic abrasives for sandblasting, in particular, those to be used in sandblast processing for forming barrier ribs and priming ribs; a sandblast processing method with the use of the same; and a method for treating sandblasting waste matters. A plastic abrasive for sandblasting characterized by being soluble in organic solvents or water/organic solvent mixtures and comprising plastic particles having an average particle size of 5 to 100 &mgr;m; a method for sandblast processing a plasma display panel substrate by using the plastic abrasive; and a method for treating sandblasting waste matters.

Plastic abrasive for sandblasting, method for sandblast processing plasma display panel substrate using the same and method for treating sandblasting waste matters

A photopolymerizable composition comprising (A) a polymer binder, (B) a photopolymerizable monomer and (C) a photopolymerization initiator, wherein the component (B) is at least one compound represented by the following formula (1):

Photopolymerizable composition

An insulating paste composition for rib formation which comprises an insulating material, an organic binder, a light-absorbing substance, and an organic solvent. A rib pattern is formed by sandblasting an insulating layer formed of the composition using a lithographically formed resin pattern mask. The composition forms an antireflective insulating layer which can provide a rib pattern excellent in crosssectional contour and dimensional precision.

Insulating paste composition for rib formation and method of rib pattern formulation

A photosensitive composition for sandblasting and a photosensitive film laminate having a photosensitive layer comprising the photosensitive composition are disclosed, the photosensitive composition comprising (A) a photopolymerizable urethane (meth)acrylate oligomer having at least two acryloyl groups and/or methacryloyl groups and a structural unit represented by formula:

Photosensitive composition for sandblasting and photosensitive film laminate comprising the same

An improved process for producing a multilayer wiring board that has a plurality of conductor patterns and an interlevel dielectric layer on at least one surface of a substrate, with via holes or trench-like channels being provided at specified sites of said interlevel dielectric layer to establish an electrical interconnection between said conductor patterns, wherein prior to the provision of said via holes or trench-like channels, a coating having resistance to sandblasting is formed in a pattern over the interlevel dielectric layer and then sandblasting is performed to remove the interlevel dielectric layer in selected areas to form the via holes or trench-like channels and, thereafter, the coating having resistance to sandblasting is removed, followed by the provision of a conductive layer.

Process for producing multilayer wiring boards

A photosensitive composition for sandblasting and a photosensitive film having a photosensitive layer comprising the photosensitive composition are disclosed, the photosensitive composition comprising a photopolymerizable urethane (meth)acrylate oligomer having at least two acryloyl groups and/or methacryloyl groups, a photopolymerization initiator, and at least one cellulose derivative selected from the group consisting of hydroxypropyl cellulose, ethylhydroxyethyl cellulose, hydroxypropylmethyl cellulose phthalate, and hydroxypropylmethyl cellulose acetate phthalate. The composition exhibits excellent adhesion to a substrate, high sensitivity, and high resistance to sandblasting.

Photosensitive composition for sandblasting and photosensitive film comprising the same

Plastic abrasives for sandblasting, in particular, those to be used in sandblast processing for forming barrier ribs and priming ribs; a sandblast processing method with the use of the same; and a method for treating sandblasting waste matters. A plastic abrasive for sandblasting characterized by being soluble in organic solvents or water/organic solvent mixtures and comprising plastic particles having an average particle size of 5 to 100 .mu.m; a method for sandblast processing a plasma display panel substrate by using the plastic abrasive; and a method for treating sandblasting waste matters.

Plastic abrasive for sandblasting, method for sandblast processing

A modified cellulose compound and a photopolymerizable resin composition containing the same are disclosed, the modified cellulose compound being obtained by reacting a hydroxyl group of cellulose or a cellulose derivative with an isocyanate group of a specific (meth)acryloyloxyalkylene isocyanate compound. The photopolymerizable resin composition has excellent adhesion to a substrate and high flexibility, and the modified cellulose compound has properties of easily decomposing and volatilizing even after baking.

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Kanagawa, Japan

Hiroyuki Obiya