Toray Industries, Inc.

Hiroyuki Niwa

Mitsuhito Suwa

Toshihisa Nonaka

Koichi Fujimaru

Yoichi Shinba

Kazuyuki Matsumura

Kazutaka Tamura

Hiroshi Hosono

Akira Shimada

Yoshiko Tatsuta

Masahide Senoo

Kanako Sugimoto

Chikara Inagaki

Yasuko Tachibana

A photosensitive resin composition contains: (a) an alkali-soluble polyimide; (b) a compound which has two or more epoxy groups and/or oxetanyl groups in each molecule; and (c) a quinonediazide compound. Less than 10 parts by weight of an acrylic resin is contained per 100 parts by weight of the polyimide (a); and the content of the compound (b) is not less than 20 parts by weight per 100 parts by weight of the polyimide (a).

Photosensitive resin composition, photosensitive resin composition film, and semiconductor device using the photosensitive resin composition or photosensitive resin composition film

Provided is a photosensitive adhesive composition comprising (A) an alkali-soluble polyimide having particular structural unit(s) and having a particular structure at at least one end of the main chain, (B) a glycidylamine type epoxy compound of a particular structure, (C) a photopolymerizable compound, and (D) a photoinitiator, wherein (A) the alkali-soluble polyimide has a glass transition temperature of 160&#xb0; C. or higher. The photosensitive adhesive composition has the ability to form patterns with an alkaline developer, excellent thermocompressibility at a low temperature to an irregular substrate after exposure, and a high adhesive strength even at a high temperature.

Photosensitive adhesive composition, photosensitive adhesive film, and semiconductor device using each

The present invention is an optical waveguide-forming paste composition including (A) barium sulfate particles with a mean particle diameter of 1 nm or more to 50 nm or less, (B) a compound having a polymerizable group and a carboxyl group, or a phosphoric ester compound having a polymerizable group, and (C) an organic solvent.

Paste composition for light guide and light guide utilizing the same

The present invention relates to a positive-working radiation-sensitive composition which is characterized in that it contains a compound meeting any of conditions a1) to a3), and b) an acid generator which generates acid by irradiation with radiation; and also to a method for the production of a resist pattern employing same. a1) A compound wherein a carboxyl group is protected by an acid labile group represented by general formula (1)(Rand Rare aromatic rings, and Rrepresents an alkyl group, a substituted alkyl group, a cycloalkyl group or an aromatic ring. Rto Rmay be the same or different.) a2) A compound in which an alkali-soluble group is protected by an acid labile group represented by general formula (2)(Rto Rare each an alkyl group, a substituted alkyl group, a cycloalkyl group or an aromatic ring, and at least one of Rto Ris an aromatic ring with an electron-donating group. Rto Rmay be the same or different.) a3) A compound in which an alkali-soluble group is protected by an acid labile group a, and either acid labile group a has an alkali-soluble group or acid labile group a has an alkali-soluble group protected by an acid labile group b. With this constitution, it is possible by means of the present invention to obtain a positive-working radiation-sensitive composition of high sensitivity having a resolution which enables sub-quarter micron pattern processing to be carried out.

Positive type radiation-sensitive composition and process for producing pattern with the same

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Otsu, Japan

Hiroyuki Niwa