Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Skyworks Solutions, Inc.

Skyworks Filter Solutions Japan Co., Ltd.

Skyworks Panasonic Filter Solutions Japan Co., Ltd.

Maxell, Ltd.

Riso Kagaku Corporation

National Institute of Advanced Industrial Science and Technology

Skyworks Global Pte. Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Sharp Kabushiki Kaisha Corporation

Other

Hitachi Maxell, Limited

Maxell Holdings, Ltd.

Hitachi Industry & Control Solutions, Ltd.

Hiroyuki Nakamura

Tetsuya Tsurunari

Joji Fujiwara

Rei Goto

Hidekazu Nakanishi

Kazunori Nishimura

Keiji Onishi

Toshio Ishizaki

Tomohiro Iwasaki

Hiroshi Nakatsuka

Toru Yamada

Tomoya Komatsu

Shigeru Tsuzuki

Keiichi Maki

Takehiko Yamakawa

Yasuhiko Kunii

Yosuke Hamaoka

Nobuyuki Kaku

Mitsunori Miyanari

Hiroyuki Kajikawa

Ken Matsunami

Yoshiaki Ando

Hiroshi Yamaguchi

Megumi Kurachi

Toru Yamaji

Masahiro Kishigami

Takuya Shimizu

Gong Bin Tang

Shoji Okamoto

Akio Tsunekawa

Shun-ichi Seki

Chohei Ono

Toru Jibu

Koji Hirata

Masahiko Yatsu

Takashi Inoue

Toshinori Sugiyama

Toshifumi Nakatani

Kwang Jae Shin

Hiroshi Chiba

Makoto Sakakura

Masahiro Yasumi

Yukio Iwasaki

Masashi Ito

Hidehito Shimizu

Hiroshi Yasuda

Hiroaki Kosugi

Joshua James Caron

Kazuhide Uriu

Benjamin Paul Abbott

Shunichi Seki

Siarhei Dmitrievich Barsukou

Tsutomu Igaki

Kenichi Yamashita

Tohru Nakamura

Koichi Ogawa

Ryoichi Takayama

Kenichi Takahashi

Takahiro Sato

Hironori Fukuhara

Kazuo Shikita

Toshiki Itoi

Toru Sakuragawa

Takaaki Maegawa

Hiroki Kamiguchi

Tsutomu Matsumura

Jie Zou

Michio Kadota

Satoshi Nakayama

Kaoru Ishida

Hisashi Adachi

Hideki Aikoh

Hiroshi Kagata

Hironori Tomita

Morito Akiyama

Naoki Yuda

Satoshi Ohuchi

Shuji Tanaka

Toshiaki Nakamura

Kouji Kawakita

Toshimitsu Matsuyoshi

Hideo Ohkoshi

Eiichi Kanaumi

Chun Sing Lam

Shigehiro Yoshiuchi

Masayuki Fukui

Katsuya Morinaka

Ryouichi Takayama

Kenji Sakamoto

Naohiro Tsurumi

Takami Ishida

Naohiro Ueno

Tomoya Maekawa

Takuya Wada

Tetsuo Kawasaki

Tomohiro Nagano

Myeong Gweon Gu

Masato Uehara

Takashi Imanaka

Kenichi Kimura

A surface acoustic wave device is disclosed. The surface acoustic wave device can include a ceramic substrate, a piezoelectric layer over the ceramic substrate, and an interdigital transducer electrode over the piezoelectric layer. The ceramic substrate can be a polycrystalline spinel substrate. The surface acoustic wave device can also include a temperature compensating layer over the interdigital transducer electrode.

Acoustic wave device with ceramic substrate

Based on information about a vehicle, the information can be projected and displayed onto a road surface or the like. An image projection apparatus, which projects an image, includes an acquisition unit that acquires the information about the vehicle, and an image projection unit that projects the image based on the information acquired by the acquisition unit.

Image projection apparatus

A method of manufacturing a packaged surface acoustic wave filter chip is disclosed. The method can include providing a structure having first interdigital transducer electrodes formed with a first piezoelectric layer, second interdigital transducer electrodes formed with a second piezoelectric layer, and a substrate between the first and second piezoelectric layers. The method can include forming a plurality of through electrodes extending at least partially through a thickness of the structure such that a first set of through electrodes of the plurality of through electrodes are electrically connected to the first interdigital transducer electrodes and a second set of through electrodes of the plurality of through electrodes are electrically isolated from the first interdigital transducer electrodes.

Methods of manufacturing multi-band surface acoustic wave filters

Aspects of this disclosure relate to a surface acoustic wave device. The surface acoustic wave device includes a piezoelectric layer and an interdigital transducer. The interdigital transducer electrode includes a pair of electrodes, each electrode having a bus bar and fingers extending from the bus bar. The interdigital transducer electrode has an interdigital region defined by a portion of the fingers of the electrodes that interdigitate with each other. A dielectric layer is disposed over the interdigital transducer electrode outside the interdigital region and configured to reduce a loss of the surface acoustic wave device.

Surface acoustic wave device

A piezoelectric microelectromechanical systems device can include a cavity bounded by walls and an asymmetrical bimorph structure at least partially spanning the cavity that includes at least a piezoelectric layer and two electrode layers. The electrode layers can have relative thicknesses configured to compensate for expected temperature stress in the bimorph structure. Thus, metals having different thicknesses can be positioned and configured to compensate deflection due to thermal stress of any or all of the piezoelectric layer, the first metal layer, and second metal layer and a substrate. A method for making the piezoelectric microelectromechanical systems device is also provided.

Piezoelectric MEMS device with thermal compensation from different material thicknesses

Aspects of this disclosure relate to acoustic wave devices on stacked die. A first die can include first acoustic wave device configured to generate a boundary acoustic wave. A second die can include a second acoustic wave device configured to generate a second boundary acoustic wave, in which the second die is stacked with the first die. The first acoustic wave resonator can include a piezoelectric layer, an interdigital transducer electrode on the piezoelectric layer, and high acoustic velocity layers on opposing sides of the piezoelectric layer. The high acoustic velocity layers can each have an acoustic velocity that is greater than a velocity of the boundary acoustic wave.

Acoustic wave devices on stacked die

A piezoelectric microelectromechanical system microphone comprises a support substrate, a membrane including a piezoelectric material attached to the support substrate and configured to deform and generate an electrical potential responsive to impingement of sound waves on the membrane, and a compliant anchor including a trench defined in the support substrate about a portion of a perimeter of the membrane to increase sensitivity of the piezoelectric microelectromechanical system microphone.

Anchor silicon dioxide layer for piezoelectric microelectromechanical system microphone

A delay line for radio frequency circuits comprises a piezoelectric substrate, a transmission single phase unidirectional transducer (SPUDT) disposed on the piezoelectric substrate, and a receive SPUDT disposed on the piezoelectric substrate and separated from the transmission SPUDT in a direction of transmission of a main acoustic wave mode utilized by the transmission SPUDT.

Lamb wave delay line

An acoustic wave component is disclosed. The acoustic wave component can include a bulk acoustic wave resonator and a surface acoustic wave device. The bulk acoustic wave resonator can include a first portion of a ceramic substrate, a first piezoelectric layer positioned on the ceramic substrate, and electrodes positioned on opposing sides of the first piezoelectric layer. The surface acoustic wave device can include a second portion of the ceramic substrate, a second piezoelectric layer positioned on the ceramic substrate, and an interdigital transducer electrode on the second piezoelectric layer.

Acoustic wave devices with common ceramic substrate

Information related to a vehicle can be displayed by projecting an image based on the information on a road surface or the like. An image projection apparatus that projects an image includes: a sensor unit that acquires information related to a vehicle; and an image projection unit that projects the image based on the information acquired by the sensor unit.

Image projection apparatus, of a vehicle, that projects an image on a surface

Multiplexers are disclosed. A multiplexer can include a first filter and a second filter that are coupled to a common node. The second filter can include a first type of acoustic wave resonators (e.g., bulk acoustic wave resonators) and a series acoustic wave resonator of a second type (e.g., a surface acoustic wave resonator) that is coupled between the acoustic wave resonators of the first type and the common node. The first filter can provide a single-ended radio frequency signal. In certain embodiments, the first filter can be a receive filter and the second filter can be a transmit filter.

Multiplexer including filter with two types of acoustic wave resonators

Aspects of this disclosure relate to an elastic wave device. The elastic wave device includes a sub-wavelength thick piezoelectric layer, an interdigital transducer electrode on the piezoelectric layer, and a high velocity layer configured to inhibit an elastic wave from leaking from the piezoelectric layer at anti-resonance.

Elastic wave device with sub-wavelength thick piezoelectric layer and high velocity layer

Aspects of this disclosure relate to a surface acoustic wave device that includes a first reflector over a piezoelectric layer, a second reflector over the piezoelectric layer, and an interdigital transducer electrode structure over the piezoelectric layer and positioned between the first reflector and the second reflector. The surface acoustic wave device includes a velocity adjustment layer arranged to adjust acoustic velocity in a region of the surface acoustic wave device. The velocity adjustment layer can be a high speed layer or a low speed layer.

Acoustic wave device with velocity adjustment layer

Growing community of inventors

Osaka, Japan

Hiroyuki Nakamura