Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Hiroyuki Naito

Satoshi Shida

Takaari Uemoto

Keiji Nishimoto

Yasuharu Ueno

Makoto Morikawa

Shinji Kanayama

Akira Yamada

Shozo Minamitani

Noriyasu Tanimoto

Takaharu Mae

Nobuhisa Watanabe

Makoto Akita

Shinya Marumo

Akira Mori

Toshifumi Ogata

A light source that restricts the heat accumulation in the phosphor. The light source includes: a substrate; LED elements D, D, D, D, Dthat have been implemented on a main surface of the substrate; projectionsthat have been formed in areas of the main surface of the substratein which any of the LED elements D, D, D, D, Dhave not been implemented; and a translucent sealing memberthat has been formed on the substrate in a state that the LED elements D, D, D, D, Dand the projectionsare covered and sealed with the sealing member. The sealing memberincludes a phosphorthat converts light from the LED elements D, D, D, D, Dinto light of a predetermined color. The heat conductivity of the projectionsis higher than the heat conductivity of the sealing member

Light source

A phosphor layer forming apparatus () in which a paste () containing a phosphor is discharged so as to cover each of a plurality of light-emitting elements () mounted on a substrate () includes the following: a discharge portion () for discharging the paste () in the form of droplets onto each of the light-emitting elements (); a measurement portion () for measuring the thickness of individual phosphor layers that are formed of the paste () covering each of the light-emitting elements (); and a discharge control portion () for controlling the amount of the paste () to be redischarged for each phosphor layer in accordance with the thickness of the individual phosphor layers measured by the measurement portion (). This phosphor layer forming apparatus can reduce the manufacturing time.

Apparatus for forming phosphor layer and method for forming phosphor layer using the apparatus

A light-emitting module () includes a mounting board () with a conductor pattern and a plurality of light-emitting elements () mounted on the conductor pattern via wires (). The extending direction of each of the wires () toward the conductor pattern is oriented irregularly when viewed perpendicularly to the mounting board (). This can prevent the shadows of the wires () from overlapping, and thus can suppress the luminance nonuniformity.

Light-emitting module with plural light emitters and conductor pattern

A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.

Component mounting method, component mounting apparatus, and ultrasonic bonding head

A light-emitting device () includes a substrate (), a light-emitting element () that is mounted on the substrate () and includes a luminous region () and a nonluminous region (), and a phosphor layer () that is formed to cover the light-emitting element (). The thickness of the phosphor layer () located on the nonluminous region () is smaller than that of the phosphor layer () located on the luminous region (). The light-emitting device () can suppress nonuniform luminescent color.

LED with phosphor layer having different thickness or different phosphor concentration

Provided is a light source that has high reliability and hardly causes conductivity failure between a light emitting device and a conductive land. In an LED light source of the present invention, an LED bare chip is mounted to conductive lands of a substrate, using bumps (). The LED bare chip (D) is provided with a p-electrode (Lp) and an n-electrode (Ln) on a rear surface. The p-electrode (Lp) is larger in area than the n-electrode (Ln). The p-electrode (Lp) is bonded to a corresponding conductive land via four bumps (), whereas the n-electrode (Ln) is bonded to a corresponding conductive land via one bump (). A bonded area (Sn) between the n-electrode (Ln) and the bump () is larger than a bonded area (Sp) between the p-electrode (Lp) and one of the bumps ().

Light source, manufacturing method of light source, lighting apparatus, and display apparatus

The semiconductor device bonding apparatusof the present invention includes: a pressing memberthat presses the semiconductor devicetoward the substrateside in a state where a bumpis provided between the semiconductor deviceand the substrate; an ultrasonic vibration applying memberthat vibrates the semiconductor deviceand the substraterelatively by applying an ultrasonic vibration to at least one of the semiconductor deviceand the substrate; a time measuring memberthat measures a required time period from a time when starting to apply the ultrasonic vibration to a time when the semiconductor deviceis pressed a predetermined distance; and a controlling memberthat controls an output of an ultrasonic vibration during subsequent bonding, based on the time period measured by the time measuring member

Semiconductor device bonding apparatus and method for bonding semiconductor device using the same

Light source of light-emitting diode

A component mounting apparatus includes a component feeder () that feeds a component () with its bump electrodes facing down, a mounting head () that mounts the component onto a substrate (), a supporting base () that secures the substrate, and a positioning device () that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (), an ultrasonic vibration propagation member () that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face () holding the component as vibration parallel thereto, a pressure loader () that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater () that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes () on its face.

Growing community of inventors

Osaka, Japan

Hiroyuki Naito