Nissha Co., Ltd.

Nissha Printing Co., Ltd.

Labo Juversa Co., Ltd.

Hiroyuki Nagai

Masateru Chiyama

Koji Okamoto

Yoshihiro Sakata

Eiji Kawashima

Kazuto Nakamura

Ichiro Ono

Kanji Takada

Akihiro Maeda

Hiromitsu Muko

Kensaku Akita

Shigeru Hinoshita

Masaki Kashiwagi

Mariko Sanada

Ikuya Takahashi

Risa Nakaoka

Rokusuke Takemura

Masato Oonishi

Kazuo Arai

Takeshi Sanada

An edible powder formed of particles smaller than a film thickness, a predetermined component, and an edible liquid having a mass 35% or less of a mass of the powder are kneaded to generate a plastic solid material containing a liquid. The solid material is extruded from a mold to plastically deform the solid material and a predetermined cross-sectional shape is imparted to the solid material. The solid material having the predetermined cross-sectional shape is sliced with a cutting edge so as to have a film shape having a predetermined thickness.

Method of producing edible film, film formulation, and edible film

Provided is an inexpensive microneedle array with little dimensional error that can control, with high precision, the amount of a predetermined component to be introduced to the inner part of the skin, and a production method for this microneedle array. A foundation that is insoluble or sparingly soluble in inner part of the skin is overlaid on a mold. A plurality of frustum-shaped protrusions, which are insoluble or sparingly soluble in the raw material liquid, provided on a first main surface of the foundation are fit into a plurality of cone-shaped recesses. The raw material liquid in the plurality of cone-shaped recesses dries and, as a result, a plurality of microneedles, which are dissolvable in the inner part of the skin, are fixed to tip surfaces of the plurality of frustum-shaped protrusions.

Microneedle array and method for producing the same

To achieve stable administration of a medicine into a dermis by improving the operability of a device that inserts a microneedle into a skin. An impacting type applicator () for a microneedle patch is an applicator that applies a microneedle patch () to a skin includes a main body (), a spring expanding/compressing lever (), a resilient body (), a lock mechanism (), and a piercing switch (). The spring expanding/compressing lever () is movably attached to the main body (), and the microneedle patch () can be attached to a leading end of the spring expanding/compressing lever (). The resilient body () is a member that imparts a biasing force to the spring expanding/compressing lever (). The lock mechanism () is a mechanism that locks the spring expanding/compressing lever () in a state where the resilient body () exerts the biasing force on the main body (). The piercing switch () is a member that releases the engagement between the lock mechanism () and the spring expanding/compressing lever (). In addition, a biasing force imparting mechanism () further imparts a biasing force to the spring expanding/compressing lever () in a state where the spring expanding/compressing lever () is moved toward the leading end of the main body () and thereby presses the microneedle patch () against the skin.

Impacting type applicator for microneedle patch and leading end member

A multipoint-measurement strain sensor which is free of a conduction failure originated from slippage at the time of lamination and which can reduce the material cost, and a method for producing the multipoint-measurement strain sensor are provided. A multipoint-measurement strain sensorof the present invention includes a substrate film, a plurality of strain-sensing partsformed on a first main surfaceof the substrate film, routing circuitsformed, in correspondence with the respective strain-sensing parts, on a second main surfaceof the substrate film, and having outer connection terminalsnear an outer edge of the substrate film, and a conductive pasteto fill via holessuch that each of the strain-sensing partsis connected to the corresponding routing circuit

Multipoint-measurement strain sensor and method for producing the same

There are provided a substrate sheet, a plurality of design portions arranged independently from each other along a longitudinal direction of the substrate sheet and each including at least a conductive material portion, and a band-shaped static eliminating band portion extending continuously along the longitudinal direction of the substrate sheet and electrically connecting the conductive material portions in the plurality of design portions to each other.

Static eliminating sheet, static eliminating system for sheets, and simultaneous design molding method, printing method, and deposition method using static eliminating sheet

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Kyoto, Japan

Hiroyuki Nagai