Hitachi, Ltd.

Hitachi Device Engineering Corp

Hiroyuki Mouri

Makoto Kimura

Takahiro Fujioka

Shinya Kanamitsu

Shinji Tojo

Akihiko Narisawa

Yoshiyuki Tanigawa

Koji Akimoto

To provide a semiconductor device in which a thin resin film is provided on the whole margin of the principal plane of a semiconductor chip a lead is provided on the thin resin film, the lead is electrically connected with input and output electrode pads of the semiconductor chip, and the electrical joint is covered and sealed with a seal resin.

Semiconductor device and display unit using the semiconductor device and

To provide a semiconductor device in which a thin resin film is provided on the whole margin of the principal plane of a semiconductor chip, a lead is provided on the thin resin film, the lead is electrically connected with input and output electrode pads of the semiconductor chip, and the electrical joint is covered and sealed with a seal resin.

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Kunitachi, Japan

Hiroyuki Mouri