Taiyo Yuden Co., Ltd.

Hiroyuki Moteki

Takeshi Nosaki

Norihiro Arai

Jyouji Ariga

Masumi Ishii

Manabu Ozawa

Daisuke Iwai

Atsuhiro Yanagisawa

Yoshinori Shibata

Kazuya Maekawa

Michio Oshima

A method of manufacturing a multilayer ceramic capacitor includes: forming a multilayer body by alternately stacking a green sheet and a conductive paste for forming an internal electrode layer, the green sheet being mainly composed of a ceramic material having a perovskite structure that includes Ca and Zr and is expressed by a general expression ABOand containing an alkali metal, the conductive paste being mainly composed of Cu, containing a ceramic co-material and no alkali metal; and baking the multilayer body to obtain a ceramic multilayer body.

Method of manufacturing multilayer ceramic capacitor and multilayer ceramic capacitor

A multilayer ceramic capacitor includes: a multilayer chip in which each of dielectric layers and each of internal electrode layers are alternately stacked and the internal electrode layers are alternately exposed to two end faces; and external electrodes formed on the two end faces; wherein: the external electrodes have a structure in which a plated layer is formed on a ground layer including Mo; and 'M&#x2265;0.003185&#xd7;(Ew&#xd7;Et)&#x2212;is satisfied when 'Et' is a height from a bottom one of the internal electrode layers to a top one of the internal electrode layers, &#x201c;Ew' is a width of the internal electrode layers in a direction in which side faces of the multilayer chip face with each other, and &#x201c;M&#x201d; is a Mo concentration (atm %) with respect to a main component ceramic of a total of the multilayer chip and the pair of external electrodes.

Multilayer ceramic capacitor using molybdenum (Mo) ground layer and manufacturing method of the same

A multilayer ceramic capacitor includes: a ceramic multilayer structure having a structure in which each of ceramic dielectric layers and each of internal electrode layers are alternately stacked and are alternately exposed to two edge faces of the ceramic multilayer structure, a main phase of the plurality of ceramic dielectric layers having a perovskite structure that includes Ca and Zr and is expressed by a general formula ABO; and a pair of external electrodes that are formed on the two edge faces, wherein 300&#xd7;TE/TA&#x2212;12&#x2264;30 is satisfied when a volume TA is a length C&#xd7;a width C&#xd7;a thickness Cof the ceramic multilayer structure and a volume TE is a length E&#xd7;a width E&#xd7;a thickness E&#xd7;a stacked number of the plurality of internal electrode layers in a capacity region.

Multilayer ceramic capacitor, circuit substrate and manufacturing method of the same

A ceramic electronic device includes: a multilayer chip having a first and a second internal electrode layers; a first and a second external electrodes covering a first a second regions of a surface of the multilayer chip, wherein: a mark is shifted on a side of one of two end faces on an upper face; the first internal electrode layer is exposed to the first region and connected to the first external electrode; the second internal electrode layer is exposed to the second region and connected to the second external electrode; the second internal electrode is shifted further on a side of the lower face than on a side of the upper face; the second internal electrode layer is shifted further on a side of the lower face than the upper face; the second region is a region of a half of the surface on the lower face side.

Multilayer ceramic capacitor, package of multilayer ceramic capacitor and component mounting circuit substrate

A multilayer ceramic capacitor includes: a ceramic multilayer structure designated to have ceramic dielectric layers and internal electrode layers alternately stacked, the internal electrode layers being mainly composed of a transition metal other than an iron group, end edges of the internal electrode layers being alternately exposed to a first end face and a second end face; and a pair of external electrodes provided on the first end face and the second end face, wherein: the external electrodes have a base conductive layer and a first plated layer; the base conductive layer directly contacts the ceramic multilayer structure; a main component of the base conductive layer is a noble metal or a transition metal other than an iron group; and a total concentration of Si and B in a second-phase not contacting the ceramic multilayer structure is 0.3 wt % or less, in the base conductive layer.

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Takasaki, Japan

Hiroyuki Moteki