Fuji Xerox Co., Ltd.

Sony Corporation

Fujifilm Business Innovation Corp.

Ricoh Company, Ltd.

Hiroyuki Moriya

Tsuyoshi Miyamoto

Masayuki Okoshi

Akira Imai

Takako Kobayashi

Koji Horiba

Daisuke Nakayama

Daisuke Yoshino

Masahiro Oki

Yoshihiro Inaba

Yuko Iwadate

Toshio Kobayashi

Tomohito Nakajima

Hideya Katsuhara

Kiyoshi Hashimoto

Seiichi Takagi

Kazuya Hongo

Yoshitake Ogura

Kazunari Muraoka

Takashi Imai

Hideki Watanabe

Ichiro Fujiwara

Shigeru Seitoku

Shingo Ishimaru

Kazuaki Tabata

Junichi Tomonaga

Takuya Uchida

Masayuki Ookoshi

Daisuke Nakashima

Toshie Furuya

This resin composition includes: a polyolefin; carbon fibers having an average fiber length of 0.1 to 2.5 mm; a resin including at least one among an amide bond and an imide bond, the content of the resin with respect to 100 parts by mass of the polyolefin being greater than 20 parts by mass and less than or equal to 100 parts by mass; and a compatibilizer.

Resin composition and resin molded body

A resin molded article includes a first resin formed of a polyolefin, reinforcing fibers, a second resin selected from a group consisting of a resin containing at least one of an amide bond and an imide bond, a resin containing an ester bond, and a resin having a linking group containing a sulfur atom, and a compatibilizer. The absolute value of difference in melting temperature between the first resin and the second resin is 130&#xb0; C. or lower. At least a portion of the second resin forms domains in the first resin. The domains include first domains that do not contain the reinforcing fibers and second domains that contain the reinforcing fibers and that include a coating layer formed of at least a portion of the second resin on the periphery of the reinforcing fibers. The second domains include a second domain A containing one of the reinforcing fibers and a second domain B containing two or more of the reinforcing fibers.

Resin molded article

A resin composition includes a thermoplastic resin, a carbon fiber, a polyamide having at least one of a carboxy group and an amino group at a terminal thereof, in which a presence ratio of the amino group present on the terminal (terminal amino group) is higher than a presence ratio of the carboxy group present the terminal (terminal carboxy group), and a compatibilizer.

Resin composition and resin molded article

A resin composition includes a thermoplastic resin, a carbon fiber, a resin containing at least one of an amide bond and an imide bond that includes a first resin containing at least one of an amide bond and an imide bond and having such a melting temperature that a difference in melting temperature between the first resin and the thermoplastic resin is from 0&#xb0; C. to 90&#xb0; C. and a second resin containing at least one of an amide bond and an imide bond and having a melting temperature which is higher than that of the thermoplastic resin and that of the first resin, and a compatibilizer.

A resin composition includes a thermoplastic resin, a carbon fiber, a polyamide having at least one of a carboxy group and an amino group at a terminal thereof, in which a presence ratio of the carboxy group present on the terminal is higher than a presence ratio of the amino group present on the terminal, and a compatibilizer.

A resin composition for resin moldings comprises: a first resin composition containing a first polyolefin, a polyamide, carbon fibers having an average fiber length of 0.1 mm to 1 mm and a carboxylic anhydride-modified polyolefin as a compatibilizer; and a second resin composition containing a second polyolefin and organic fibers having an average fiber length of 1 mm to 20 mm, wherein, taking the total contents of the first polyolefin and the second polyolefin as 100 parts by mass, a content of the polyamide accounts for 1 part by mass to 50 parts by mass, a content of the carbon fiber accounts for 1 part by mass to 50 parts by mass, a content of the organic fibers accounts for 1 part by mass to 20 part by mass, and a content of the compatibilizer accounts for 1 part by mass to 10 parts by mass.

Resin composition for resin molding, and resin molding

Provided is a resin composition including: a thermoplastic resin; a carbon fiber; and a terminal modified resin including a main chain having at least one terminal modified with a long chain alkyl group having 8 or more carbon atoms, the main chain containing at least one of an amide bond and an imide bond.

A resin composition includes a thermoplastic resin, a carbon fiber, a resin containing at least one of an amide bond and an imide bond and having such a melting temperature that a difference in melting temperature between the resin containing at least one of an amide bond and an imide bond and the thermoplastic resin is 90&#xb0; C. or lower, and a compatibilizer.

A resin composition for resin moldings includes: a first resin composition containing a first polyolefin, a polyamide, first carbon fibers having an average fiber length of 0.1 mm to 1 mm and a carboxylic anhydride-modified polyolefin as a compatibilizer; and a second resin composition containing a second polyolefin and second carbon fibers having an average fiber length of 6 mm to 20 mm, wherein of the whole quantity of the resin composition for resin moldings, taking the total contents of the first polyolefin and the second polyolefin as 100 parts by mass, a content of the polyamide accounts for 1 part by mass to 50 parts by mass, the total contents for the first carbon fiber and the second carbon fiber account for 1 part by mass to 50 parts by mass and a content of the compatibilizer accounts for 1 part by mass to 10 parts by mass.

A resin composition contains: polyolefin; a carbon fiber; a resin containing at least one of an amide bond and an imide bond; and a compatibilizer, the resin containing at least one of an amide bond and an imide bond forms a coating layer around the carbon fiber, and a thickness of the coating layer is from 50 nm to 700 nm.

Resin composition, resin molded article, and method of preparing resin composition

A liquid developer includes a carrier liquid and a toner including a urethane-modified acrylic resin.

Liquid developer and developer cartridge

A liquid developer includes a carrier liquid and a toner particle whose surface is treated by a polyamine, wherein an amount of sodium ion to be eluted in 1 g of the toner particles is 0.04 mg or less.

Liquid developer, developer cartridge, and image forming apparatus

A resin composition including a thermoplastic resin, a glass fiber, a resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond, and a compatibilizer, wherein a part of the resin which is different from the thermoplastic resin and contains at least one of an amide bond and an imide bond forms a coating layer around the glass fiber, and wherein the thickness of the coating layer is from 50 nm to 700 nm.

A liquid developer contains a carrier liquid and a toner particle which contains a binder resin, wherein the toner particles have a content of aluminum measured by fluorescent X-ray analysis in a range of from 0.04% by weight to 0.1% by weight of total elements.

A positively chargeable toner includes at least a binder resin, and toner particles of which surfaces are modified by a polyvinylamine compound.

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Kanagawa, Japan

Hiroyuki Moriya