Threebond Co., Ltd.

Three Bond

Hiroyuki Mikuni

Vincent Daniel McGinniss

Toshiyuki Chikusa

James L White

Yuko Nishiyama

Tatsuo Fujii

Hiroshi Takeuchi

Nobuo Ohsawa

Albert R Bunk

A photocurable composition comprising (A) an &agr;-cyanoacrylate and (B) a metallocene compound comprising a transition metal of Group VIII of the periodic table and aromatic electron system ligands selected from &pgr;-arenes, indenyl, &eegr;-cyclopentadienyl. The photocurable composition may further comprise (C) a cleavage-type photoinitiator. The photocurability of the photocurable composition can be greatly improved by incorporating a cleavage type photoinitiator into the composition. Even when the composition contains a radical-polymerizable compound such as an acrylic compound, it can be rapidly cured due to the cleavage type photoinitiator contained therein. In the case where the cleavage-type photoinitiator used is a peroxide, heating can also be used to cure the composition. In the case where the cleavage type photoinitiator used is an azo compound, the composition can be foamed by regulating the addition amount of the photoinitiator or the quantity of light with which the composition is irradiated.

Photocurable composition containing an &agr;-cyanoacrylate and a metallocene compound

According to the present invention there is provided a cyanoacrylate adhesive composition having high shear bond strength, peeling bond strength and impact bond strength and superior particularly in hot-cold cycle resistance and heat resistance. The cyanoacrylate adhesive composition contains (a) a cyanoacrylate monomer, (b) an elastomer miscible or compatible with the cyanoacrylate monomer, and (c) a core-shell polymer having a core of a rubbery polymer and a shell of a glassy polymer, the core-shell polymer being compatible but not miscible with the cyanoacrylate monomer.

Cyanoacrylate adhesive composition

A method of bonding an artificial nail to a nail with a photocurable cyanoacrylate adhesive or of decorating an artificial nail or a nail using the adhesive. The adhesive comprises (A) an cyanoacrylate monomer, (B) a catalyst selected from the group consisting of a metallocene compound comprising a transition metal of Group VIII of the periodic table and aromatic electron system ligands, and a mixed catalyst consisting of a combination of a cleavage-type photoinitiator and a metallocene compound comprising a transition metal of Group VIII of the periodic table and aromatic electron system ligands, an acetylacetonatoplatinum(II) complex, and a specific metal complex which releases a nucleophilic agent upon light irradiation. The curability of the adhesive of the present invention in the bonding of an artificial nail to a nail or in the bonding of a decorative article to a nail or artificial nail is improved in the case where the adhesive has flowed out of the bonding part or has been applied thickly so as to fill (build up) the recessed part of the joint, etc.

Method of bonding or decorating artificial nail

The present invention relates to polymeric networks that can be made electrically conductive in bulk or which have a surface which is electrically conductive, and which networks exhibit resistivities in the ohm to kilo-ohm range. One aspect of the present, thermosetting invention, then, comprises an electrically conductive polymeric network comprising a cured polymeric network which contains an oxidized additive comprising one or more of an oxidizable aniline, thiophene, or pyrrole additive, which additive was oxidized with an oxidizing agent in situ in the cured polymeric network.

Electrically-conductive and ionically-conductive polymeric networks and

The present invention relates to polymeric networks that can be made electrically conductive in bulk or which have a surface which is electrically conductive, and which networks exhibit resistivities in the ohm to kilo-ohm range. One aspect of the present invention, then, comprises an electrically conductive polymeric network comprising a cured thermosetting polymeric network which contains an oxidized additive comprising one or more of an oxidizable aniline, thiophene, or pyrrole additive, which additive was oxidized with an oxidizing agent in situ in the cured polymeric network.

The present invention is directed to a non-emissive, bimodal cured polymeric network which has an onset degradation temperature that is about 100.degree. C. above the onset degradation temperature of a base polymer. The novel cured polymeric network comprises the cured reaction product of the following ingredients: (a) combination of one or more liquid carrier monomers or prepolymers which combination is reactive to form a base polymer by exposure to ultraviolet (UV) radiation in the presence of a UV photosensitizer at a temperature, T.sub.uv ; and (b) between about 10 and 100 wt-% based on ingredient (a) of a combination of one or more monomers or prepolymers which combination is reactive to form a cured high temperature stable polymer by heating at a temperature, T.sub..DELTA.. Ingredient (b) is soluble or dispersible in ingredient (a) at a temperature, T.sub.s, wherein T.sub.s is equal to or lower than T.sub.uv, and T.sub.uv is at least about 50.degree. C. lower than T.sub..DELTA..

Bimodal cured intermixed polymeric networks which are stable at high

A novel neopentyl .alpha.-cyanoacrylate composition is provided. The composition which includes neopentyl .alpha.-cyanoacrylate has superior adhesive properties even at high temperatures and is characterized by the absence of the whitening phenomenon.

.alpha.-cyanoacrylate containing adhesive composition

A novel neopentyl .alpha.-cyanoacrylate is provided. It has superior adhesive properties even at high temperatures and whitening-preventing property.

.alpha.-cyanoacrylate and adhesive composition

A silicon-containing alpha-cyanoacrylate, useful as an adhesive, having the general formula: ##STR1## wherein R.sup.1 is an alkylene group containing 1 to 6 carbon atoms; and R.sup.2, R.sup.3 and R.sup.4 are each alkyl groups containing 1 to 6 carbon atoms, is disclosed. A process for preparing the silicon-containing alpha-cyanoacrylate compound is also set forth. In this process a cyanoacetate having the structural formula ##STR2## wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are as defined above, is dehydrocondensed with formaldehyde or paraformaldehyde in the presence of a basic catalyst to produce a condensation polymer. The condensation polymer is thereupon depolymerized at elevated temperature to produce the silicon-containing alpha-cyanoacrylate.

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Sagamihara, Japan

Hiroyuki Mikuni