Waseda University

Harima Chemicals, Incorporated

Hiroyuki Kuwae

Jun Mizuno

Masami Aihara

Kosuke Yamada

Takayuki Ogawa

A bonding method is capable of realizing high bonding strength and connection reliability even at a connection part in a high temperature area by means of simple operation low temperature bonding. The method includes a first step wherein, on at least one of the bonded surfaces of two materials to be bonded having a smooth surface, a thin film of noble metal with a volume diffusion coefficient greater than that of the base metal of the material to be bonded is formed using an atomic layer deposition method at a vacuum of 1.0 Pa or higher, a second step wherein a laminate is formed by overlapping the two materials to be bonded so that the bonded surfaces of the two materials are connected through the thin film, and a third step wherein the two materials to be bonded are bonded by holding the laminate at a predetermined temperature.

Growing community of inventors

Tokyo, Japan

Hiroyuki Kuwae