Hokuriku Electric Industry Co., Ltd.

Hiroyuki Kurokawa

Ichiro Ishiyama

Kazuo Nomura

Yozo Ohara

Masaki Kato

Koji Higashi

Ichiro Nagare

Katsumi Takeuchi

Yutaka Nomura

Nobutsugu Nakanuma

A chip-like electric component such as a chip resistor is provided, which is easy to manufacture and in which cracks or fractures of an insulating substrate are unlikely to occur. A pair of surface electrodesare formed so that thicknesses of the pair of surface electrodes increase from a resistor layertoward end portionsof an insulating substratein a direction in which the pair of surface electrodesare arranged. A plating reservoir S is formed between one of the surface electrodesand an insulating protective layer. When forming at least one plated layera plated metal pools in the plating reservoir S. The at least one plated layermay work to reduce to some extent a height difference between a soldering electrode portionand the insulating protective layer

Chip-like electric component and method for manufacturing the same

A multi-layer circuit board capable of reducing an electrical resistance between circuit patterns positioned inside the circuit board and a through-hole connection conductor. A plurality of circuit patterns are superposed on each other with a plurality of insulating layers being alternately interposed therebetween in turn. A solution in which ultrafine metal particles of the independent dispersion type such as silver, gold, palladium or the like are contained in a colloid-like manner is applied so as to extend from one of lands through an inner surface of a through-hole to the other land. Then, the solution is calcined to form a metal particle film, The metal particle film is coated thereon with a conductive paste such as a resin/silver paste or the like, which is then calcined to form a conductive paste layer.

Process for manufacturing a multi-layer circuit board

A printed capacitor-mounted circuit board capable of increasing a capacity of each of printed capacitors formed on a printed board. A copper-clad laminate is arranged so as to act as an insulating substrate. The printed capacitors each include a first electrode made of a copper foil and arranged on a front surface of the copper-clad laminate. Then, a dielectric layer made of a dielectric paste is arranged on the first electrode and a second electrode made of a conductive paint is arranged on the dielectric layer.

Capacitor-mounted circuit board

Growing community of inventors

Toyama-ken, Japan

Hiroyuki Kurokawa