Denki Kagaku Kogyo Kabushiki Kaisha

Denka Company Limited

Sharp Kabushiki Kaisha Corporation

Hiroyuki Kurimura

Hayato Miyazaki

Norihiro Shimizu

Isamu Ichikawa

Gosuke Nakajima

Tomoyuki Kanai

Takeshi Oda

Jun Watanabe

Shigeru Suzuki

Kazuhiro Oshima

Yoshiyuki Kobayashi

Yoshitsugu Goto

Toshiyuki Ibayashi

Kenji Tanaka

Yukio Eda

Youhei Nakanishi

Masayuki Kanehiro

Yukihiro Morimoto

Takeshi Ootsuka

Takako Hoshino

Kenji Fukao

Takuya Amada

Koji Hashimoto

Eitaro Fukutaka

Takayuki Matsumoto

Yasunori Hayashi

Takayuki Nagumo

Yasunori Ishida

Yutaka Ogino

A method of collectively producing display panels each having an outline a part of which is curved includes a bonded substrate forming process of bonding substrates in a pair one of which has thin film patterns and forming a bonded substrate, a layering process of layering multiple bonded substratesvia curing resinand curing the curing resin, a grinding process of collectively grinding the substrates in a pair and the curing resinthat are outside the thin film pattern on each of the bonded substratesB that are layered on each other along the outline and collectively forming edge surfaces of the display panels each having the curved outline, and a separation process of separating each of the bonded substratesB that are layered on each other from the curing resin

Method of producing display panels

Provided is a jig having a structure that differs from conventional jigs and enables flat plates to be bonded while suppressing an air bubble formation. A flat-plate bonding jig is provided with the following: a first surface; a second surface that is on the opposite side of the first surface, has a plurality of suction holes for sucking a flat-plate, and is curved outward in a substantially arc shape; a main body connecting the first surface and the second surface; and a communication means that is disposed in the main body and allows the suction holes to communicate with a suction means.

Flat-plate bonding jig and method of manufacturing flat-plate laminated body

The present invention is intended to provide an adhesive composition for temporarily fixing which exhibits high adhesive strength and peeling property in water, and which is applicable to members having opaque area, and still which leaves no adhesive deposit on released members, so that it realize the excellent workability and environment. The present invention is a two-component composition for temporarily fixing members, comprising (A) a polyfunctional (meth)acrylate, (B) a mono-functional (meth)acrylate, (C) an organic peroxide, (D) a decomposition accelerator, (E) a polymerization initiator and (G) particulate matter, and composed of two-component system of a first agent and a second agent, said first agent containing at least said component (C) and said second agent containing at least said component (D), wherein cured body of said composition being used to bond members is brought into contact with water to be decomposed and release said members.

Composition and method for temporarily fixing member using same

There is provided an ultrasonic cleaning method capable of reliably cleaning to remove adhesive components even when the adhesive components adhere to a rigid substrate. The ultrasonic cleaning method comprises performing the following steps (1) to (5), in this order: (1) a step of immersing a rigid substrate having an adhesive adhering to a surface thereof in an aromatic alcohol-based cleaning liquid at 25 to 60&#xb0; C.; (2) a step of cleaning off the adhesive on the rigid substrate by ultrasonic oscillation while keeping the state where the rigid substrate is immersed in the step (1); (3) a step of subsequently immersing the rigid substrate in a glycol ether-based cleaning liquid at 25 to 60&#xb0; C.; (4) a step of rinsing off the aromatic alcohol-based cleaning liquid adhering to the rigid substrate by ultrasonic oscillation while keeping the state where the rigid substrate is immersed in the step (3); and (5) a step of subsequently rinsing off the glycol ether-based cleaning liquid and aromatic alcohol-based cleaning liquid adhering to the rigid substrate with water.

Ultrasonic cleaning method and apparatus

Provided is a method of manufacturing a translucent rigid substrate laminate, which method can improve position precision. Further provided is a translucent rigid substrate bonding apparatus that contributes to improvement of the position precision while increasing production efficiency of a plate-shaped product. In the method of manufacturing a translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent including (A) polyfunctional (meth)acrylate, (B) monofunctional (meth)acrylate and (C) a photopolymerization initiator therebetween, the entire fixing agent spreading between the both translucent rigid substrates is cured every time the translucent rigid substrates are bonded.

Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus

Provided is a method of manufacturing a translucent rigid substrate laminate, which method can improve position precision while increasing production efficiency. Further provided is a translucent rigid substrate bonding apparatus that contributes to improvement of the position precision while increasing production efficiency of a plate-shaped product. In the method of manufacturing a translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent including (A) polyfunctional (meth)acrylate, (B) monofunctional (meth)acrylate and (C) a photopolymerization initiator therebetween, only the fixing agent present in outer peripheral portions of both translucent rigid substrates is cured for provisional fastening.

Provided is a method of manufacturing a translucent rigid substrate laminate to improve a positional precision. Further, a translucent rigid substrate bonding apparatus contributing to improvement of the positional precision while increasing production efficiency of a plate-shaped product is provided. In the method of manufacturing the translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent therebetween, the entire fixing agent interposed and spreading between both translucent rigid substrates is cured everytime the translucent rigid substrates are bonded.

There is provided a method by which it is possible to precisely process a translucent rigid substrate laminate. The method for processing a translucent rigid substrate laminate includes the steps of: preparing a translucent rigid substrate laminate by adhering two or more translucent rigid substrates with photocurable adhering agent; fixing the laminate to a cradle with predetermined adhesive; performing processing A for cutting the laminate, which is fixed to the cradle, in a thickness direction and forming a desired number of divided translucent rigid substrate laminates, or performing desired outline processing B on the laminate which is fixed to the cradle; and peeling the processed translucent rigid substrate laminate from the cradle by applying external force without heating the translucent rigid substrate laminate at 40&#xb0; C. or more.

Method for processing transluscent rigid substrate laminate and method for manufacturing plate shaped product

Provided is a method for disassembling a bonded body, whereby the bonded body can be easily disassembled and peeled. The method for disassembling a bonded body formed by bonding substrates with an adhesive comprises irradiating light having a wavelength of 280 nm or more such that irradiation energy is 1000-5000000 mJ/cmat a wavelength of 365 nm while heating the bonded body to 150&#xb0; C.-300&#xb0; C.

Method for disassembling bonded body, and adhesive

Provided is a method for manufacturing a translucent rigid substrate laminate which can improve a thickness precision while decreasing the risk of fractures. In the method for manufacturing a translucent rigid substrate laminate according to the present invention, translucent rigid substrates are placed opposite to each other such that bonding surfaces thereof are parallel to each other, both rigid substrates are brought toward each other while being kept parallel, the both rigid substrates are preliminarily bonded using a photo-curable fixing agent, the bonded translucent rigid substrates are roll-pressed, and the fixing agent is then cured.

Method of manufacturing translucent rigid substrate laminate

Provided is a method of processing a translucent rigid substrate laminate, whereby it becomes possible to maintain peeling properties and good appearance of the translucent rigid substrate laminate during the processing of the translucent rigid substrate laminate even when a process such as transportation and storage is included in the method. The method of processing a translucent rigid substrate laminate comprises a step 1 for producing a translucent rigid substrate laminate in which at least two translucent rigid substrates are bonded to each other with a photocurable adhering agent; a step 2 for maintaining the translucent rigid substrate laminate, which has been produced in step 1 or which has been subjected to a shape processing subsequent to step 1, under predetermined temperature management conditions and transporting and/or storing the translucent rigid substrate laminate while maintaining the translucent rigid substrate laminate under the above-mentioned conditions; and a step 3 for peeling the translucent rigid substrate laminate which has been subjected to the shape processing or has not been subjected to the shape processing subsequent to step 2.

Method of processing translucent rigid substrate laminate, and process of manufacturing plate-shaped product employing the method

Provided is an adhesive (meth)acrylic resin composition being high in adhesiveness and capable of affording an adhered body which can be used at high temperatures of 250&#xb0; C. or higher, and possessing low outgassing property and heat resistance. A (meth)acrylic resin composition including (A) a polyfunctional (meth)acrylate, and (B) a photopolymerization initiator that exhibits a mass loss on heating of 15% by mass or less when increasing temperature from 30&#xb0; C. to 250&#xb0; C. at a temperature increase rate of 10&#xb0; C./min. under nitrogen flow, wherein the glass transition temperature of a cured body obtained from the composition is 250&#xb0; C. or higher.

(Meth)acrylic resin composition

Disclosed is a method for separating a bonded body, whereby the bonded body can be separated easily. Specifically disclosed is a method for separating bonded bodies that includes a step that irradiates excimer light with a central wavelength of 1 to 300 nm on to a bonded body that has been formed by using an adhesive composition to bond substrates together, which includes and is formed by one type or two or more types of meth (acrylate) that have one or more (meth)acryloyl groups, and by hardening of said adhesive composition. At least one of the substrates is permeable to the excimer light.

Method for separating bonded bodies using excimer light irradiation

Provided is a method of manufacturing a translucent rigid substrate laminate to improve a positional precision while increasing production efficiency. Further, a translucent rigid substrate bonding apparatus contributing to improvement of the positional precision while increasing production efficiency of a plate-shaped product is provided. In the method of manufacturing the translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent therebetween, only the fixing agent present on an outer boundary portion of both translucent rigid substrates is cured for provisional fastening.

To provide a resin composition for e.g. a temporary fixing adhesive which has a high adhesive strength and which is readily removable in water, and a temporary fixing method for a member by means thereof. A resin composition comprising component (A): N,N-diethylacrylamide and/or N-isopropylacrylamide, component (B): at least one member selected from the group consisting of a homopolymer of N-vinyl-2-pyrrolidone, a homopolymer of N,N-dimethylacrylamide, a homopolymer of N,N-diethylacrylamide, a homopolymer of acryloylmorpholine, a homopolymer of N-isopropylacrylamide, and a copolymer of at least two monomers selected from the group consisting of N-vinyl-2-pyrrolidone, N,N-dimethylacrylamide, N,N-diethylacrylamide, acryloylmorpholine and N-isopropylacrylamide, and component (C): a polymerization initiator. A temporary fixing method for a member and a surface protecting method for a member, by means the resin composition.

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Shibukawa, Japan

Hiroyuki Kurimura