Shinko Electric Industries Co., Ltd.

Hiroyuki Komatsu

Shoji Koizumi

Akira Takahashi

Tatsuya Inatsugu

Hideki Matsuzawa

Hideki Toya

Yoshihisa Nagamine

Akinobu Abe

In a lead frame which comprises lead portions extended from a frame portion toward an inside like a teeth of a comb and each having a top end portion, a center portion, and a base portion connected to the frame portion, the top end portion and the center portion are connected via a first constriction portion, and the center portion and the base portion are connected via a second constriction portion, and thickness of both side surface portions of the center portion and the top end portion of each lead portion are set thinner than thickness of remaining portions of each lead portion.

Lead frame and method of manufacturing the same

A plate-shaped member having a recess useful for an electronic part and particularly for a heat dissipation plate for a semiconductor element, the inside and outside of which member are flat. The plate-shaped member has a recess defined by a bottom wall portion and a side wall portion extending from a peripheral end of the bottom wall portion formed without bending a metallic plate, by press forming. The upper and lower surfaces of the side wall and the bottom wall are formed in parallel and flat, and the thickness of the bottom wall is smaller than the thickness of the metallic plate and, further, the thickness, between the upper surface and the lower surface, of the side wall is larger than the thickness of the metallic plate.

Method of manufacturing a plate-shaped member having a recess and press die for forming recesses

A semiconductor module includes a circuit board provided with a plurality of attachment holes and semiconductor elements or semiconductor devices mounted on the circuit board and a pair of metallic plates. The circuit board is disposed, between the pair of metallic plates, in such a manner that spaces are defined between the circuit board and the pair of metallic plates for accommodating the semiconductor elements or semiconductor devices when the pair of metallic plates are attached to the circuit board. One of the metallic plates is provided at positions corresponding to the attachment holes with through holes and the other metallic plate is provided at positions corresponding to the attachment holes with tubular projections having a length larger than a sum of a thickness of the circuit board and a thickness of the one metallic plate. The tubular projections are inserted into the attachment holes and the through holes and tip ends of the tubular projections are enlarged to firmly attach the pair of metallic plates to the circuit board.

Semiconductor module and heat sink used in such module

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Nagano, Japan

Hiroyuki Komatsu