Ibiden Company Limited

Hiroyuki Kobayashi

Kiyotaka Tsukada

Mitsuhiro Kondo

Masaru Takada

Hisashi Minoura

Kenji Chihara

Yoshikazu Ukai

Yoshihiro Kodera

Junji Furuya

Yoshihide Tohyama

Yasuyoshi Okuda

A holding apparatus includes a first holding unit including at least two supporting rollers rotatable around rotation shafts which extend substantially parallel with each other; a second holding unit including at least one supporting roller rotatable around a rotation shaft; and at least one holding mechanism having the first holding unit and the second holding unit. The rotation shafts of the supporting rollers of the first holding unit and the rotation shaft of the supporting roller of the second holding unit are substantially in parallel with each other. By moving at least one of the first holding unit and the second holding unit, an object to be held is held between the first holding unit and the second holding unit by using the supporting rollers.

Holding apparatus and method for manufacturing honeycomb structure

A solder resist comprising a thermosetting resin is printed on a surface of an insulating board () having a conductor circuit (). The solder resist is then heat-cured to form an insulating film () having a low thermal expansion coefficient. A laser beam () is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (), whereby the conductor circuit () is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

Method of manufacturing printed wiring board

In a printed wiring board, an odd number (n) of conductive layers (-) and insulating layers (-) are alternately laminated upon another. The first conductive layer () is constituted as a parts connecting layer and the n-th conductive layer () is constituted as an external connecting layer which is connected to external connecting terminals (). The second to (n&#x2212;1)-th conductive layers () are constituted as current transmitting layers for transmitting internal currents. The surface of the n-th conductive layer () is coated with the outermost n-th insulating layer () in a state where the external connecting terminals () are exposed on the surface. It is preferable to constitute the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.

Printed wiring board and method for manufacturing the same

A method of producing a printed wiring board comprising innerlayer conductor circuits among insulating layers and blind via-holes formed by irradiating laser beams from the outermost surface of the insulating layer toward the innerlayer conductor circuit. A central portion of the innerlayer conductor circuit contains a previously formed opening hole located at the bottom of the blind via-hole. Thereafter, a metal plated film is formed on surfaces of the innerlayer conductor circuits and the blind via-holes.

Method of manufacturing a printed wiring board having a previously formed opening hole in an innerlayer conductor circuit

A honeycomb structure mounting base includes a mounting member having a structure mounting surface configured to contact an entire end face of a honeycomb structure including a periphery of the honeycomb structure; a preliminary mounting member having a preliminary mounting surface configured to have the honeycomb structure placed thereon before placement of the honeycomb structure on the mounting member; and an elevating mechanism configured to move the preliminary mounting member up and down in relation to the mounting member. The preliminary mounting surface is parallel to the structure mounting surface. The preliminary mounting surface has a shape allowing an entire periphery of the preliminary mounting surface to exist inside a periphery of the end face of the honeycomb structure in a case of superimposing the preliminary mounting surface onto an end face of the honeycomb structure.

Honeycomb structure mounting base and honeycomb structure inspection apparatus

In a printed wiring board, an odd number (n) of conductive layers (-) and insulating layers (-) are alternately laminated upon each other. The first conductive layer () is a parts connecting layer and the n-th conductive layer () is an external connecting layer which is connected to external connecting terminals (). The second to (n&#x2212;1)-th conductive layers () are current transmitting layers for transmitting internal currents. The surface of the n-th insulating layer () in a state where the external connecting terminals () are exposed on the surface. It is preferable to make the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.

Printed wiring board and method of manufacturing the same

In the production of a printed wiring board comprising innerlayer conductor circuits arranged among insulating layers and blind via-holes formed from an outermost surface of the insulating layer toward the innerlayer conductor circuit, an opening hole is previously formed in a central portion of the innerlayer conductor circuit located at the bottom of the blind via-hole , and laser beams are irradiated from the outermost surface of the insulating layer to form the blind via-holes . Thereafter, a metal plated film is formed on surfaces of the innerlayer conductor circuits and the blind via-holes

Printed wiring board having throughole and annular lands

A solder resist comprising a thermosetting resin is printed on a surface of an insulating board ( ) having a conductor circuit ( ). The solder resist is then heat-cured to form an insulating film ( ) having a low thermal expansion coefficient. A laser beam ( ) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening ( ), whereby the conductor circuit ( ) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

This invention relates to a solder member for external connection joined to a connection terminal formed on a surface of a printed wiring board corresponding to a conductor pattern and having an electroless Ni/Au plated layer, wherein the solder member is a ball-shaped solder containing finely powdered copper and has an excellent joint strength to the connection terminal.

Soldering member for printed wiring boards

A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (,) having a conductor circuit (,). The solder resist is then heat-cured to form an insulating film (,) having a low thermal expansion coefficient. A laser beam (,) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (,), whereby the conductor circuit (,) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

A printed wiring board which has a conductor circuit (,) on an insulating substrate (,) and a surface insulating layer (,) formed on the surface of the substrate (,) including the surface of the conductor circuit (,). Part of the conductor circuit (,) has an exposed conductor section (,) having an exposed surface, and a surface insulating layer (,) around the conductor section (,) forms a recessed section at the same level of the surface of the conductor section (,) or lower than the surface. It is preferable to form a black or white solder resist layer on the surface insulating layer.

Growing community of inventors

Ogaki, Japan

Hiroyuki Kobayashi