Hitachi Chemical Company, Ltd.

Hitachi-High-Technologies Corporation

National Institute of Advanced Industrial Science and Technology

Hitachi, Ltd.

Hiroyuki Kawakami

Takayuki Saito

Tohru Kikuchi

Takuya Imai

Masao Suzuki

Teiichi Inada

Keiji Sumiya

Takayuki Matsuzaki

Masaaki Yasuda

Yasushi Shimada

Kazuhiro Zama

Hiroyuki Kuriya

Yusuke Miyazaki

Kazuo Takahashi

Keiichi Hatakeyama

Takeo Tomiyama

Tetsurou Iwakura

Youichi Hosokawa

Yuuko Tanaka

Noriyuki Aizawa

Shingo Tanaka

Daichi Takemori

Naoki Tomori

Shoichi Sasaki

Katsuyasu Niijima

Yutaka Nakahara

Kazuhiko Sato

Norihide Saho

Hisashi Isogami

Yoshihiro Nomura

Hiroshi Takahashi

Taisei Uede

Yasuo Yamashita

Masaki Yagi

Youji Katayama

Kouji Yamazaki

Kenichi Tominaga

Reiko Yamaguchi

Disclosed is an effective method for producing an ester compound at a reaction temperature lower than that of conventional methods, and with a high yield, even when inexpensive formic acid ester is used as a starting material. A method for producing an ester compound, the method comprising the step of reacting an organic compound having at least one unsaturated carbon bond in the molecule, and a formic acid ester in the presence of a catalyst system containing: a ruthenium compound; a cobalt compound; and a halide salt.

Method for producing ester compound by reacting an unsaturated organic compound and a formic acid ester in the presence of a catalyst system containing a ruthenium compound, a cobalt compound and a halide salt

A sealing film which includes a resin layer having a flow within the range of 150 to 1800 &#x3bc;m at 80&#xb0; C., or having a resin layer with a viscosity within the range of 10000 to 100000 Pa&#xb7;s in a B-stage state at 50 to 100&#xb0; C. in thermosetting viscoelasticity measurement, and containing: (A) both (a1) a high-molecular-weight component including crosslinking functional groups and having a weight-average molecular weight of 100,000 or more and a Tg within the range of &#x2212;50 to 50&#xb0; C., and (a2) a thermosetting component including an epoxy resin as a main component, (B) a filler having an average particle size within the range of 1 to 30 &#x3bc;m, and (C) a colorant, as well as a manufacturing method thereof and a semiconductor device using the same.

Sealing film and a semiconductor device using the same

An object of the present invention is to provide a heat-resistant resin paste that enables the formation of a precise pattern, exhibits excellent adhesiveness, heat resistance and flexibility, and enables a shortening of the production time, as well as a method for producing thereof. The present invention relates to a heat-resistant resin paste, comprising a first organic solvent (A1), a second organic solvent (A2) that comprises a lactone, a heat-resistant resin (B) that is soluble in a mixed organic solvent of (A1) and (A2), and a heat-resistant resin filler (C) that is soluble in (A1) but insoluble in (A2), wherein (C) is dispersed within a solution comprising (A1), (A2) and (B).

Heat-resistant resin paste and method for producing same

Provided is a heat-resistant resin paste excellent in heat resistance, flexibility, printability and viewability. A heat-resistant resin paste containing a first organic solvent (A1), a second organic solvent (A2) containing a lactone, a heat-resistant resin (B) soluble in a mixed solvent of the solvents (A1) and (A2), a heat-resistant resin filler (C) insoluble in the mixed organic solvent of the solvents (A1) and (A2), and a pigment (D), wherein the components (C) and (D) are dispersed in a solution containing the solvents (A1) and (A2) and the component (B).

Heat-resistant resin paste

A method for sealing electrodes on a semiconductor device using a sealing film which includes a resin layer having a flow within the range of 150 to 1800 &#x3bc;m at 80&#xb0; C., or having a resin layer with a viscosity within the range of 10,000 to 100,000 Pa&#xb7;s in a B-stage state at 50 to 100&#xb0; C. in thermosetting viscoelasticity measurement, and containing: (A) both (a1) a high-molecular-weight component including crosslinking functional groups and having a weight-average molecular weight of 100,000 or more and a Tg within the range of &#x2212;50 to 50&#xb0; C. and (a2) a thermosetting component including an epoxy resin as a main component, (B) a filler having an average particle size within the range of 1 to 30 &#x3bc;m, and (C) a colorant.

A novel tricyclodecane monomethanol monocarboxylic acid and derivatives thereof, which can be raw materials for highly heat-resistant alicyclic polyesters, are provided. A tricyclodecane monomethanol monocarboxylic acid represented by the following formula (I) and derivatives thereof. 

Tricyclodecane monomethanol monocarboxylic acid and derivatives thereof

Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for producing an adhesive composition, including mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film including the above-mentioned adhesive composition formed into a film; a substrate for mounting a semiconductor including a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which includes the above-mentioned adhesive film or the substrate for mounting a semiconductor.

Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device

Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer

A laser beam oscillated from a laser source is folded in its path by first and second plane mirrors and enters a beam expander. The surface of each plane mirror is deteriorated with illumination by the laser beam and the reflectance is reduced. To avoid a light quantity of the laser beam entering the beam expander from being reduced below a reference value, when the laser beam is illuminated over a certain time, a position on each of the first and second plane mirrors at which the laser beam is illuminated is changed by a structure for rotating and/or translating a reflecting surface of each plane mirror on a plane, which includes the plane mirror, while an optical axis is kept same. Thus, the useful life of each plane mirror can be prolonged without displacing the optical axis.

Optical defect inspection apparatus

An unsaturated polyester resin composition capable of affording a molded product having a small cured volume shrinkage, a superior dimensional stability, a surface quality and a high hardness, a sheet-form molding material using the composition and a process for producing a fiber-reinforced plastic molded product are provided, which composition comprises a saturated polyester obtained by reacting a saturated dibasic acid component containing 20% by mol or more of adipic acid with a saturated glycol component and having a number average molecular weight of 4,000 or higher and an acid value of 2 to 8 KOH mg/g, an unsaturated polyester and an ethylenic unsaturated monomer; which sheet-form molding material has the unsaturated resin composition together with a fiber reinforcing material placed between two films.

Unsaturated polyester resin composition and sheet-form molding material

A plurality of cryopumps are installed in each of a plurality of neutral beam injection apparatuses disposed around a nuclear fusion apparatus. The cryopanels of each of the cryopumps are refrigerated by a small helium refrigerating machine. Since the cryopanels are refrigerated from room temperature with cold liquid nitrogen used for refrigerating a heat shield plate, then a small helium refrigerating machine and finally cold liquid helium itself, various valves and a small helium refrigerating machine are disposed. This permits refrigeration of a plurality of cryopumps within a short time, thereby saving the power consumption and improving the operating reliability of a refrigeration system.

Cryogenic refrigeration system and refrigeration method therefor

A phenolic polymer obtained by reacting a phenolic compound with a bis(hydroxyalkyl)benzene, followed by alkylation of ortho positions or para position with respect to the hydroxyl group of the terminal phenol groups of the produced polymer is suitable for use as a heat resistant antioxidant for thermoplastic resins.

Phenolic polymer and production thereof

A phenolic polymer obtained by reacting a phenolic compound with a bis(hydroxyalkyl)benzene, followed by alkylation of ortho positions or para position with respect to the hydroxyl group of the terminal phenol groups of the produced polymer is suitable for use as a heat resistant antioxidant for thermoplastic resins

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Hitachi, Japan

Hiroyuki Kawakami