Murata Manufacturing Co., Ltd.

Hiroyuki Kani

Tomohiro Sano

Yukiya Yamaguchi

Morio Takeuchi

Motoji Tsuda

Atsushi Horita

Yusuke Naniwa

Jin Yokoyama

Sho Matsumoto

Syunsuke Kido

Takuma Kuroyanagi

Assuming transmission signals in different frequency bands are simultaneously transmitted, the isolation lowering is suppressed. A radio frequency module includes a first power amplifier, a second power amplifier, a first switch, a second switch, a third switch, and a mounting substrate. The first switch, the second switch, and the third switch are configured to be capable of simultaneously connecting the first power amplifier and the second power amplifier to an antenna terminal. The first switch is disposed between the second switch and the third switch in plan view of the mounting substrate from a thickness direction. The second switch and the third switch are disposed on the same main surface out of the first main surface and the second main surface of the mounting substrate.

Radio frequency module and communication device

The total sum of wiring lengths between reception filters and low-noise amplifiers is reduced. A high frequency module includes a mounting board, a plurality of inductors, a plurality of reception filters, and an IC component. The plurality of inductors are mounted on a first main surface of the mounting board. The plurality of reception filters are mounted on the first main surface of the mounting board. The IC component is mounted on a second main surface of the mounting board and includes a low-noise amplifier. A rectangular region in which the plurality of inductors are positioned overlaps with the IC component when viewed in plan from a thickness direction of the mounting board. An electronic component that is closest to each of three or more sides out of four sides of the rectangular region is at least one of the plurality of reception filters.

High frequency module and communication apparatus

In simultaneous communication using multiple frequency bands, the degradation in the communication quality is suppressed. The radio-frequency front-end circuit () includes an antenna terminal (), a transmit filter (), a receive filter, a transport filter, a switch (), and a phase adjusting circuit (). The switch () is capable of connecting the antenna terminal () to the transmit filter () or the receive filter and the transport filter simultaneously. The transmit filter () is disposed on a transmission path (T). The receive filter is disposed on a reception path. The transport filter is disposed on a transport path. The phase adjusting circuit () is disposed on at least one of paths, the transmission path (T), the reception path, and a reception/transmission path.

Radio-frequency front-end circuit and communication apparatus

A radio-frequency module includes a switch performing switching of the connection between a common terminal and a selection terminal, a reception filter having a reception band in a band A as a passband, a transmission filter that has a transmission band in a band B as a passband and has an output terminal connected to the selection terminal, a filter that has the transmission band in a band B as an attenuation band and has an input terminal connected to the selection terminal, a reception path which connects the selection terminal and an input terminal of the reception filter and on which the filter is disposed, a bypass path which connects the selection terminal and the input terminal of the reception filter and on which no filter is disposed, and a transmission path which connects the selection terminal and a transmission terminal and on which the transmission filter is disposed.

Radio-frequency module and communication device

A radio-frequency module includes a module substrate. The module substrate includes a first principal surface; a second principal surface on a side of the module substrate that is opposite to the first principal surface; a third principal surface that is recessed toward the first principal surface from the second principal surface in a plan view of the second principal surface; a recessed region in which the third principal surface is a bottom surface; and a protruding region located on an outer periphery of the recessed region, in a plan view of the second principal surface, wherein the protruding region has a via conductor disposed therein, the via conductor extending in a direction perpendicular to the second principal surface and having an end exposed on the second principal surface.

A radio-frequency module includes a transmission path which has one end connected to a transmission terminal and on which a transmission signal in Band A is transmitted; a reception path () which has one end connected to a reception terminal (B) and on which a reception signal in Band B is transmitted; a reception path () which has one end connected to a reception terminal (C) and on which a reception signal in Band C is transmitted; a switch () having a common terminal () and selection terminals (and); and a switch () having a common terminal () and selection terminals (and).

Radio-frequency module and communication apparatus

A front-end circuit includes a power amplifier circuit configured to amplify power of multiple transmission waves having different frequency bands, a transmission filter provided between the power amplifier circuit and an antenna and configured to pass a predetermined transmission frequency band of an output signal of the power amplifier circuit, a switch provided between the power amplifier circuit and the antenna, and a matching circuit. In accordance with switching of whether the matching circuit is connected, an insertion loss in a frequency band of an intermodulation distortion within a communication band in an intra-band carrier aggregation mode is increased as compared to an insertion loss in a frequency band of an intermodulation distortion within the communication band in a single mode.

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Kyoto, Japan

Hiroyuki Kani