Murata Manufacturing Co., Ltd.

Hiroyuki Kanbara

Rikiya Sano

Michiaki Iha

Keiichi Yoshinaka

Masahiro Hayashi

Shuuichi Towata

An inductor component comprising an element body; a helically wound coil disposed in the element body; and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a plurality of insulating layers and a mark layer constituting a portion of an outer surface of the element body, and a K abundance ratio (atom %) in the mark layer is higher than a K abundance ratio (atom %) in the insulating layers.

Inductor component

The present disclosure provides a coil component including an element assembly containing a filler and a resin material, a coil portion composed of a coil conductor embedded in the element assembly, and a pair of outer electrodes electrically coupled to the coil conductor. A relatively thin first conductor layer and a relatively thick second conductor layer are stacked in the coil conductor.

Coil component

A photosensitive glass paste contains a photosensitive organic component, and an inorganic component containing a glass powder and a ceramic filler. The glass powder contains a glass powder having a crystallization point. The difference between the crystallization point and the softening point of the glass powder having a crystallization point is from 85&#xb0; C. to 180&#xb0; C. The glass powder having a crystallization point is preferably a SiO&#x2014;BO&#x2014;BaO&#x2014;ZnO&#x2014;AlO&#x2014;MgO&#x2014;LaOglass powder.

Photosensitive glass paste, electronic component, and method for producing electronic component

A photosensitive glass paste contains a photosensitive organic component and an inorganic component containing a glass powder having a high softening point, a glass powder having a low softening point, and a ceramic filler. The ceramic filler has a thermal expansion coefficient of 10&#xd7;10/&#xb0; C. to 16&#xd7;10/&#xb0; C., the inorganic component contains 30% to 50% by volume of the ceramic filler, and the inorganic component contains 0.5% to 10% by volume of the glass powder having a low softening point.

Photosensitive glass paste and electronic component

A method for forming a thick film pattern forms a thick film pattern having a large thickness, a high hardness, and a high aspect ratio and exhibiting high dimension precision and high shape precision. In the method, a photosensitive paste including an inorganic powder, a photosensitive monomer, and a photopolymerization initiator and containing substantially no polymer is applied to a support so as to form a photosensitive paste film. The resulting photosensitive paste film is subjected to an exposure treatment and, thereafter, development is conducted so as to form a predetermined thick film pattern. Alternatively, a photolithography photosensitive paste including an inorganic powder, a photosensitive monomer, a photopolymerization initiator, and a polymer is used, wherein a ratio (weight ratio) of the photosensitive monomer to a total amount of the photosensitive monomer and the polymer is about 0.86 or more.

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Nagaokakyo, Japan

Hiroyuki Kanbara