Dowa Electronics Materials Co., Ltd.

Central Research Institute of Electric Power Industry

Other

Hiroyuki Kado

Masahiro Kojima

Michiharu Ichikawa

Masakazu Kawahara

Masatoyo Shibuya

Kanako Miyashita

Mitsuhiro Ohtani

Nobuyuki Kirihara

Hiroyuki Kawamura

Keisuke Sumida

Masaki Aoki

Shigeo Suzuki

The present invention provides a Bi2223 based thick film that does not peel off when a thermal or a mechanical shock is applied to a base or an oxide superconductor thick film or the like in the middle of a manufacturing process and a method of manufacturing the same. An oxide superconductor pastehaving a mixing ratio of Bi2212 composition is applied to a basedried, burned, and thereafter burned at a temperature approximate to its melting point to obtain a partially molten layer. Next, an oxide superconductor pastehaving a mixing ratio of Bi2223 composition is applied to the partially molten layer, dried, burned, compressed by a CIP, and thereafter repeatedly burned and compressed for a predetermined number of times to obtain the basehaving a desired superconductor thick filmformed thereon.

Oxide superconductor thick film and method for manufacturing the same

To provide an oxide superconductor thick film formation method that can enhance adhesiveness of a Bi2223 thick film to a body to be processed on which the Bi2223 thick film is formed, and increase a cross-sectional area of the Bi2223 thick film, without a decrease in Jc of the Bi2223 thick film. A mixture of a compound oxide having composition Bi2212 and Pb is applied to a surface of the body to be processed, and burned to form a first thick film. An oxide superconductor thick film expressed by a general formula (Bi, Pb)SrCaCuO(where &#x2212;0.1&#x2266;a&#x2266;0.5) is formed on the first thick film.

Method of forming oxide superconductor thick film

The present invention provides an oxide superconductor thick film which is formed on a substrate or a board and has a high Jc and Ic and a method for manufacturing the same. Predetermined amounts of materials containing elements of Bi, Pb, Sr, Ca and Cu are weighed, mixed and subjected to steps of calcining, milling, and drying, and thereafter an organic binder and an organic vehicle are added thereto to prepare a (Bi, Pb)SrCaCuOsuperconductive paste, which is applied to the surface of a substrate or a board in a thickness of 260 &#x3bc;m or more and dried. Thereafter, the paste is first subjected to burning at temperatures of 835&#xb0; C. to 840&#xb0; C. for 100 hours, then pressurization, and further burning at temperatures of 835&#xb0; C. to 840&#xb0; C. for 100 hours, thereby preparing an oxide superconductor thick film having a film thickness of 130 &#x3bc;m or more having a high Jc and Ic.

Method of manufacturing oxide superconductor thick film

The present invention provides an oxide superconductor thick film which is formed on a substrate or a board and has a high Jc and Ic and a method for manufacturing the same. Predetermined amounts of materials containing elements of Bi, Pb, Sr, Ca and Cu are weighed, mixed and subjected to steps of calcining, milling, and drying, and thereafter an organic binder and an organic vehicle are added thereto to prepare a (Bi, Pb) Sr Ca Cu O , superconductive paste, which is applied to the surface of a substrate or a board in a thickness of 260 &mgr;m or more and dried. Thereafter, the paste is first subjected to burning at temperatures of 835&deg; C. to 840&deg; C. for 100 hours, then pressurization, and further burning at temperatures of 835&deg; C. to 840&deg; C. for 100 hours, thereby preparing an oxide superconductor thick film having a film thickness of 130 &mgr;m or more having a high Jc and Ic.

The present invention intends to provide a manufacturing method for a PDP that can continuously apply phosphor ink for a long time and can accurately and evenly produce phosphor layers even when the cell construction is very fine. To do so, phosphor ink is continuously expelled from a nozzle while the nozzle moves relative to channels between partition walls formed on a plate so as to scan and apply phosphor ink to the channels. While doing so the path taken by the nozzle within each channel between a pair of partition walls is adjusted based on position information for the channel. When phosphor particles is successively applied to a plurality of channels, phosphor ink is continuously expelled from the nozzle even when the nozzle is positioned away from the channels. The phosphor ink is composed of: phosphor particles that have an average particle diameter of 0.5 to 5 &mgr;m; a mixed solvent in which materials selected from a group consisting of terpineol, butyl carbitol acetate, butyl carbitol, pentandiol, and limonene are mixed; and a binder that is an ethylene group polymer or ethyl cellulose containing at least 49% of ethoxy group (&mdash;OC H ) cellulose molecules. After dispersion a charge-removing material is added to the phosphor ink.

Plasma display panel manufacturing method for manufacturing a plasma display panel with superior picture quality, a manufacturing apparatus and a phosphor ink

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Yokosuka, Japan

Hiroyuki Kado