Showa Denko Materials Co., Ltd.

Other

Resonac Corporation

Hiroyuki Izawa

Tetsuyuki Shirakawa

Tatsuya Kumada

Shohei Yamazaki

Toshiyuki Sugimoto

Takuya Mori

Takahiro Fukui

Kenta Kikuchi

A method for classifying solder particles includes: a first step of forming an electric field between a first electrodeand a second electrodeincluded in an electrostatic attraction device, the first electrodehaving a disposition part having electrostatic diffusivity or electrical conductivity, the second electrodehaving an attraction parthaving electrical insulation properties, which faces the disposition part and is provided with a plurality of opening partsopened to the disposition part side, so as to cause solder particles P disposed on the disposition part to be electrostatically attracted to the attraction part; a second step of removing solder particles Pattracted to areas other than the opening partsof the attraction part; and a third step of collecting solder particles Paccommodated in the opening parts, from the attraction partthat has been subjected to the second step.

Solder particle classifying method, solder particle, solder particle classifying system, adhesive composition, and adhesive film

A method of producing a connected body, containing: disposing an adhesive film between a first electronic member having a first electronic electrode and a second electronic member having a second electrode; and pressure-bonding the second electronic member to the first electronic member via the adhesive film so that the second electrode is electrically connected to the first electrode; wherein the first electronic member has an indented surface, the first electrode is provided in a depressed portion of the indented surface, the second electrode has a substantially flat surface having an area larger than an area of the first electrode, the adhesive film contains: first conductive particles that are dendritic conductive particles; and second conductive particles containing a non-conductive core and a conductive layer provided on the core, and the second conductive particles have an average particle diameter of not less than a depth of the depressed portion.

Connector production method and adhesive film

A method for dispersing conductive particles includes: forming an electric field between a first electrode and a second electrode of an electrostatic adsorption device including the first electrode including a disposition part having electrostatic diffusivity or conductivity on which particles are disposed and the second electrode including an adsorption part having electrostatic diffusivity or conductivity and facing the disposition part, to cause a blend particle in which the conductive particles each having a particle size smaller than a particle size of an intermediate particle are attached to the intermediate particle and which is disposed on the disposition part, to reciprocate between the disposition part and the adsorption part, and to cause the conductive particles to be adsorbed onto the adsorption part.

Method for dispersing conductive particles, and electrostatic adsorption device

One aspect of the present invention is an adhesive film comprising: a first adhesive layer comprising a first adhesive component, a first conductive particle that is a dendritic conductive particle, and a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body; and a second adhesive layer comprising a second adhesive component, wherein a volume proportion of the second adhesive component in the second adhesive layer is larger than a volume proportion of the first adhesive component in the first adhesive layer.

Adhesive film

One aspect of the present invention is an adhesive film comprising a first adhesive layer comprising a first conductive particle that is a dendritic conductive particle; and a second adhesive layer containing a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body.

Growing community of inventors

Tokyo, Japan

Hiroyuki Izawa