Sony Semiconductor Solutions Corporation

Sony Corporation

Meiji Co., Ltd.

Kabushiki Kaisha Square Enix

Square Enix Co., Ltd.

Hiroyuki Itou

Nobutoshi Fujii

Minoru Ishida

Hiroshi Tazawa

Suguru Saito

Hiroyasu Matsugai

Toshiaki Shiraiwa

Keiji Ohshima

Masanori Iwasaki

Yusuke Moriya

Toshihiko Hayashi

Shuzo Sato

Yoshiya Hagimoto

Takashi Oinoue

Toshihiro Kurobe

Atsushi Yamamoto

Kazutoyo Maehiro

Koichi Takeuchi

Kunihiko Hikichi

Masahiko Shimizu

Munekatsu Fukuyama

Masaki Okamoto

Ko Okumura

Takeshi Takahashi

Keisuke Furuichi

Shuji Ikegami

Seiya Makino

Hirotaka Yoshioka

Yukio Asami

Naoki Orii

Masaki Terahara

Kazuyoshi Takeda

Sotetsu Saito

Hiroshi Kano

Jun Henmi

Yoshio Suzuki

Sachio Kawai

Keisuke Sawaki

Isao Nagaoka

There is provided a camera module including a stacked lens structure including a plurality of lens substrates. The plurality of lens substrates includes a first lens substrate including a first lens that is disposed at an inner side of a through-hole formed in the first lens substrate, and a second lens substrate including a second lens that is disposed at an inner side of a through-hole formed in the second lens substrate, wherein the first lens substrate is directly bonded to the second lens substrate. The camera module further includes an electromagnetic drive unit configured to adjust a distance between the stacked lens structure and a light-receiving element.

AF module, camera module, and electronic apparatus

The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.

Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing method

A deformation of a stacked lens is suppressed. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are bonded and stacked by direct bonding. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.

Stacked lens structure, method of manufacturing the same, and electronic apparatus

There is provided imaging devices and methods of forming the same, the imaging devices, including: a photodetector layer; and a light-blocking member stacked above the photodetector layer, where the light-blocking member includes at least one light-transmitting portion and at least one lens portion.

Image sensor and electronic apparatus

To suppress occurrence of contamination or damage to a lens. In the present technology, for example, a manufacturing apparatus allows a spacer which is thicker than a height of a lens resin portion protruded from a substrate to be adhered to the substrate. In addition, for example, in the present technology, the manufacturing apparatus molds the lens resin portion inside a through-hole formed in the substrate by using a mold frame configured with two layers of molds and, after molding the lens resin portion, in the state that one mold is adhered to the substrate, the manufacturing apparatus demolds the substrate from the other mold. The present technology can be applied to, for example, a lens-attached substrate, a stacked lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic apparatus, a computer, a program, a storage medium, a system, or the like.

Lens-attached substrate, stacked lens structure, camera module, and manufacturing apparatus and method

A positional shift of a lens of a stacked lens structure is reduced. A plurality of through-holes is formed at a position shifted from a first target position on a substrate according to a first shift. A lens is formed on an inner side of each of the through-holes using a first mold in which a plurality of first transfer surfaces is disposed at a position shifted from a predetermined second target position according to a second shift and a second mold in which a plurality of second transfer surfaces is disposed at a position shifted from a predetermined third target position according to a third shift. The plurality of substrates having the lenses formed therein is formed according to direct bonding, and the plurality of stacked substrates is divided. The present technique can be applied to a stacked lens structure or the like, for example.

Stacked lens structure, method of manufacturing the same, electronic apparatus, mold, method of manufacturing the same, and substrate

Influence of chipping in case of dicing a plurality of stacked substrates is reduced. Provided is a semiconductor device where a substrate, in which a groove surrounding a pattern configured with a predetermined circuit or part is formed, is stacked. The present technology can be applied to, for example, a stacked lens structure where through-holes are formed in each substrate and lenses are disposed in inner sides of the through-holes, a camera module where a stacked lens structure and a light-receiving device are incorporated, a solid-state imaging device where a pixel substrate and a control substrate are stacked, and the like.

Lens substrate, semiconductor device, and electronic apparatus

Substrates with lenses having lenses disposed therein are aligned with high accuracy. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are direct-bonded and stacked based on an alignment mark. The alignment mark is formed simultaneously with the through-hole. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.

Substrates with lenses having lenses disposed therein are aligned with high accuracy. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are direct-bonded and stacked. In particular, one or more air grooves formed in surfaces of the substrates reduces an influence of air inside a void portion between adjacent lenses of a layered lens structure.

Lens attached substrate, layered lens structure, manufacturing method thereof, and electronic device

The present invention provides a novel anticariogenic agent without side effects so that anticariogenic effect can also be obtained in humans who are highly sensitive to oligosaccharides and sugar alcohols. Also, an agent for preventing periodontal disease or for treating periodontal disease which has an effect of preventing or treating periodontal disease and which does not have side effects is provided. The invention relates to an anticariogenic agent and an anticariogenic composition comprising a bifidobacterium, an agent and a composition for preventing periodontal disease comprising a bifidobacterium and an agent and a composition for treating periodontal disease comprising a bifidobacterium.

Anticariogenic agent and anticariogenic composition

An electronic device has a mounted image sensor including a light shielding body having light shielding walls and light transmitting portions each formed in an opening between the light shielding walls, a first light-shielding layer formed on a light incident surface side of the light shielding body and having an opening narrower than the opening of the light shielding body for each of the openings of the light shielding body, a microlens provided for each of the openings of the first light-shielding layer on the light incident surface side of the light shielding body, and a light receiving element layer with an array of a large number of light receiving elements. The present disclosure can be used for, for example, a compound-eye optical system.

Image sensor and electronic device

Stacked lens structure method of manufacturing the same, and electronic apparatus

Growing community of inventors

Kanagawa, Japan

Hiroyuki Itou