Ntt Docomo, Inc.

Mitsubishi Electric Corporation

Jsr Corporation

Nippon Telegraph and Telephone Corporation

Fujitsu Corporation

Nec Corporation

Sugatsune Kogyo Co., Ltd.

Kabushiki Kaisha Toshiba

Mitsubishi Denki Kabushiki Kaisha

Sumitomo Electric Industries, Limited

Dai Nippon Printing Co., Ltd.

The Furukawa Electric Co., Ltd.

Tohoku University

Ushio Denki Kabushiki Kaisha

Thk Co., Ltd.

Hiroyuki Ishii

Mineo Yamamoto

Hiroki Aso

Junichiro Oya

Yuto Urabe

Takehiro Nakamura

Anil Umesh

Mikio Iwamura

Akihito Hanaki

Tomoaki Oikawa

Satoshi Nagata

Yoshihisa Kishiyama

Kazunori Sakanobe

Naoto Okubo

Masafumi Usuda

Kazuaki Takeda

Kenichi Higuchi

Hideaki Takahashi

Sadayuki Abeta

Kazuki Takeda

Yukio Nishimura

Daisuke Nishikawa

Nobuhiko Miki

Tetsushi Abe

Takaya Shimokawa

Masafumi Yamamoto

Hiroki Harada

Junichiro Hagiwara

Hiromasa Umeda

Kohei Kiyoshima

Yasufumi Morioka

Tooru Uchino

Takahiro Hayashi

Koji Takeda

Yoshikazu Goto

Junichiro Kawamoto

Takushi Kazama

Naoto Ookubo

Yuta Ueda

Toru Kajita

Takuya Sato

Hidehiro Ando

Naoki Fujiwara

Yuta Sagae

Atsushi Harada

Tsutomu Shimokawa

Isao Nishimura

Atsushi Matsuoka

Eiichi Kobayashi

Kazuhiko Baba

Koji Yabe

Sean Anthony Ramprashad

Shimpei Yasukawa

Tomoki Nagai

Teruo Kawamura

Sung Uk Moon

Yoshiaki Ofuji

Yuji Yada

Kengo Yagyu

Kiyoshi Murata

Katsumi Inomata

Mamoru Sawahashi

Takashi Okada

Minami Ishii

Atsushi Nakamura

Lan Chen

Hiroyuki Seki

Yukihiko Okumura

Kenichiro Aoyagi

Hiroshi Ikeda

Noriyuki Takahashi

Kazunori Hatakeyama

Kenichi Hasegawa

Hiroshi Yamaguchi

Hiroaki Mochizuki

Tsuyoshi Shimomura

Yosuke Shinomoto

Hiroki Ito

Hirofumi Sasaki

Takuya Shimomugi

Dai Kimura

Kei Watanabe

Kazuyoshi Oshima

Yusuke Ohwatari

Kota Shikama

Junichi Ono

Yasumasa Takeuchi

Minoru Fukuda

Kazunori Obata

Xiang Yun

Ryogo Takahashi

Hiroshi Okamoto

Takashi Yamada

Koushi Yamaguchi

Kengo Horikoshi

Toshiaki Tamamura

Moo Ryong Jeong

Masataka Nakazawa

Hideaki Matsuzaki

A semiconductor optical integrated device in which a forward-bias optical device and a semiconductor laser are monolithically integrated on a semiconductor substrate, includes: a passive waveguide portion that is arranged between the forward-bias optical device and the semiconductor laser; and a ground electrode that is arrange on a lower surface of the semiconductor substrate. Further, the semiconductor laser includes a mirror having a length on a side closer to the forward-bias optical device, the forward-bias optical device includes a forward-bias optical-device electrode on a side opposite to a side in contact with the semiconductor substrate, the passive waveguide portion includes a passive waveguide electrode on a side opposite to a side in contact with the semiconductor substrate, and the passive waveguide electrode is electrically connected to the ground electrode.

Semiconductor optical integrated device

A terminal is disclosed that includes a receiver that receives, in a first cell, information indicating a measurement object including information regarding a parameter of a discovery or measurement signal. The terminal also includes a processor that performs a measurement using the discovery or measurement signal based on the information indicating the measurement object and a transmitter that transmits a result of the measurement, where when the information indicating the measurement object designates a timing that is synchronous with the first cell, the processor performs the measurement in a second cell based on the timing that is synchronous with the first cell. In other aspects, a radio communication method and a base station are also disclosed.

Terminal, radio communication method, and base station

An electric motor has a mechanism to detect an overcurrent in an inverter circuit. The electric motor includes a rotor, a stator, and a board. The board includes a power transistor, a first resistor, a second resistor, and a constant voltage diode. The power transistor is included in the inverter circuit, which is configured to change a direction of a current that flows through a winding of the stator. The first resistor is provided between the power transistor and a ground terminal, and configured to detect an overcurrent in the inverter circuit. The second resistor is provided between the power transistor and the first resistor, and configured to detect a current that flows through the winding of the stator. The constant voltage diode is connected parallel to the first resistor.

Electric motor and air-conditioning apparatus including the same

A motor includes a stator, and includes a first substrate and a second substrate mounted on the stator. The stator has a stator core in a ring shape and a first coil of a first phase and a second coil of a second phase wound around the stator core. The first substrate includes a first power supply wiring to supply electric power to the first coil. The second substrate has a second power supply wiring to supply electric power to the second coil.

Motor and air conditioner

An electric motor includes a stator, a rotor, and a magnetic sensor. The stator has an iron core and a magnetic flux coil. The rotor has a rotary shaft and a cylindrical rotor magnet. The magnetic sensor has a sensor unit that outputs an electric signal based on an applied magnetic flux. The rotor magnet is disposed so as to face the iron core of the stator. The rotor magnet has a main magnet unit and a sensor magnet unit that is formed integrally with the main magnet unit and has an external diameter smaller than an external diameter of the main magnet unit. The magnetic sensor is disposed beside the sensor magnet unit. An outer circumferential edge of the sensor magnet unit is located farther away from the rotary shaft than a center of the sensor unit. The magnetic sensor is configured such that a center of the sensor unit and a center of the magnetic sensor do not match each other, and the center of the sensor unit is closer to the sensor magnet unit than the center of the magnetic sensor.

Electric motor and air-conditioning apparatus including same

A mobile station UE includes a measurement unitconfigured to measure radio quality of a cell during communication or a neighboring cell for each of the two or more carriers, a determination unitconfigured to determine whether to notify the radio base station eNB of a measurement result regarding each of the two or more carriers in the measurement unitand a transmission unitconfigured to transmit the measurement result in the measurement unitto the radio base station eNB, wherein the transmission unittransmits, in addition to the measurement result regarding a carrier in which it is determined by the determination unitto notify the radio base station eNB of the measurement result in the measurement unita measurement result regarding a carrier other than the carrier.

Mobile station, radio base station, and communication control method

An optical circuit is provided in which electric circuit parts and optical circuit parts are integrated in a stack on a printed substrate. The optical circuit is provided with a lid having a temperature regulation function that uses a temperature control element and an optical fiber block capable of optical input and output. Temperature control of optical circuit elements can be efficiently performed by mounting electric circuit parts and optical circuit parts on a printed substrate in advance by a reflow step using OBO technology and subsequently attaching a lid that includes a temperature control element.

Optical circuit

A motor includes a stator to which a substrate can be stably secured without increasing the size of the substrate. An air-conditioning apparatus includes the motor. At an end portion of the stator in the axial direction thereof, a substrate on which electronic components are mounted is provided. The stator includes: a stator core formed by stacking electromagnetic steel sheets, and including a plurality of teeth; insulators provided on the stator core; and a wire wound around the teeth, the teeth being coated with the insulators. The insulators have outer walls provided on respective core backs of the stator core. In a linearly developed state of the stator, where of the teeth, an outermost tooth is a first tooth, a tooth adjacent to the first tooth is a second tooth, another tooth adjacent to the second tooth is a third tooth, another tooth adjacent to the third tooth is a fourth tooth, and another tooth adjacent to the fourth tooth is a fifth tooth, the outer walls of the first, third and fifth teeth include respective substrate attachment pins for use in attachment of the substrate, and the outer walls of the first tooth include respective power terminals for use in supplying power to the wire.

Motor and air-conditioning apparatus

An optical module includes: a substrate; one or more light sources that produce light that is an optical signal; one or more light reflection units that change the direction of travel of the light to a direction substantially perpendicular to the substrate; one or more optical waveguides that optically connect the one or more light sources and the one or more light reflection units to each other; and a lid that is attached to the substrate to cover the one or more light sources, the one or more light reflection units and the one or more optical waveguides. The lid has one or more lenses that collimate light directed by the one or more light reflection units and transmit the light to the outside of the lid.

Optical module, optical wiring substrate, and method for manufacturing optical module

There is provided an optical element mounted on a substrate and an optical coupling element mounted on the substrate. The optical coupling element includes a guide unit extending in a direction parallel to a plane of the substrate so as to fix an optical fiber. There is provided a mold resin layer formed on the substrate so as to cover the optical element and expose a side surface of the optical coupling element at one end of the guide unit. The optical element includes a light incidence/emission unit on a side surface perpendicular to the plane of the substrate, and the other end of the guide unit and the light incidence/emission unit are disposed to face each other.

Optical component and method for manufacturing same

To provide an optical module, an optical wiring board, and a method for manufacturing an optical module that provide the two-dimensional freedom degree of the joint portion between the optical module and the optical fiber even through the OBO method is applied to an optical module mounted via WLP. The optical module includes a board, a plurality of optical input-output portions that change a travel direction of light traveling substantially orthogonally to the board to a direction substantially parallel to the board and change a travel direction of the light traveling substantially parallel to the board to a direction substantially orthogonal to the board, one or more optical waveguides that optically connect the optical input-output portions to each other, and a lid that is attached to the board so as to include the optical input-output portions and the one or more optical waveguides, in which the lid has one or more reflection mirrors that change a travel direction of the light traveling from an outside of a side surface of the lid to an inside of the side surface so as to be directed to the optical input-output portions and change a travel direction of the light output from the optical input-output portions so as to be directed from the inside of the side surface of the lid to the outside of the side surface.

Optical module, optical wiring board, and production method for optical module

A semiconductor device includes a core which includes a first cache and a second cache; and a third cache configured to connect to the core, wherein the core is configured to: hold a read instruction that is issued from the first cache to the second cache, hold a write-back instruction that is issued from the first cache to the second cache, process the read instruction and the write-back instruction, determine whether a target address of the read instruction is held by the first cache by using a cache tag that indicates a state of the first cache, and when data of the target address is held by the first cache, abort the read instruction until it is determined that data of the target address is not held by the first cache.

Semiconductor device

A method for manufacturing a monolithically integrated semiconductor optical integrated element comprising a DFB laser, an EA modulator, and a SOA disposed in a light emitting direction, comprising the step of forming a semiconductor wafer on which the elements are two-dimensionally arrayed and aligned the optical axes; cleaving the semiconductor wafer along a plane orthogonal to the light emitting direction to form a semiconductor bar including a plurality of the elements arranged one-dimensionally along a direction orthogonal to the light emitting direction such that the elements adjacent to each other share an identical cleavage end face as a light emission surface; inspecting the semiconductor bar by driving the SOA and the DFB laser through a connection wiring part together; and separating out the semiconductor bar after the inspection to cut the connection wiring part connecting the electrode of the SOA and the DFB laser to isolate from each other.

Semiconductor integrated optics element and production method therefor

A consequent-pole-type rotor includes a first rotor core having a first insertion hole, and a second rotor core having a second insertion hole, the second rotor core being stacked on the first rotor core such that the first insertion hole and the second insertion hole together form a space accommodating a permanent magnet. The first insertion hole has an opening at a first circumferential position of the first rotor core, and the second insertion hole is occluded at least at a second circumferential position of the second rotor core. The second circumferential position corresponds to the first circumferential position.

Consequent-pole-type rotor, electric motor, and air conditioner

The present invention is designed so that uplink transmission is carried out adequately even when CA is executed by applying different duplex modes between multiple cells. A user terminal that receives downlink control information (DCI) including Downlink Assignment Index (DAI) in a frequency division duplex (FDD) cell and controls, based on the DAI, transmission of a transmission acknowledgement signal for a downlink shared channel that is scheduled to the FDD cell by the DCI.

User terminal, base station, and radio communication method

Growing community of inventors

Tokyo, Japan

Hiroyuki Ishii