Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Nippon Shokubai Co., Ltd.

Hiroyuki Ishida

Noriyuki Yoshikawa

Masanori Minamio

Toshiyuki Fukuda

Hideyuki Nakanishi

Yoshihiro Tomita

Masayuki Ono

Masatoshi Yoshida

Kenji Minami

Masuji Izubayashi

Kiyoshi Fujihara

Yasumasa Tanaka

Masaya Tateyanagi

Masaya Uchida

Shouichi Takasuka

Shigeki Okamoto

Hisanori Ishiguro

Masanori Mimamio

Kouji Ise

By increasing the width of a lead terminalconnected to a die padin the vicinity of the die padand forming a slitand a projecting plate in the lead terminal in the region where resinis formed, it is possible to ensure the holding strength of the lead terminal by the resin, as well as ensuring the strength of the lead terminal during the manufacturing process and achieving a reduction in thickness.

Semiconductor device and optical pickup device

An optical element mounted on a wiring board is sealed by a sealing resin except an optical function region. Wires connecting the wiring board with the optical element are also sealed by the sealing resin. The optical function region is exposed as a bottom surface of a recess whose side surface is formed by the sealing resin. A boundary portion between the side surface of the recess and a top surface portion and a boundary portion between the side surface and bottom surface of the recess have a rounded shape.

Optical device for reducing disturbance light and manufacturing method thereof

An optical semiconductor device includes a semiconductor laser chip, a base for mounting the semiconductor laser chip and a solder layer sandwiched between the top surface of the base and the bottom surface of the semiconductor laser chip. The semiconductor laser chip is warped in upward convex shape.

Optical semiconductor device

An optical device includes a copper plate, light receiving elements mounted on the copper plate, a light emitting element mounted on the light receiving elements, a flexible substrate bent to cover portions of upper and side surfaces of the copper plate, and a positioning frame of metal for fixing the flexible substrate and the copper plate to each other. Since the positioning frame secures the flexible substrate and the copper plate against movement, a thin optical device can be attained without employing a resin-molded construction.

Optical device, method for fabricating optical device, cap component, and method for forming cap component

An optical pick-up apparatus includes: a semiconductor laser light source that generates an optical beam; a diffraction grating that divides the optical beam into a main beam and side beams; an optical element that guides the main beam and the side beams that are generated by the diffraction grating onto an optical information medium; and a photodetector that detects a signal from reflected light reflected from the optical information medium. The semiconductor laser light source is configured with a 2-wavelength semiconductor laser device in which a semiconductor laser chip that generates an optical beam having a wavelength of &#x3bb;and a semiconductor laser chip that generates an optical beam having a wavelength of &#x3bb;are integrated into one chip or are arranged in proximity to each other. The diffraction grating has one grating period &#x39b; by which each of the optical beams having the wavelength &#x3bb;and the optical beam having the wavelength &#x3bb;, which are generated by the 2-wavelength semiconductor laser device, is divided into a main beam and side beams. The apparatus is applicable to two kinds of optical information media having different track pitches.

Optical pick-up apparatus

The present invention provides: a process for producing a high molecular weight thermoplastic resin composition, which can give the high molecular weight thermoplastic resin composition with good reproducibility and stably; and uses of the resultant resin composition. The process for producing a high molecular weight thermoplastic resin composition comprises the step of mixing a thermoplastic resin with pyromellitic dianhydride to carry out a reaction therebetween to convert the thermoplastic resin into a high molecular weight one, and this process is characterized in that the pyromellitic dianhydride has at least one of the following properties in particle form: (1) intrinsically linear or needle-like particle forms; (2) a bulk density of 0.4&tilde;0.9 g/ml; and (3) a rest angle of 50&tilde;70 degrees.

Process for producing high molecular weight thermoplastic resin composition and its use

The present invention provides an acrylic polymer containing no surfactant, having little limitation in the polymer composition and being superior in heat resistance, processing operation performance and fluidity, and also provides use of the polymer and a production process. An acrylic polymer of present invention is obtained by the bulk polymerization, contains an acrylic acid-based monomer unit as a main component in its structure and has a Mn of 1,000 to 1,000,000, a glass transition temperature of -80.degree. C. or higher and a Mw/Mn ratio of 5 or less, and is appropriate for acrylic rubber, a pressure-sensitive adhesive, an alkali-soluble adhesive, an alkali-soluble film, an alkali-soluble injection molding or water ink. This polymer is produced by, in the presence of an inactive gas, carrying out the bulk polymerization of a starting material which contains a monomer component having an acrylic acid-based monomer as a main component and contains a sulfur compound of 0.001 to 20 parts by weight based on 100 parts by weight of the monomer component, and contains a polymerization initiator in the weight of one-third or less based on the sulfur compound.

Acrylic polymer, its use and process for producing it

Growing community of inventors

Osaka, Japan

Hiroyuki Ishida