Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Hiroyuki Imamura

Nobuyuki Koutani

Nozomi Shimoishizaka

Kouichi Nagao

Yoshifumi Nakamura

Michinari Tetani

Hiroyuki Kobayashi

Takayuki Tanaka

Katsuhiko Watanabe

Hiroshi Nasu

Hiroshi Ebihara

Kenshi Tokushima

In a direction parallel to a directionof ultrasonic vibrations imparted from an ultrasonic vibrator, the shape of a center portionof a tooland the shape of an end portionof the toolare changed such that the cross-sectional areas are different, whereby ultrasonic amplitudesin a direction perpendicular to the directionof ultrasonic vibrations are substantially equal. By this means, the difference in ultrasonic vibration between at the center portionof the tooland at the end portionof the toolcan be eliminated or reduced.

Electronic component mounting apparatus and electronic component mounting method

In a film substrate (FB) including a film base material () and conductor wiring () that is formed on the film base material (), the conductor wiring () is arranged such that the conductor wiring thickness of an external connection portion on the film substrate to which another panel or substrate is connected is thicker than the conductor wiring thickness of conductor wiring portions (bent portions) () at other positions.

Film substrate, fabrication method thereof, and image display substrate

A wiring board according to the present invention includes: an insulating base; a plurality of first conductor wiringsaligned in an inner region on the insulating base; bumpsformed on the respective first conductor wirings; and a protective filmthat is formed on the insulating base so as to cover the first conductor wirings and has an opening region through which the bumps are exposed. The height of at least part of a surface of the protective film from a surface of the insulating base is greater than the height of the bumps from the surface of the insulating base. With this configuration, it is possible to decrease the thickness in the state where a protective tape is placed on the wiring board to protect bumps, thereby increasing the length of the wiring board that can be held by a reel for supplying the wiring board.

Wiring board with a protective film greater in heights than bumps

A flexible insulating base, a plurality of conductor wirings aligned on the flexible insulating base, and bump electrodes provided respectively in end portions of the plurality of conductor wirings in a region where a semiconductor chip is to be placed are provided. The semiconductor chip is mounted on the conductor wirings by bonding electrode pads formed on the semiconductor chip to the bump electrodes. An auxiliary conductor wiring formed similarly to the conductor wirings is provided on the insulating base, and an auxiliary bump electrode formed similarly to the bump electrodes is provided on the auxiliary conductor wiring, so that the electrode pads formed on the semiconductor chip can be registered with respect to the bump electrodes on the conductor wirings by positioning the semiconductor chip with reference to the auxiliary bump electrode. It is possible to configure a wiring board having register marks capable of positioning electrode pads of a semiconductor chip with respect to bump electrodes with high accuracy.

Wiring board

A circuit board including a flexible insulating substrate, a plurality of conductive wirings placed in line on the flexible insulating substrate, and bumps provided at end portions of the respective conductive wirings positioned in a region for mounting a semiconductor chip is provided. The circuit board further includes an auxiliary conductive wiring positioned at an outermost corner of the region for mounting the semiconductor chip, being adjacent to and an outside the outermost conductive wiring, and an auxiliary bump formed on the auxiliary conductive wiring in line with the bumps on the conductive wirings. One end portion of the auxiliary conductive wiring is terminated at a position in the outside vicinity of the auxiliary bump in an outward direction of the region for mounting the semiconductor chip, and the auxiliary conductive wiring is bent at the other end portion positioned inside the auxiliary bump in an inward direction of the region for mounting the semiconductor chip, and connected to an end of the adjacent outermost conductive wiring. A break in the outermost conductive wiring, which is caused by concentrated stress at the time of joining the bumps of the circuit board and electrode pads of the semiconductor chip, can be suppressed.

Circuit board with auxiliary wiring configuration to suppress breakage during bonding process

A wiring board includes: an insulating base; a plurality of conductive wirings; and bumps formed on the conductive wirings, respectively. The conductive wirings can be connected with electrode pads of a semiconductor element via the bumps. The conductive wirings include a connection terminal portion at an end portion opposite to the other end portion where the bumps are formed, and at the connection terminal portion, the conductive wirings can be connected with an external component. The conductive wirings include first conductive wirings and second conductive wirings, on which the bumps are formed respectively at a semiconductor element mounting region. The first conductive wirings extend from the bumps to the connection terminal portion. The second conductive wirings extend beyond the semiconductor element mounting region from the bumps but do not reach the connection terminal portion. End portions of the second conductive wirings extending beyond the semiconductor element mounting region are separated electrically from the first conductive wirings by a cutting portion formed at a boundary region with the first conductive wirings. Irrespective of the state of operating electrode pads of a semiconductor element to be mounted, the bumps can be arranged at constant intervals.

Wiring board and method for manufacturing the same, and semiconductor device

A method for manufacturing a semiconductor device that includes mounting a semiconductor chip on a circuit board having an insulating substrate, a plurality of wiring layers arranged on the insulating substrate, and bumps formed on the wiring layers respectively, in which the bump is provided across a longitudinal direction of a corresponding one of the wiring layers so as to extend over regions on both sides of the wiring layer and contact a surface of the insulating substrate, without a stepped portion formed on a surface of the bump, and a cross sectional shape of the bump taken in a width direction of the wiring layer is such that a central portion is higher than both side portions. The method also includes connecting electrode pads of the semiconductor chip to the bumps, thereby achieving connection between the electrode pads of the semiconductor chip and the wiring layers via the bumps.

Method for manufacturing semiconductor device

A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring layers so as to extend over regions on both sides of the wiring layer above the insulating substrate, and a cross sectional shape of the bump taken in the width direction of the wiring layer is such that a central portion is higher than portions on both sides of the central portion. Accordingly, the bumps formed on the wiring layers can be held with strength sufficient for practical use against the force applied in the lateral direction.

Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same

A wiring board includes: a flexible insulating base; a plurality of conductive wiringsarranged on the flexible insulating base; protruding electrodesprovided respectively at an end portion of the same side of each of the conductive wirings; external terminalsformed respectively at the other end portions of each of the conductive wirings; metal plating layers applied on the conductive wirings, the protruding electrodes and the external terminals; and solder resist layersformed respectively by coating the conductive wirings in regions between the end portions at which the protruding electrodes are provided and the external terminals. In the regions where the solder resist layers are formed, no metal plating layers are formed on the conductive wirings, and the surfaces of the conductive wirings to be contacted with the flexible insulating base are rougher than the surfaces not to be contacted with the flexible insulating base. Even when a film base is thin, bending stress applied to the conductive wirings is relieved sufficiently, and thus breaks in the wirings are suppressed.

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Osaka, Japan

Hiroyuki Imamura