Shin-etsu Chemical Co., Ltd.

Hiroyuki Iguchi

Takayuki Kusunoki

Yoshihiro Tsutsumi

Yuki Kudo

Atsushi Tsuura

Tsutomu Kashiwagi

Tomoyuki Mizunashi

Masayuki Iwasaki

Toshio Shiobara

Naoyuki Kushihara

Yoshinori Takamatsu

Rina Sasahara

Provided is an adhesive composition for a flexible printed-wiring board (FPC) that has low dielectric properties, a high adhesion strength to low-dielectric resin films (LCP or MPI) and a copper foil, and an excellent moisture resistance and reflow resistance. This adhesive composition contains:

Adhesive composition for flexible printed-wiring board (FPC), and heat-curable resin film, prepreg and FPC substrate containing same

Provided is a resin composition that has a low melt viscosity, and is capable of being turned into a cured product having a high heat resistance, a high adhesion and a high glass-transition temperature, though having a low permittivity and a low dielectric tangent. The resin composition is a cyclic imide resin composition containing: and

Cyclic imide resin composition, prepreg, copper-clad laminate and printed-wiring board

A low-dielectric heat dissipation film composition contains: (A) a maleimide resin composition containing (A1) a maleimide resin containing at least two or more maleimide groups per molecule and (A2) a polymerization initiator; and (B) boron nitride particles. The component (A1) has a maleimide equivalent of not more than 0.1 mol/100 g, and a cured material of the component (A) has a relative dielectric constant of 3.5 or less at a frequency of 10 GHz. Thus, the present invention provides a film composition for forming a film having low dielectric constant and high heat dissipation.

Low-dielectric heat dissipation film composition and low-dielectric heat dissipation film

Provided are a slurry composition having a low thixotropy and a superior handling property; a cured product of this slurry composition; and a substrate, film and prepreg using such cured product, the substrate, film and prepreg exhibiting excellent mechanical properties and a low relative permittivity and dielectric tangent. The slurry composition has a thixotropic ratio of not higher than 3.0, and comprises:

Slurry composition, cured product of the slurry composition, and substrate, film and prepreg using the cured product

One of the purposes of the present invention is to provide a radiation curable organosilicon resin composition which offers a cured product having a sufficient gas barrier property and which further has workability enough for use in spin coating or inkjetting. The present invention provides a radiation curable organosilicon resin composition comprising 100 parts by mass of (A) a (meth)acryloyloxy group-containing organosilane represented by the formula (1) which has a (meth)acryloyloxy group or a monovalent organic group having 4 to 25 carbon atoms and having one, two, or three of said (meth)acryloyloxy group, and 1 to 50 parts by mass of (B) a photopolymerization initiator.

Radiation curable organosilicon resin composition

An adhesive substrate includes a support base member and an adhesive layer provided on the support base member. The support base member contains electroconductive particles and an insulating resin, and has a recessed and projected pattern with two or more projected portions on one surface or both surfaces of the support base member. The adhesive layer is provided at least on upper surfaces of the projected portions in the recessed and projected pattern of the support base member. The adhesive layer on the upper surfaces of the projected portions has an upper surface with a curved surface. Thus, the present invention provides an adhesive substrate capable of selectively picking up and quickly transferring large amounts of fine chips and particles, a method for producing the adhesive substrate, and a transfer device.

Adhesive substrate, transfer device having adhesive substrate, and method for producing adhesive substrate

Addition-curable silicone composition providing cured product having good performance at low temperature and excellent resistance to a temperature change. Also, semiconductor device having high reliability, whose semiconductor element is encapsulated with a cured addition-curable silicone resin composition comprising (A) a branched organopolysiloxane of formula (1): wherein a is an integer of 2-100, b is an integer of 5-100, c is an integer of 5-100, 0.03&#x2264;a/(a+b)&#x3c;1.0, and a ratio of (RRSiO) units to (RSiO) units is &#x2264;2; (B) an organopolysiloxane of formula (2):(RSiO)(RSiO)(RSiO)(SiO)&#x2003;&#x2003;(2)in an amount of 5-900 parts by mass, relative to 100 parts by mass of (A); (C) an organopolysiloxane having at least two hydrosilyl groups, in an amount such that a ratio of the number of the hydrosilyl groups in (C) to the number of the alkenyl groups in (A) and (B) is 0.4-4.0; and (D) a hydrosilylation catalyst in an amount sufficient to accelerate hydrosilylation.

Addition-curable silicone resin composition and a semiconductor device

Provided is an addition-curable organopolysiloxane resin composition capable of forming a cured product having a superior transparency, heat resistance and light resistance. The addition-curable organopolysiloxane resin composition contains:

Addition-curable organopolysiloxane resin composition, cured product thereof, and semiconductor device having the cured product

One of the purposes of the present invention is to provide an addition-curable silicone composition which provides a cured product having good performance at a low temperature and excellent resistance to a temperature change, and to provide a semiconductor device having a high reliability, whose semiconductor element is encapsulated with a product obtained by curing the addition-curable silicone composition. Thus, an addition-curable silicone resin composition comprising (A) a branched organopolysiloxane represented by the following formula (1): wherein a is an integer of from 2 to 100, b is an integer of from 5 to 100, c is an integer of from 5 to 100, 0.03&#x2264;a/(a+b)&#x3c;1.0, and a ratio of the number of (RRSiO) unit to the number of (RSiO) unit is 2 or less; (B) an organopolysiloxane represented by the following formula (2): (RSiO)(RSiO)(RSiO)(SiO)(2) in an amount of 5 to 900 parts by mass, relative to 100 parts by mass of component (A); (C) an organopolysiloxane having at least two hydrosilyl groups, in an amount such that a ratio of the number of the hydrosilyl groups in component (C) to the number of the alkenyl groups in components (A) and (B) is 0.4 to 4.0; and (D) a hydrosilylation catalyst in an amount sufficient to accelerate hydrosilylation.

The present invention provides an adhesion promoter for promoting adhesiveness of a cured product of an addition curable organopolysiloxane resin composition, the adhesion promoter comprising at least one alkoxy group bonded to a silicon atom, and at least one cyano group-containing organic group bonded to a silicon atom in one molecule. There can be provided an adhesion promoter which can make a cured product of an addition curable organopolysiloxane resin composition excellent in heat resistance, workability, adhesiveness, and gas barrier property by adding it to the composition.

Adhesion promoter, addition curable organopolysiloxane resin composition and semiconductor apparatus

An addition curable organopolysiloxane composition comprising (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) a silphenylene oligomer having at least two silicon-bonded hydrogen atoms per molecule, and (C) a hydrosilylation catalyst cures into a product having both a satisfactory hardness and crack resistance.

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Annaka, Japan

Hiroyuki Iguchi