Tokyo Electron Limited

Hiroyuki Ide

Kousuke Yoshihara

Hideo Shite

Masato Hayashi

Takami Satoh

Naoyuki Satoh

Minoru Kubota

Takeshi Tamura

Shinichi Hatakeyama

Ryouichirou Naitou

Naoki Shibata

Manabu Hama

Kentaro Yoshihara

Seiya Totsuka

Takafumi Hasimoto

Atsumu Maita

Hirofumi Araki

Yosuke Kameda

A liquid processing device includes: a nozzle configured to discharge, onto a substrate, a processing liquid supplied from a processing liquid source, the processing liquid being configured to process the substrate; a main flow path which connects the processing liquid source and the nozzle; a filter provided in the main flow path; a branch path branched from the main flow path; a pump provided at an end of the branch path; and a controller configured to output a control signal to perform a first process of sucking the processing liquid supplied from the processing liquid source by the pump to flow the processing liquid into the branch path and then a second process of discharging the processing liquid of a smaller amount than a capacity of the branch path from the pump to the branch path to discharge the processing liquid from the nozzle.

Liquid processing device and liquid processing method

A solution supply apparatus is for supplying a treatment solution to a treatment solution discharger which discharges the treatment solution to a treatment object. The solution supply apparatus includes: a supply pipe line connected to the treatment solution discharger; a filter provided on the supply pipe line which filters the treatment solution to remove foreign substances; and a controller. The controller performs a determination of a state of the treatment solution to be supplied to a primary side of the filter and, when the state of the treatment solution is determined to be bad, outputs a control signal for restricting supply of the treatment solution to the primary side of the filter.

Solution supply apparatus and solution supply method

There is provided a coating method which can apply a coating solution uniformly onto a substrate surface while reducing the amount of the coating solution supplied. The coating method for applying a coating solution onto a wafer includes the steps of: supplying a solvent for the coating solution onto the wafer to form an annular liquid film of the solvent in a peripheral area of the wafer; supplying the coating solution to the center of the wafer while rotating the wafer at a first rotational speed (time t-t); and allowing the coating solution to spread on the wafer by rotating the wafer at a second rotational speed which is higher than the first rotational speed (time t-t). The supply of the solvent is continued until just before the coating solution comes into contact with the liquid film of the solvent (time t-t).

Coating method, computer storage medium and coating apparatus

A substrate processing apparatus is used for radiating UV rays onto a target film formed on a target surface of a substrate to perform a curing process of the target film. The apparatus includes a hot plate configured to heat the substrate to a predetermined temperature, a plurality of support pins disposed on the hot plate to support the substrate, and a UV radiating device configured to radiate UV rays onto the target surface of the substrate supported on the support pins. The support pins are preset to provide a predetermined thermal conductivity to conduct heat of the substrate to the hot plate. The hot plate is preset to have a predetermined thermal capacity sufficient to absorb heat conducted through the support pins.

Substrate processing apparatus and method

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Koshi, Japan

Hiroyuki Ide