Seiko Instruments Inc

Hiroyuki Hoshina

Takashi Niwa

Koichiro Jujo

Susumu Ichihara

Matsuo Kishi

In a method of manufacturing an electroforming mold, a first photoresist layer is formed on an upper surface of a bottom conductive film of a substrate, and the first photoresist layer is divided into a first soluble portion and a first insoluble portion. A conductive material is thermally deposited on an upper surface of the first photoresist layer within a predetermined temperature range, to thereby form an intermediate conductive film. An intermediate conductive film is patterned. A second photoresist layer is formed on an exposed upper surface of the first photoresist layer after the intermediate conductive film is removed, and on an upper surface of the intermediate conductive film remaining after patterning. The second photoresist layer is divided into a second soluble portion and a second insoluble portion. Next, the first and second photoresist layers are developed, and the first and second soluble portions are removed.

Method manufacturing electroforming mold

Method of manufacturing electroforming mold, electroforming mold, and method of manufacturing electroformed component

To provide an electroforming mold for manufacturing a multi-step structure minute component and a method for manufacturing the same, for which height control is possible and manufacturing process does not become complicated. On the upper face of a film of an electroconductive layerformed on the upper face of a substrate, a resistis formed in which a first soluble portionand a first insoluble portionare formed. Next, a light-absorbing bodyis formed on the upper face of the resist, exposure and development are carried out, in addition a film of an electroconductive layeris formed on the upper face thereof, and a light-absorbing bodyand an electroconductive layeron the upper face of the light-absorbing bodyare removed by liftoff. Further, a resist is formed on the upper face thereof, in which a second soluble portionand a second insoluble portionare formed. Next, the first resist and the second resist are developed to remove the first soluble portionand the second soluble portion, thereby giving an electroforming moldhaving an electroconductive layer on the basal part of respective steps.

Electroforming mold and method for manufacturing the same, and method for manufacturing electroformed component

An electroforming mold has a first negative type photosensitive material formed on an electroconductive substrate, and a first through-hole extends through the firs photosensitive material to expose the electroconductive substrate. An electroconductive layer formed on an upper face of the first photosensitive material surrounds the first through-hole. A second negative type photosensitive material formed on an upper face of the electroconductive layer has a second through-hole that overlies and exposes both the first through-hole and a peripheral part of the electroconductive layer that surrounds the first through-hole. Because the electroconductive substrate and the electroconductive layer are separated from one another, the first and second through-holes precipitate an electroformed object independently during use of the electroforming mold resulting in a uniform electroformed object.

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Funabashi, Japan

Hiroyuki Hoshina