Murata Manufacturing Co., Ltd.

Hiroyuki Honda

Ryota Hashimoto

Kaori Takezawa

Yoshihiro Imanishi

Tarou Higuchi

Akio Igarashi

Hiroshi Marusawa

Shigeto Yamamoto

Kenta Kondo

Yasushi Saito

Masaki Inui

Akiko Sakane

Yuya Nagaoka

Minehito Yoshida

A coil component includes a core having a winding core portion and a coil wound along an axis of the winding core portion and including a plurality of wires. The coil has a wound region in which the plurality of wires are wound around the winding core portion. The wound region includes a twisted wire portion in which the plurality of wires are twisted together and a parallel portion in which the plurality of wires are not twisted together and extend parallel to each other.

Coil component

A coil component includes a core that includes a winding core portion and a coil that is wound around the winding core portion and that includes a plurality of wires. The coil includes a stranded wire portion that is formed by twisting the plurality of wires together. The stranded wire portion forms a bank region including a first layer that is formed by continuously winding the stranded wire portion around the winding core portion in a plurality of turns and a second layer that is continuous with the first layer and that is formed by winding the stranded wire portion around the first layer in a plurality of turns. The second layer has at least one pair of adjacent turns, and at least one pair of adjacent turns among all the pairs of adjacent turns are isolated from each other.

A multilayer circuit board having a signal and power isolation circuit, which can suppress the capacitive coupling between a chip inductor and a ground layer below the chip inductor and also suppress the characteristic impedance change occurring in a mounting pad on a microstrip line. Portions of the inner-layer ground below both the mounting pad on the microstrip line and the chip inductors connected to the mounting pad are separately removed respectively as the signal transmission characteristic compensation removal portion, which is formed by removing a portion having a predetermined area and situated immediately below the mounting pad, and the inductor characteristic compensation removal portion, which is formed by removing a mounting-surface-below portion having a predetermined area and situated immediately below the chip inductors. The signal transmission characteristic compensation removal portion and the inductor characteristic compensation removal portion are electrically isolated from each other with the predetermined distance therebetween.

Multilayer circuit board having signal and power isolation circuit

A coil component includes a terminal electrode and a terminal of a wire connected by thermocompression bonding on a bottom surface of a flange portion, to achieve a strong fixing force without the terminal of the wire protruding from the terminal electrode. A terminal of a wire extends along a main surface of a terminal electrode while at least a part of the terminal is disposed in the terminal electrode, and has a top surface positioned on a side opposite to a bottom surface side of a flange portion with respect to the main surface. A fillet surface which rises from the main surface toward the top surface and forms a concave curved surface is on an outer surface of the terminal electrode. The main surface is configured by a solder wettable layer made of tin or a tin alloy as an outermost layer of the terminal electrode.

A coil component comprising a wire including the core wire made of copper or a copper alloy and an insulating coating film made of resin that covers a peripheral surface of the core wire, and a terminal electrode including a nickel-containing layer made of nickel or a nickel alloy and covering a bottom surface of a flange portion, and a tin-containing layer located on the nickel-containing layer and made of tin or a tin alloy. The terminal of the core wire has a contact surface in contact with the nickel-containing layer, side surfaces extending in a direction rising from the nickel-containing layer, and a top surface facing the contact surface. The side surfaces have a region not in contact with the tin-containing layer at least on a top surface side. In the region, copper of the core wire is not diffused into the tin-containing layer.

A coil component includes a core having a winding core portion, a first flange portion disposed on a first end portion of the winding core portion, and a second flange portion disposed on a second end portion of the winding core portion; a wire winding on the winding core portion of the core; and a plate member disposed so as to bridge the first flange portion and the second flange portion. The coil component further includes an adhesive portion disposed between the first flange portion and the plate member and adhering the first flange portion to the plate member, and an adhesive portion disposed between the second flange portion and the plate member and adhering the second flange portion to the plate member. The adhesive portion contains a resin and magnetic powder.

A mounting structure for mounting inductors to suppress cross talk and a stub effect due to a mounting land, and reduce deterioration of signal transmission characteristics. A first Bias-T inductor is mounted on a circuit board with one electrode terminal connected to a first mounting land with an axial direction of the first Bias-T inductor oriented perpendicular to the first mounting land and the one electrode terminal extends along the first mounting land. A second Bias-T inductor is mounted on the circuit board in the vicinity of the first Bias-T inductor with one electrode terminal connected to a second mounting land with an axial direction of the second Bias-T inductor inclined by 90° with respect to the axial direction of the first Bias-T inductor and the second Bias-T inductor is oriented perpendicular to the second mounting land and the one electrode terminal extends along the second mounting land.

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Nagaokakyo, Japan

Hiroyuki Honda