Dai Nippon Printing Co., Ltd.

D.t. Circuit Technology Co., Ltd.

Kabushiki Kaisha Toshiba

Hiroyuki Hirai

Yoshitaka Fukuoka

Yuji Yamaguchi

Osamu Shimada

Hiroshi Yagi

Kenji Sasaoka

Kenichi Matsumura

Tooru Serizawa

Kazuhiro Shinozaki

Tatsuro Imamura

Satoshi Shibazaki

A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one of first surfaces of a first metal foil and a second metal foil each of which has a first surface and a second surface; arranging an insulating board having thermo-plasticity and thermo-setting properties so as to face the first surface of the first metal foil, and arranging the first surface side of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board; forming a double-sided wiring board by stacking, pressurizing and heating the arranged first metal foil, insulating board, and second metal foil, and thereby integrating these; and patterning the first metal foil and/or the second metal foil.

Method for fabricating wiring board provided with passive element, and wiring board provided with passive element

To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating-reliability. The component built-in wiring board includes: a conductive layer () extending in a thickness direction of the board and buried in the board without being exposed from an upper and a lower surface of the board; an electrical/electronic component () having a terminal and buried in the board with the terminal facing the buried conductive layer; a connecting member () provided in a gap between the terminal of the buried electrical/electronic component and the conductive layer to electrically/mechanically connect the terminal and the conductive layer; and two upper and lower insulating layers () which cover an outer surface of the buried electrical/electronic component excluding a portion connected to the connecting member and which are in close contact with a top and a bottom in the board thickness direction of the electrical/electronic component.

Component built-in wiring board and manufacturing method of component built-in wiring board

To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability. The component built-in wiring board includes: a conductive layer () extending in a thickness direction of the board and buried in the board without being exposed from an upper and a lower surface of the board; an electrical/electronic component () having a terminal and buried in the board with the terminal facing the buried conductive layer; a connecting member () provided in a gap between the terminal of the buried electrical/electronic component and the conductive layer to electrically/mechanically connect the terminal and the conductive layer; and two upper and lower insulating layers () which cover an outer surface of the buried electrical/electronic component excluding a portion connected to the connecting member and which are in close contact with a top and a bottom in the board thickness direction of the electrical/electronic component.

Wiring board incorporating components and process for producing the same

Method for fabricating wiring board provided with passive element

Wiring board provided with passive element and cone shaped bumps

In order to obtain a semiconductor device of which bonding reliability between a semiconductor element and a printed wiring board is improved and a manufacturing method thereof, in a semiconductor device mounted a semiconductor element on a printed wiring board , while a circumference of a metal bump formed on a conductor pad electrode disposed on the printed wiring board in wiring pattern and an electrode disposed along an external periphery of a semiconductor element facing the metal bump is provided with, along a placement position of the metal bump or the electrode , frame- or wall-shaped anisotropic conductive film , a gap between the semiconductor element and the printed wiring board , the insides of the anisotropic conductive film formed in frame or wall shape, is filled by sealing material such as epoxy resin or the like.

Anisotropic conductive film and resin filling gap between a flip-chip and circuit board

Growing community of inventors

Fuchu, Japan

Hiroyuki Hirai