Tokyo Electron Limited

Toyko Electron Limited

Hiroyuki Hara

Kousuke Yoshihara

Takahiro Kitano

Yuji Matsuyama

Junichi Kitano

Takashi Takekuma

Toshinobu Furusho

Hiroyuki Miyamoto

Takeshi Ohto

Shinya Hori

A process liquid supply mechanism for supplying a process liquid comprises a process liquid supply source for supplying a process liquid, a process liquid discharging nozzle for discharging the process liquid, a pipe connecting the process liquid supply source to the process liquid discharging nozzle, a pump mounted to the pipe for allowing the process liquid to be discharged from the process liquid discharging nozzle, a pressure sensor for detecting the pressure of the process liquid at a prescribed position intermediate between the pump and the process liquid discharging nozzle, and a controller for controlling the inner pressure of the pump based on the pressure value detected by the pressure sensor and the relationship obtained in advance between the pressure and the discharging rate of the process liquid such that the process liquid is discharged at a prescribed discharging rate.

Process liquid supply mechanism and process liquid supply method

In a coating apparatus for supplying a mixed solution of a resist solution and a thinner onto a wafer from a nozzle, the nozzle is connected to a mixed solution supply pipe, and the resist solution and the thinner are supplied to the mixed solution supply pipe from a resist solution supply pipe and a thinner supply pipe respectively through a junction pipe. The diameter of the junction pipe is set smaller than those of other supply pipes, whereby the resist solution and the thinner can be mixed efficiently in the junction pipe, and as a result the wafer is coated with the mixed solution so that a uniform film thickness can be obtained within the surface of the wafer.

Coating apparatus and mixing apparatus

Growing community of inventors

Kikuchi-gun, Japan

Hiroyuki Hara