Sony Chemicals Corporation

Hiroyuki Fujihira

Yukio Yamada

Motohide Takeichi

Masamitsu Itagaki

A chip-on-glass (COG) assembly, in which the electrodes of the semiconductor chips () are held in direct connection with the corresponding electrodes on the substrate glass circuit board (), utilizes a layer () of a connecting material for bonding and connecting the semiconductor chip () with the substrate board (). The connecting material can provide a reduced stress concentration at the boundaries between the binder layer () and the chip () and between the binder layer () and the glass board (), even at higher adhesive strengths, bringing about less deformation, such as warping, of the resulting bonded assembly, even when using a thinner substrate glass board, and provides a superior bonding strength and excellent electroconductive performance. The connecting material is made up of, on the one hand, an adhesive component () containing a thermosetting resin and, on the other hand, electroconductive particles () and has a characteristic feature that a tensile elongation percentage at 25&#xb0; C., after having been cured, is at least 5%.

COG-assembly and connecting material to be used therein

A connection structure is configured such that electrodes formed on an overcoat layer on a substrate are connected to other electrode terminals using an anisotropically electroconductive adhesive comprising electroconductive particles dispersed in an insulating adhesive, wherein the angle of encroachment A of the electroconductive particles into the overcoat layer is made to be at least 135&deg;.

Connection structure for semiconductor electrode terminals

An anisotropically electroconductive connection body, in which two elements, each having electrodes on a confronting face, are connected with each other. The connection body is made up of a connecting material containing an adhesive component constituted mainly of a thermosetting resin, the connecting material being interposed between the two elements to be connected, and an extraneous portion of the connecting material protruding from the periphery of one of the elements on the other one of the elements, wherein the degree of hardening of the thermosetting resin in the connecting material in the extraneous portion is at least 60%.

Anisotropically electroconductive connection body and method for forming it

Substrate warpage is eliminated without adversely affecting connection reliability when an IC chip or other packaging component is mounted on a substrate by thermocompression bonding with an interposed thermosetting adhesive. In a packaging method for the thermocompression bonding of a substrate and an IC chip or other packaging component between a stage and a head by means of an interposed thermosetting adhesive, the temperature of the stage during thermocompression bonding is set above the temperature corresponding to the inflection point of the elastic modulus in the relationship between the elastic modulus and the temperature of the cured adhesive.

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Kanuma, Japan

Hiroyuki Fujihira