Hitachi High-tech Corporation

Hitachi-high-technologies Corporation

Adv Antest Corporation

Toppan Printing Co., Ltd.

Sony Corporation

Hiroyuki Chiba

Wei Chean Tan

Shigeru Kawamata

Yoshinobu Hoshino

Ryo Komatsuzaki

Tsunenori Nomaguchi

Hirofumi Sato

Mai Yoshihara

Yudai Kubo

Miku Maehara

Kazuhiko Sato

Akihiko Kinoshita

Takashi Kanao

Yuki Suda

Yoshihiro Takahoko

Kazuki Ishizawa

Keisuke Igarashi

Hirofumi Satou

Tatsuya Hirato

Takahiro Usui

Maasa Yano

Keisuke Mikami

Toshiaki Nesaki

Daichi Nara

Sae-Bum Myung

Hiroyuki Komatsu

Akira Kisaku

Kiyoshi Ootsuka

Hirotsugu Kajiyama

A semiconductor analysis system includes a machining device that machines a semiconductor wafer to prepare a thin film sample for observation, a transmission electron microscope device that acquires a transmission electron microscope image of the thin film sample, and a host control device that controls the machining device and the transmission electron microscope device. The host control device evaluates the thin film sample based on the transmission electron microscope image, updates acquisition conditions of the transmission electron microscope image based on an evaluation result of the thin film sample, and outputs the updated acquisition conditions to the transmission electron microscope device

Semiconductor analysis system

A technique that enables automatic focus adjustment even for a sample having regions with different heights is proposed. A charged particle beam device according to the disclosure includes: a sample holder configured to hold a sample; a sample stage configured to move the sample; a charged particle gun and a charged particle beam column configured to irradiate the sample with a charged particle beam; an objective lens configured to perform focus adjustment by changing an intensity of a focusing effect on the charged particle beam; a detector configured to detect electrons from the sample and output a signal forming an electron image; an optical imaging device configured to capture an optical image of the sample; and a control device configured to calculate height information of the sample based on the optical image obtained by imaging the sample by the optical imaging device, and automatically set a focus adjustment value of an observation site based on the height information (see FIG.).

Charged particle beam apparatus and focus adjusting method therefor

A sample image display systemdisplays, on a screen, a plurality of imagesof a sample S and a symbolcorresponding to each of the images. The sample image display systemdisplays each symbolin a different mode according to information related to the corresponding image

Sample image display system and charged particle beam apparatus

A semiconductor analysis system includes a machining device that machines semiconductor wafer to prepare a thin film sample for observation, a transmission electron microscope device that acquires a transmission electron microscope image of the thin film sample, and a host control device that controls the machining device and the transmission electron microscope device. The host control device evaluates the thin film sample based on the transmission electron microscope image, updates machining conditions based on an evaluation result of the thin film sample, and outputs the updated machining conditions to the machining device.

There is provided a technique capable of shortening a photographing time and obtaining a more accurate photographed image when photographing a sample SAM using a charged particle beam device. The charged particle beam deviceincludes an electron gun, an objective lens, a stage, detectorsand, an integrated control unit C, a photographing function, and an autofocus function. Each of a plurality of photographing visual fields is focused in a focus value calculation visual fieldadjacent to a designated visual fielddesignated as a photographing target among the plurality of photographing visual fields, and a focus value calculated in the focus value calculation visual fieldis used for calculating focus values of each of the plurality of photographing visual fields.

Charged particle beam device

A charged particle beam apparatus includes a charged particle beam optical system that irradiates a sample on a sample stage with a charged particle beam; a detector that detects a signal generated from the sample; a charged particle beam imaging device that acquires an observation image from the signal; an optical imaging device that captures an optical image of the sample; a stage that rotatably holds the sample stage; a stage control device that controls movement and rotation of the stage; and an image composition unit that combines a plurality of optical images. The stage is moved so that the center of an imaging range of the optical imaging device is located at a position different from the rotation center of the stage, and then rotated. A plurality of optical images relating to different positions of the sample by rotation operation are acquired and combined to generate the composite image.

Charged particle beam apparatus

A charged particle beam deviceincludes an irradiation unitconfigured to irradiate a sample S with a charged particle beam, a detection unitconfigured to output a signal caused by irradiating the sample S with the charged particle beam, a display unitconfigured to output a condition selection interface for selecting one condition set from a plurality of condition sets, and a control unitconfigured to execute an evaluation on an object of interest. The condition set includes information for specifying one learned model from a plurality of learned models, information for specifying one search condition from a plurality of search conditions including at least one of an irradiation condition and a detection condition, and information for specifying one analysis condition from a plurality of analysis conditions defining an operation of at least one of the irradiation unitand the detection unit. The charged particle beam deviceis configured to accept a selection of the condition set via the condition selection interface, irradiate a first region of the sample S with the charged particle beam based on the specified search condition and detect a first signal caused by the irradiation, transfer information that is based on the first signal to the specified learned model, acquire information that represents a second region of the sample S including a position of a candidate of the object of interest from the specified learned model, the second region being a part of the first region and smaller than the first region, irradiate the second region with the charged particle beam based on the specified analysis condition and detect a second signal caused by the irradiation, and input information that is based on the second signal to the control unit

A charged particle beam deviceincludes: an irradiation unitconfigured to irradiate a sample S with a charged particle beam; a particle detection unitconfigured to detect a particle caused by the irradiation of the sample with the charged particle beam; and a control unitconfigured to generate an image of the sample based on an output from the particle detection unit, wherein the control unitinputs the image of the sample S into models Mand Mfor detecting a first structureand a second structure, acquires a first detection result related to the first structureand a second detection result related to the second structurefrom the models Mand M, determines locations or regions of the first structureand the second structurebased on the first detection result and the second detection result, and outputs an integration result imagerepresenting the location or the region of the first structureand the location or the region of the second structure

The charged particle beam apparatus includes a charged particle beam optical system that irradiates a sample mounted on a sample stage with a charged particle beam; a detector that detects a signal generated from the sample; a charged particle beam imaging device that acquires an observation image from the signal detected by the detector; an optical imaging device that captures an optical image of the sample; a stage that rotatably holds the sample stage; a stage control device that controls movement and rotation of the stage; and an image composition unit that combines the plurality of optical images to generate a composite image. The stage control device is configured to move the stage so that the center of an imaging range of the optical imaging device is located at a position different from the rotation center of the stage and then, to rotate the stage, the optical imaging device acquires a plurality of optical images relating to different positions of the sample by rotation operation, and the image composition unit combines the plurality of optical images obtained by the rotation operation to generate a composite image.

An object of the invention is to accurately correct a deviation in position or angle between observation regions in an imaging device that acquires images of a plurality of sample sections. The imaging device according to the invention identifies a correspondence relationship between the observation regions between the sample sections using a feature point on a first image, corrects a deviation between the sample sections using a second image in a narrower range than the first image, and after reflecting a correction result, acquires a third image having a higher resolution than the second image (see FIG.B).

Imaging device capturing images of a sample including a plurality of sections

Provided is a charged particle beam device using a detector that detects electromagnetic waves, in which a circumstance in a sample chamber can be checked, and a sample is observed with the detector at the same time. The charged particle beam device that observes a sample by using a charged particle beam, including: a component used for observing the sample; a detector that detects electromagnetic waves; a chamber scope that photographs a picture while irradiating the sample with the electromagnetic waves; and a control unit that controls the detector, the component, and an operation of the chamber scope, in which the control unit can be selectively operated in any one of a pre-photographing mode and an observation mode, the control unit causes the chamber scope to photograph the picture, in a state in which an operation of observing the sample by the detector is not performed in the pre-photographing mode, and the control unit, in the observation mode, does not cause the chamber scope to apply the electromagnetic waves, generates a guide image showing a positional relationship between the sample and the component based on the picture, and outputs the guide image.

An object of the invention is to easily acquire images of a position corresponding among a plurality of sample sections in an imaging device that acquires images of the plurality of sample sections. The imaging device according to the invention generates a cursor for specifying a first observation region and a contour portion of a first sample section, and superimposes the cursor on a contour portion of a second sample section so as to calculate coordinates of a second observation region of the second sample section.

Imaging device

An object of the invention is to easily acquire an image of a position corresponding between each section in an imaging device that acquires an image of a plurality of sample sections. The imaging device according to the invention calculates, according to a correspondence relationship between a characteristic point and a first observation region in a first sample section, coordinates of a second observation region of a second sample section, and generates an observation image at the calculated coordinates (see FIG.B).

A charged particle beam apparatus includes: an optical system that irradiates a sample mounted on a sample stage with a charged particle beam; at least one detector that detects a signal generated from the sample; an imaging device that acquires an observation image; a mechanism for changing observation positions in the sample which has at least one of a stage that moves the sample stage and a deflector that changes the charged particle beam's irradiation position; a display unit that displays an operation screen provided with an observation image displaying portion that displays the observation image and an observation position displaying portion that displays an observation position of the observation image; and a controller that controls display processing of the operation screen. The controller superimposes and displays on the observation position displaying portion a plurality of observation position images at different magnifications, based on the observation images' magnifications and coordinates.

Charged particle beam apparatus, observation method using charged particle beam apparatus, and program

An object of the invention relates to the fact that the alignment of the sample stage and the optical image can be adjusted with high accuracy, good operability, and high throughput by utilizing a low magnification optical image and a high magnification optical image. The invention relates to the fact that an alignment adjustment by a sample table alignment can be performed using a first processed optical image obtained by enlarging or reducing or changing a visual field of the optical image of the sample table holding the sample by digital processing, and that an alignment adjustment by an alignment point designation can be performed using a second processed optical image different from the first processed optical image. According to the invention, it is possible to adjust the alignment of the sample stage and the optical image with reference to the outer shape of the sample table and the feature points on the sample without taking out the sample table holding the sample from the sample chamber.

Growing community of inventors

Tokyo, Japan

Hiroyuki Chiba