Nitto-Denko Corporation

Hiroyuki Asao

Tomohiro Taruno

Shinichi Kanai

Yoshio Toyoda

Hirofumi Ohno

Shoichi Kimura

Syoichi Kimura

A resin tablet for sealing a semiconductor formed by solidifying a molten thermosetting resin composition by cooling, wherein the content of volatile matters in the tablet is 0.05% by weight or less, and the content of gelled particles in the tablet is 0 for the particles of 60 mesh on and is 10 ppm or less for the particles of 100 mesh on.

Resin tablet for sealing semiconductor

A resin tablet for sealing by transfer molding a semiconductor, which is obtained by cooling and solidifying a molten resin composition, is disclosed. The tablet has a compressibility of not less than 98% and a metallic impurity content of less than 50 ppm, preferably with the amount of fine powders of 250 mesh or smaller adhered thereto being controlled below 0.05% by weight based on the tablet and a water content being controlled below 0.1% by weight.

Process for producing semiconductor devices using resin tablets

Growing community of inventors

Osaka, Japan

Hiroyuki Asao