Az Electronic Materials (luxembourg) S.a.r.l.

Merck Patent Gmbh

Hiroyuki Aoki

Takashi Kanda

Takashi Fujiwara

Toshiya Okamura

Issei Sakurai

Bertram Bernd Barnickel

Jun Yamakawa

Bernd Bertram Barnickel

A copolymerized polysilazane comprising at least repeating units represented by general formula (I): &#x2014;Si(R)(R)&#x2014;NR&#x2014; and repeating units represented by general formula (II): &#x2014;Si(R)(R)&#x2014;NH&#x2014; (in the formulas, Rand Reach independently represent a hydrogen atom, hydrocarbon group, hydrocarbon group-containing silyl group, hydrocarbon group-containing amino group, or hydrocarbon oxy group, and Rrepresents an alkyl group, alkenyl group, alkoxy group, cycloalkyl group, aryl group or alkyl silyl group), and the NR/SiHratio (SiHrepresents the total amount of SiHand SiH) is 0.005-0.3. Said copolymerized polysilazane can be manufactured by reacting Si(R)(R)X(in the formula, X represents a halogen atom) with a primary amine compound: RNHand then reacting with ammonia, and is able to form a siliceous film that has withstand voltage characteristics and solvent resistance by curing at a low temperature.

Copolymerized polysilazane, manufacturing method therefor, composition comprising same, and method for forming siliceous film using same

[Problem] To provide a perhydropolysilazane making it possible to form a siliceous film with minimal defects, and a curing composition comprising the perhydropolysilazane. [Means for Solution] The present invention provides a perhydropolysilazane having a weight-average molecular weight of 5,000 to 17,000, characterized in that whenH-NMR of a 17% by weight solution of said perhydropolysilazane dissolved in xylol is measured, the ratio of the amount of SiHbased on the aromatic ring hydrogen content of the xylol is 0.235 or less and the ratio of the amount of NH based on the aromatic ring hydrogen content of the xylol is 0.055 or less, and a curing composition comprising the perhydropolysilazane. The present invention also provides a method for forming a siliceous film, comprising coating the curing composition on a substrate and heating.

Perhydropolysilazane, composition containing same, and method for forming silica film using same

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Kakegawa, Japan

Hiroyuki Aoki