Growing community of inventors

Fujisawa, Japan

Hiroyoshi Yokome

Average Co-Inventor Count = 7.16

ph-index = 3

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 44

Hiroyoshi YokomeTatsumi Tsuchiya (6 patents)Hiroyoshi YokomeTatsushi Yoshida (6 patents)Hiroyoshi YokomeYoshio Uematsu (4 patents)Hiroyoshi YokomeYukihiro Nakamura (4 patents)Hiroyoshi YokomeHiromi Ishikawa Ishikawa (4 patents)Hiroyoshi YokomeTadaaki Tomiyama (4 patents)Hiroyoshi YokomeTakao Kidachi (4 patents)Hiroyoshi YokomeHisashi Ohyama (4 patents)Hiroyoshi YokomeSurya Narayan Pattanaik (1 patent)Hiroyoshi YokomeTakuya Satoh (1 patent)Hiroyoshi YokomeYasuhiro Mita (1 patent)Hiroyoshi YokomeNaoki Fujii (1 patent)Hiroyoshi YokomeLan Shi (1 patent)Hiroyoshi YokomeHiroyoshi Yokome (6 patents)Tatsumi TsuchiyaTatsumi Tsuchiya (39 patents)Tatsushi YoshidaTatsushi Yoshida (30 patents)Yoshio UematsuYoshio Uematsu (27 patents)Yukihiro NakamuraYukihiro Nakamura (26 patents)Hiromi Ishikawa IshikawaHiromi Ishikawa Ishikawa (11 patents)Tadaaki TomiyamaTadaaki Tomiyama (7 patents)Takao KidachiTakao Kidachi (5 patents)Hisashi OhyamaHisashi Ohyama (4 patents)Surya Narayan PattanaikSurya Narayan Pattanaik (47 patents)Takuya SatohTakuya Satoh (17 patents)Yasuhiro MitaYasuhiro Mita (14 patents)Naoki FujiiNaoki Fujii (9 patents)Lan ShiLan Shi (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Hitachi Global Storage Technologies Netherlands B.v. (5 from 2,636 patents)

2. International Business Machines Corporation (1 from 164,108 patents)


6 patents:

1. 7380329 - Method of assembling a head gimbal assembly

2. 7210221 - Transfer system for assembling a head gimbal assembly

3. 7161766 - Base plate structure, transfer system, and method and apparatus for assembling a head gimbal assembly

4. 6823581 - Apparatus for assembling a head gimbal assembly

5. 6742694 - Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus

6. 6366431 - Head supporting arm having laser beam exposing aperture

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as of
12/3/2025
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