Murata Manufacturing Co., Ltd.

Hiroyoshi Takashima

Togo Matsui

Kenichi Okajima

Akira Hashimoto

Minoru Dooka

Yoshihiro Kanayama

Kazuhiro Tabata

Shingo Okuyama

Shinichi Kokawa

Takashige Tanabe

Norio Sakai

Takahiro Nishizawa

In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.

Manufacturing method for monolithic ceramic electronic component

In a manufacturing method for a monolithic ceramic electronic component, a ceramic paste is applied by using an application plate to a side surface of each of a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block. In the applying step, the ceramic paste is transferred to the side surface by moving the green chips and the application plate relative to each other in the direction in which the side surface extends while separating the green chips from the application plate, in a state where the ceramic paste is connected to both the green chips and the application plate.

In a print area provided on a peripheral surface of a gravure roll, a plurality of cells are defined by printing-direction walls and perpendicular walls, and each perpendicular wall has a plurality of cuts. In a center portion of the print area, most intersections of the printing-direction walls and the perpendicular walls are defined by T-shaped intersections where the perpendicular walls do not cross the printing-direction walls, but meet the printing-direction walls in a T-shaped arrangement. Preferably, round chamfers are provided at corners where a portion of each printing-direction wall and a portion of each perpendicular wall intersect, and at leading ends of the perpendicular walls pointing toward the cuts.

Photogravure press and method for manufacturing multilayer ceramic electronic component

A method for manufacturing a multilayer ceramic electronic element includes the steps of forming ceramic green sheets having superior surface smoothness and small variations in thickness at a high speed, in which defects such as pinholes are prevented from occurring, and providing internal electrodes and step-smoothing ceramic paste on the ceramic green sheets with high accuracy. The method includes the steps of applying ceramic slurry to a base film by a die coater followed by drying performed in a drying furnace for forming the ceramic green sheets, and performing gravure printing of conductive paste and ceramic paste onto the ceramic green sheets by using a first and a second gravure printing apparatus, respectively. Accordingly, the internal electrodes are formed, and the step-smoothing ceramic paste is provided in regions other than those in which the internal electrodes are formed.

Method for manufacturing multilayer ceramic electronic element

Photogravure pressure and method for manufacturing multilayer ceramic electronic component

A photogravure printing press includes plurality of cells defined by printing-direction walls and substantially perpendicular walls formed in each of image areas on the circumferential surface of a gravure roll. A plurality of substantially perpendicular cuts are formed in each of the substantially perpendicular walls. In the central portion of the image area, each of the substantially perpendicular cuts is formed so as to have a gap greater than the width of each of the printing-direction walls and the substantially perpendicular walls.

Photogravure press and method for manufacturing multilayer-ceramic electronic component

An electronic component holder has a recess portion opening outward in at least one of its edges and having dimensions corresponding to the dimensions of an electronic component chip to constitute an electronic component holding portion. At least one pair of inner side surfaces opposed to each other of the recess portion are each composed of an elastic material.

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Nagaokakyo, Japan

Hiroyoshi Takashima